The present invention discloses a bionic SERS substrate of a metal-based compound eye bowl structure, a construction method and application. The bionic SERS substrate of the metal-based compound eye bowl structure of the present invention consists of a metal bowl and a cone-shaped structure substrate in an ordered hierarchy manner. The metal bowl is of a continuously and closely arranged single-layer bowl structure. A height of the metal bowl is 0.01-10 μm, and a bowl opening diameter is 0.01-10 μm. A cone is a micron pyramid cone, and a height of the micron pyramid cone is 1-100 μm. The present invention assembles the metal bowl on a surface of the substrate of the micron pyramid cone structure with great fluctuation by a solid-liquid interface chemical reduction method and a small ball template method, and further constructs a 3D SERS substrate with a bionic compound eye structure.

An additive manufacturing process for forming a metallic layer on the surface of the substrate includes fabricating a substrate from a polymerizable composition by a stereolithographic process, and contacting the reactive surface with an aqueous solution including a metal precursor. The metal precursor includes a metal, and the polymerizable composition includes a multiplicity of multifunctional components. Each multifunctional component includes a reactive moiety extending from a surface of the substrate to form a reactive surface. An interface between the reactive surface and the aqueous solution is selectively irradiated to form nanoparticles including the metal in a desired pattern. The nanoparticles are chemically coupled to the reactive surface by reactive moieties, thereby forming a metallic layer on the surface of the substrate.

A copper-based ink contains copper acetate, 3-dimethylamino-1,2-propanediol and a silver salt. The ink may be coated on a substrate and decomposed on the substrate to form a conductive copper coating on the substrate. The ink provides micron-thick traces and may be screen printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Sintered copper traces produced from the ink have improved air stability, and have improved sheet resistivity for 5-20 mil wide screen-printed lines with excellent resolution.

Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.

The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.

An electroless process for depositing gold (Au.sup.0) from a solution, comprising allowing gold (Au.sup.0) place from a solution of gold thiocyanate complex dissolved in a mixture of water-miscible organic solvent and water, or the deposition of gold (Au.sup.0) takes place on a deposition-directing layer comprising positively charged organic groups, said layer being provided on at least a portion of a surface of a substrate sought to be gold-coated.

An electroless process for depositing gold (Au.sup.0) from a solution, comprising allowing gold (Au.sup.0) place from a solution of gold thiocyanate complex dissolved in a mixture of water-miscible organic solvent and water, or the deposition of gold (Au.sup.0) takes place on a deposition-directing layer comprising positively charged organic groups, said layer being provided on at least a portion of a surface of a substrate sought to be gold-coated.

A manufacturing method of a wire grid polarizer is provided, including: setting pattern data, where the pattern data correspond to a wire grid structure of the wire grid polarizer; preparing a metal ion solution; immersing at least one surface of a carrier substrate in the metal ion solution; and emitting, by an emitter device, an electron beam to the carrier substrate, and controlling a movement of the electron beam according to the pattern data to deposit a metal on the carrier substrate at a position where the electron beam passes, to form the wire grid structure.

A composition of matter includes a substrate material (M) having a bulk portion and an outer surface integrated to the bulk portion. The outer surface includes a modified surface layer. The modified surface layer extends to a depth from the outer surface of at least 1 nm. The modified surface layer includes M and at least one other material (X) which is a metal or metal alloy. The modified surface layer has a 25 C. electrical conductivity which is at least 2.5% above or below a 25 C. electrical conductivity in the bulk portion of M. The composition of matter can be an article that includes a frequency selective surface-based metamaterial, and the plurality of modified surface portions can be a plurality of periodic surface elements that provide a resonant frequency.