An advanced electrodeposited copper foil having island-shaped microstructures and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil includes a micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups which are in a non-uniform distribution and form into island-shaped patterns.

Provided are a semiconductor material based on metal nanowires and a porous nitride, and a preparation method thereof. The semiconductor material includes: a substrate; a buffer layer formed on the substrate; and a composite material layer formed on the buffer layer the composite material layer includes: a transverse porous nitride template layer; and a plurality of metal nanowires filled in pores of the transverse porous nitride template layer.

An object including a chromium-based coating on a substrate and a method for its production are disclosed. The chromium-based coating having a first layer on the substrate, wherein the first layer has a top surface on the opposite side to the substrate and includes fissures within the first layer, and wherein the material of the first layer is predominantly formed of chromium and chromium carbide; the chromium-based coating further having a second layer on the first layer, the second layer at least partially filling the fissures in the first layer and at least partially covers the top surface of the first layer, wherein the material of the second layer is selected from a group consisting of: chromium oxide, carbon, and a combination of chromium oxide and carbon.

Methods for electrodeposition using aqueous electrolytes where water molecules are depleted are described herein. Methods of electrodepositing superconducting thin films from aqueous electrolytes where water molecules are depleted are also described herein.

The present invention relates to a method for increasing the corrosion resistance of a chrome-plated substrate wherein at least one part of a chrome-plated surface of a chrome-plated substrate is dipped into an electrolyte comprising trivalent chromium ions, at least one conducting salt and at least one reducing agent, and afterwards, a trivalent chromium oxide film is formed on the at least one part of the chrome-plated surface by applying a pulse reverse current between the chrome-plated surface and a counter electrode electrically connected with the chrome-plated surface through the electrolyte. Furthermore, the present invention relates to a chrome-plated substrate obtainable by this method.

Methods and compositions for electrodepositing mixed metal reactive metal layers by combining reactive metal complexes with electron withdrawing agents are provided. Modifying the ratio of one reactive metal complex to the other and varying the current density can be used to vary the morphology the metal layer on the substrate.

An electroplated article includes a base member that includes one or more base member-metallic elements; and an electroplated layer that is formed directly on the base member. The electroplated layer includes at least a first electroplated layer-metallic element and a second electroplated layer-metallic element that is different from the first electroplated layer-metallic element. The second electroplated layer-metallic element is a metallic element that is identical to at least one of the one or more base member-metallic elements. A ratio of the second electroplated layer-metallic element in the electroplated layer is continuously decreased as being away from the base member in the thickness direction of the electroplated layer. Alloy grains including at least the first and second electroplated layer-metallic elements are distributed in the electroplated layer such that a clear interface is not formed between the base member and the electroplated layer.

A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

An electrode of a chemical cell includes a substrate having a surface, an array of conductive projections supported by the substrate and extending outward from the surface of the substrate, each conductive projection of the array of conductive projections having a semiconductor composition for reduction of carbon dioxide (CO.sub.2) in the chemical cell, and a catalyst arrangement disposed along each conductive projection of the array of conductive projections, the catalyst arrangement including a copper-based catalyst and an iron-based catalyst for the reduction of carbon dioxide (CO.sub.2) in the chemical cell.

The present invention relates to a method for increasing the corrosion resistance of a chrome-plated substrate wherein at least one part of a chrome-plated surface of a chrome-plated substrate is dipped into an electrolyte comprising trivalent chromium ions, at least one conducting salt and at least one reducing agent, and afterwards, a trivalent chromium oxide film is formed on the at least one part of the chrome-plated surface by applying a pulse reverse current between the chrome-plated surface and a counter electrode electrically connected with the chrome-plated surface through the electrolyte. Furthermore, the present invention relates to a chrome-plated substrate obtainable by this method.