A metal material comprising: a base material; an oxide layer disposed on a surface of the base material; and a metal layer disposed on a surface of the oxide layer, wherein the base material includes aluminum, the oxide layer includes aluminum, nickel, and oxygen, the metal layer includes nickel, and an average thickness of the oxide layer is no less than 50 nm and no more than 250 nm.

Methods of treating metal nanocrystals are provided. In embodiments, such a method comprises exposing metal nanocrystals comprising a metal and characterized by at least one twinning boundary therein, to a plating solution comprising a reducing agent and coating metal cations comprising a different metal, under conditions to form a coating of the different metal on surfaces of the metal nanocrystals via electroless deposition by chemical reduction of the coating metal cations, thereby providing coated metal nanocrystals. Methods of forming bulk nanostructured metal alloys from the coated metal nanocrystals are also provided.

An apparatus and method of fabricating magnetic structures utilizing nanocomposites to build bulk magnetic materials, with controlled magnetic alignments are provided. The method includes application of an editing tool, such as a laser, for patterning an editable structure that mounted on an electrically conductive substrate and filling the pattern with solid materials to create the magnetic structures.

A plating apparatus (10) is disclosed including a plating tank (9), cathodes (1a to 1f), a holding mechanism (2), at least one anode (3), and a rotation mechanism (4). The plating tank (9) contains an annularly or helically wound substrate (90) together with a plating solution. The cathodes (1a to 1f) are placed inside the plating tank (9). The holding mechanism (2) holds the cathodes (1a to 1f) at positions electrically connected to the outer periphery of the substrate (90) and holds the substrate (90) via the cathodes (1a to 1f). The anode (3) is placed at least on the inner periphery side of the substrate (90) held by the holding mechanism (2). The rotation mechanism (4) rotates at least either the substrate (90) and cathodes (1a to 1f) held by the holding mechanism (2) or the anode (3), or both, around the axis of the wound substrate (90).

An electrode wire includes a brass core, a Cu—Zn alloy layer coated on the brass core, and a surface layer. The surface layer includes CuO, ZnO, Cu.sub.2(OH).sub.2CO.sub.3, and a Cu—Zn intermetallic compound. The surface layer is in the shape of particles or sheets spaced apart on the Cu—Zn alloy layer; and the Cu—Zn alloy layer is exposed with respect to spaces between the particles or sheets.

Disclosed is a technical idea of forming ruthenium and ruthenium-cobalt alloy nanowires having various diameters using electroplating. More particularly, a technology of forming ruthenium and ruthenium-cobalt alloy nanowires on a porous template, on pores of which nanotubes are deposited using atomic layer deposition (ALD), using electroplating, and annealing the ruthenium and ruthenium-cobalt alloy nanowires to form ruthenium-cobalt alloy nanowires having various diameters.

The present invention relates to a wire electrode for spark-erosion cutting having a core (2), which contains a metal or a metal alloy, and a covering layer (3), surrounding the core (2), which comprises regions the morphology of which corresponds to block-like particles, which are spatially separated, at least over a portion of their circumference, from each other and/or the core material by cracks, characterized in that, viewed in a wire cross section perpendicular or parallel to the wire longitudinal axis, the portion amounting to more than 50% of the surface area of a region with the morphology of a block-like particle contains a copper-zinc alloy with a zinc concentration of 58.5-67 wt.-%, wherein, in a view perpendicular to the wire surface, the proportion of the surface formed by the block-like particles is more than 20% and less than 50% of the entire surface of the wire electrode and the block-like particles the surface area of which in each case lies in the range of 25-250 μm.sup.2 in total make up a proportion of more than 50% of the surface area of all block-like particles.

There is provided a bonding wire for semiconductor devices that exhibits a favorable bondability even when being applied to wedge bonding at the room temperature, and also achieves an excellent bond reliability. The bonding wire includes a core material of Cu or Cu alloy (hereinafter referred to as a “Cu core material”), and a coating containing a noble metal formed on a surface of the Cu core material. A concentration of Cu at a surface of the wire is 30 to 80 at%.

A canted coil spring includes a core wire 10 formed of steel having a pearlite structure; and a copper plating layer 20 formed of copper or a copper alloy and covering an outer circumferential surface 11 of the core wire 10. The steel contains 0.5 mass % or more and 1.0 mass % or less carbon, 0.1 mass % or more and 2.5 mass % or less silicon, and 0.3 mass % or more and 0.9 mass % or less manganese, with the balance being iron and inevitable impurities. The copper plating layer 20 has a crystallite size of 220±50 Å.

Method and apparatus for producing metal-coated optical fiber involves feeding a length of glass fiber through a first solution bath so as to plate a first predetermined metal on the glass fiber via electroless deposition. The length of glass fiber is passed continuously from the first solution bath to a second solution bath adapted to plate thereon a second predetermined metal via electrolytic plating such that the optical fiber contacts an electrode only after at least some of the second predetermined metal has been applied. The length of glass fiber may be passed continuously from the second solution bath to a third solution bath adapted to plate thereon a third predetermined metal via electrolytic plating.