The present invention relates to a metal-polymer resin composite in which a polymer resin is directly injection-molded to a zinc alloy, a magnesium alloy, or a die-casting part thereof, and thus an injection product is directly bonded to a metal surface, wherein in the case of a hard polymer resin, a tensile strength of the metal and the polymer resin is 30 MPa or greater, and in the case of a soft polymer resin, a tensile strength of the metal and the polymer resin is 20 MPa or greater, and an average helium leakage after 10 times of measurement is 10.sup.8 Pa.Math.m.sup.3/s or less, and a novel method for preparing the same.

It is known that when etching gold films using etching solutions containing iodine and iodide, N-methyl-2-pyrrolidinone (NP) is added to improve the etching solution's wettability, microfabrication property, and solution life. However, in recent years, the use of NMP has been regulated due to its adverse effects on human health. The present invention provides an etching solution and etching method for gold film that improves wettability, microfabrication property, and solution life without containing NP. In order to address the problem of the prior art, the present invention provides etching solutions and etching methods for gold films that improve wettability, microfabrication property, and liquid life without NMP, characterized by the inclusion of a specific organic solvent in the etching solution containing iodine and iodide.

It is known that when etching gold films using etching solutions containing iodine and iodide, N-methyl-2-pyrrolidinone (NP) is added to improve the etching solution's wettability, microfabrication property, and solution life. However, in recent years, the use of NMP has been regulated due to its adverse effects on human health. The present invention provides an etching solution and etching method for gold film that improves wettability, microfabrication property, and solution life without containing NP. In order to address the problem of the prior art, the present invention provides etching solutions and etching methods for gold films that improve wettability, microfabrication property, and liquid life without NMP, characterized by the inclusion of a specific organic solvent in the etching solution containing iodine and iodide.

A ruthenium-etching solution for carrying out an etching process on ruthenium. The etching solution includes orthoperiodic acid and ammonia, in which a pH is 8 or higher and 10 or lower. A method for manufacturing the ruthenium-etching solution, a method for processing an object to be processed including carrying out an etching process on an object to be processed including ruthenium using the ruthenium-etching solution, and a method for manufacturing a ruthenium-containing wiring.

A ruthenium-etching solution for carrying out an etching process on ruthenium. The etching solution includes orthoperiodic acid and ammonia, in which a pH is 8 or higher and 10 or lower. A method for manufacturing the ruthenium-etching solution, a method for processing an object to be processed including carrying out an etching process on an object to be processed including ruthenium using the ruthenium-etching solution, and a method for manufacturing a ruthenium-containing wiring.

A touch screen sensor includes a visible light transparent substrate and an electrically conductive micropattern disposed on or in the visible light transparent substrate. The micropattern includes a first region micropattern within a touch sensing area and a second region micropattern. The first region micropattern has a first sheet resistance value in a first direction, is visible light transparent, and has at least 90% open area. The second region micropattern has a second sheet resistance value in the first direction. The first sheet resistance value is different from the second sheet resistance value.

A touch screen sensor includes a visible light transparent substrate and an electrically conductive micropattern disposed on or in the visible light transparent substrate. The micropattern includes a first region micropattern within a touch sensing area and a second region micropattern. The first region micropattern has a first sheet resistance value in a first direction, is visible light transparent, and has at least 90% open area. The second region micropattern has a second sheet resistance value in the first direction. The first sheet resistance value is different from the second sheet resistance value.

This invention provides a metal sheet preparing process with a surface having wood grain, and the process includes the following steps: spraying photosensitive ink on the metal sheet; pasting a designed film on a surface of the metal sheet sprayed with the photosensitive ink; exposing the metal sheet pasted with the film in an ultraviolet light for 1-15 min; spray developing the surface of the metal sheet with sodium carbonate solution, and exiting the film after developing; etching the metal sheet exited the film after developing with a mixed aqueous solution of ferric trichloride and copper sulfate, and a corrosive temperature being 30-50 C. which lasts for 5-8 min; and washing corrosive liquid on the grain and cured films of the photosensitive ink out of the grain with sodium hydroxide solution of 5-8% wt %.

This invention provides a metal sheet preparing process with a surface having wood grain, and the process includes the following steps: spraying photosensitive ink on the metal sheet; pasting a designed film on a surface of the metal sheet sprayed with the photosensitive ink; exposing the metal sheet pasted with the film in an ultraviolet light for 1-15 min; spray developing the surface of the metal sheet with sodium carbonate solution, and exiting the film after developing; etching the metal sheet exited the film after developing with a mixed aqueous solution of ferric trichloride and copper sulfate, and a corrosive temperature being 30-50 C. which lasts for 5-8 min; and washing corrosive liquid on the grain and cured films of the photosensitive ink out of the grain with sodium hydroxide solution of 5-8% wt %.

Localized excess protons are created with an open-circuit water electrolysis process using a pair of anode and cathode electrodes for a special excess proton production and proton-utilization system to treat a substrate material plate/film by forming and using an excess protons-substrate-hydroxyl anions capacitor-like system. The technology enables protonation and/or proton-driven oxidation of plate/film and/or membrane materials in a pure water environment. The present invention represents a remarkable clean green chemistry technology that does not require the use of any conventional acid chemicals including nitric and sulfuric acids for the said industrial applications. The application of localized excess protons provides a special energy recycling and renewing technology function to extract latent heat including molecular thermal motion energy at ambient temperature for generating local proton motive force (equivalent to Gibbs free energy) to do useful work such as driving ATP synthesis and proton-driven oxidation of certain substrate metal atoms.