After a sulfidation detection conductor (2) is formed on a front surface of a large-sized substrate (10A), a pair of first protective films (3) made of an insoluble material is formed, respectively, on predetermined positions of the sulfidation detection conductor (2), and a second protective film (7) made of a soluble material is formed so as to cover the sulfidation detection conductor (2) positioned between the pair of first protective films (3), and thereafter, end face electrodes (5) are formed, respectively, on divided faces of each strip-shaped substrate (10B) obtained by primarily dividing the large-sized substrate (10A). Then, after external electrodes (6) are formed by performing electrolytic plating with respect to each chip substrate (10C) obtained by secondarily dividing each strip-shaped substrate (10B), a sulfidation detection portion (2a) is exposed to the outside by removing the second protective film (7), whereby a sulfidation detection sensor (10) can be obtained.

A method for forming electroplated copper on a surface of non-metal materials by graphene-based plating ink is revealed. A graphene-based plating ink is prepared by modified functionalized graphene and then sprayed on a surface of a non-metal material. Next dry the graphene-based plating ink sprayed on the non-metal material. A layer of electroplated copper is formed on a surface of the graphene-based plating ink by plating. The method uses graphene-based plating ink as a conductor of the electroplated copper and increases adhesion between functionalized graphene contained in the graphene-based plating ink and the non-metal material by modification. During plating, no heavy metal is used as catalyst so that the method is environmentally friendly and cost-saving. The graphene-based plating ink with excellent adhesion and higher flexibility can be attached to the surface of the non-metal material firmly and used as an adhesive between electroplated copper and the non-metal material.

Disclosed herein are articles having an edge that is partially, or entirely sealed with one or more coatings including a polymeric material. The article may include a coating selected so that one surface (e.g., a face surface) has a desired property (e.g., an appearance, such as a chrome appearance), and a second surface (e.g., a different face surface, or an edge surface) is covered with a different material, where the different coatings provide protection to at least the edge surface. Also disclosed are coating materials including a tracer component. Also disclosed are methods for coating a substrate. Also disclosed are methods for confirming the presence of a coating, particularly on an edge surface.

Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine airfoil component.

A semiconductor device manufacturing jig for electroplating a substrate includes a conductive member. The substrate includes an inner part including a first surface, and an outer rim part surrounding the inner part. The outer rim part has a ring shape that protrudes further than the first surface in a direction perpendicular to the first surface. The conductive member causes a current to flow in the inner part by contacting a portion of the first surface of the inner part without contacting the outer rim part.

A continuous separation installation for the galvanic deposition of a substance on objects includes contacting devices having at least one electrically conductive contact arm. The contacting devices are arranged in areas of the continuous separation installation which are free from an electrolyte used for the galvanic deposition of the substance. There is also described an assembly for a continuous separation installation.

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, fluid enters the cross flow manifold through channels in the channeled plate, and through a cross flow inlet, then exits at the cross flow exit, positioned opposite the cross flow inlet. The apparatus may switch between a sealed state and an unsealed state during electroplating, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal.

Fabrication of a double-sided photovoltaic cell, with two opposite active surfaces, comprising a step of depositing, on each active surface, at least one electric contact. The deposition step comprises in particular a shared operation of depositing on each of the active surfaces, implemented by electrolysis in a shared electrolysis tank comprising: a first compartment for depositing a metal layer on a first active surface of the cell, for fabrication of a contact comprising said metal layer on the first active surface; and a second compartment for depositing, by oxidation, a metal oxide conductor layer on the second active surface of the cell, for the fabrication of a contact comprising said metal oxide layer on the second active surface.

Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine airfoil component.

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, fluid enters the cross flow manifold through channels in the channeled plate, and through a cross flow inlet, then exits at the cross flow exit, positioned opposite the cross flow inlet. The apparatus may switch between a sealed state and an unsealed state during electroplating, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal.