The present invention provides a novel method for producing a structure comprising an assembly of metal-based particles. Provided is a method for producing a layered product, the layered product comprising a substrate having a three-dimensional surface; and a metal-based particle assembly layer arranged on the three-dimensional surface and comprising a plurality of metal-based particles arranged apart from each other, the method comprising the step of forming the metal-based particle assembly layer on the three-dimensional surface by immersing the substrate in a plating solution containing a cation of a metal constituting the metal-based particles to reduce the cation, wherein a V.sub.S/V.sub.L ratio of volume V.sub.S [cm.sup.3] of the substrate to volume V.sub.L [cm.sup.3] of the plating solution is 0.03 or less.

The present invention provides a novel structure that can be used for a sensor element or the like and is useful as an enhancing element to enhance the emission of a luminescent substance. Provided is a composite particle comprising a core particle, and a metal-based particle assembly layer arranged on at least a portion of a surface of the core particle, wherein the metal-based particle assembly layer comprises a plurality of metal-based particles arranged apart from each other.

Described herein are methods of applying metals to substrates, where the methods include contacting the substrate with an aqueous metal plating composition comprising polyammonium bisulfate (PABS) and a dissolved metal or salt thereof. The methods allow application of metals to the substrate without need for electrical energy input or for an added chemical catalyst, chelating agent, complexing agent, reducing agent, stabilizer, or pH-modifying (or controlling) chemical compound.

A surface layer including a base material made of a conductor and dispersed particles dispersed in the base material is formed on a surface of a fixed contact, and the dispersed particles each include a base particle that is metal oxide and a coating layer formed on an outer surface of the base particle.

A surface layer including a base material made of a conductor and dispersed particles dispersed in the base material is formed on a surface of a fixed contact, and the dispersed particles each include a base particle that is metal oxide and a coating layer formed on an outer surface of the base particle.

A metal wiring layer can be formed within a recess of a substrate and an unnecessary plating layer is not left on a surface of the substrate. A metal wiring layer forming method includes forming a first plating layer 7 as a protection layer at least on a tungsten or tungsten alloy 4 formed on a bottom surface 3a of a recess 3 of a substrate 2; removing an unnecessary plating layer 7a formed on a surface 2a of the substrate 2; and forming a second plating layer 8 on the first plating layer 7 within the recess 3.

An integrated circuit (IC) package comprising a substrate having a dielectric, a first structure over at least a portion of the dielectric, the first structure comprising a molecular compound having a ligand coordinating moiety and a second structure over at least a portion of the first structure, the second structure comprising a metal, wherein the first structure is chemically bonded to the dielectric.

A method for producing a corrosion resistant metal substrate and corrosion resistant metal substrate provided thereby. The method involves forming a plated substrate including a metal substrate provided with a nickel layer or with a nickel and cobalt layer followed by electrodepositing a molybdenum oxide layer from an aqueous solution onto the plated substrate, which is subsequently subjected to an annealing step in a reducing atmosphere to reduce the molybdenum oxide in the molybdenum oxide layer to molybdenum metal in a reduction annealing step and to form a diffusion layer which contains nickel and molybdenum, and optionally cobalt.

A method for producing a corrosion resistant metal substrate and corrosion resistant metal substrate provided thereby. The method involves forming a plated substrate including a metal substrate provided with a nickel layer or with a nickel and cobalt layer followed by electrodepositing a molybdenum oxide layer from an aqueous solution onto the plated substrate, which is subsequently subjected to an annealing step in a reducing atmosphere to reduce the molybdenum oxide in the molybdenum oxide layer to molybdenum metal in a reduction annealing step and to form a diffusion layer which contains nickel and molybdenum, and optionally cobalt.

Method for metallising a porous structure made of carbon material, the method comprising the following steps: supplying a porous structure made of carbon material, immersing the porous structure in a solution comprising an ionic liquid, formed by a cation and an anion, and a metal precursor, placing the porous structure in a vacuum, immersed in the solution, in such a way as to cause the solution to penetrate into the porosity of the porous structure, adding a hydrogenated reducing agent, in such a way as to metallise the porous structure to within the porosity of the porous structure.