The metallization of a metallic rack employed in galvanic metallization processes of plastic material items, coated by immersion in PVC Plastisol, is inhibited thanks to the fact that PVC Plastisol is mixed with a C8-C18 thiol selected from octyl mercaptan, nonyl mercaptan, decyl mercaptan, n-octadecyl-3-mercaptopropionate, isooctyl-3-mercaptopropionate, n-octyl-mercaptopropionate, dodecyl-3-mercaptopropionate, tridecyl-3-mercaptopropionate, palmityl mercaptan, bis-phenyl-1,4-thiol.

The metallization of a metallic rack employed in galvanic metallization processes of plastic material items, coated by immersion in PVC Plastisol, is inhibited thanks to the fact that PVC Plastisol is mixed with a C8-C18 thiol selected from octyl mercaptan, nonyl mercaptan, decyl mercaptan, n-octadecyl-3-mercaptopropionate, isooctyl-3-mercaptopropionate, n-octyl-mercaptopropionate, dodecyl-3-mercaptopropionate, tridecyl-3-mercaptopropionate, palmityl mercaptan, bis-phenyl-1,4-thiol.

A protective layer is formed over a copper seed layer on a semiconductor substrate prior to electroplating. The protective layer is capable of protecting the copper seed layer from oxidation and from dissolution in an electrolyte during initial phases of electroplating. The protective layer, in some embodiments, prevents the copper seed layer from contacting atmosphere, and from being oxidized by atmospheric oxygen and/or moisture. The protective layer contains a metal that is less noble than copper (e.g., cobalt), where the metal can be in an oxidized form that is readily soluble in a plating liquid. In one embodiment a protective cobalt layer is formed by depositing cobalt metal by chemical vapor deposition over copper seed layer without exposing the copper seed layer to atmosphere, followed by subsequent oxidation of cobalt to cobalt oxide that occurs after the substrate is exposed to atmosphere. The resulting protective layer is dissolved during electroplating.

A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

A pretreatment method for pretreating components, which are each formed of at least two different materials, prior to a coating process. The pretreatment method includes the steps: alkaline degreasing; chemical pickling in a first pickling medium; anodic pickling in a second pickling medium; and cathodic degreasing.

A pretreatment method for pretreating components, which are each formed of at least two different materials, prior to a coating process. The pretreatment method includes the steps: alkaline degreasing; chemical pickling in a first pickling medium; anodic pickling in a second pickling medium; and cathodic degreasing.

The present disclosure provides a carrier liquid leakage preventing device and an electrochemical deposition apparatus. The carrier liquid leakage preventing device is used for containing liquid medicine dripping from a carrier; the carrier liquid leakage preventing device comprises: a guide rail disposed along a first direction, the first direction is a vertical direction perpendicular to the horizontal plane or a direction at an angle to the horizontal plane; a leakage preventing groove provided on the guide rail and capable of performing a lifting movement along the guide rail so as to move above or below the carrier; and a driver for driving the lifting movement of the leakage preventing groove.

The present disclosure provides a carrier liquid leakage preventing device and an electrochemical deposition apparatus. The carrier liquid leakage preventing device is used for containing liquid medicine dripping from a carrier; the carrier liquid leakage preventing device comprises: a guide rail disposed along a first direction, the first direction is a vertical direction perpendicular to the horizontal plane or a direction at an angle to the horizontal plane; a leakage preventing groove provided on the guide rail and capable of performing a lifting movement along the guide rail so as to move above or below the carrier; and a driver for driving the lifting movement of the leakage preventing groove.

A method of making Flat No-Lead Packages with plated lead surfaces exposed on lateral faces thereof. The method includes providing a plurality of Flat No-Lead Packages having severed, unplated lead surfaces exposed on lateral faces thereof and having plated lead surfaces exposed on bottom faces thereof. The method further includes batch electroplating the severed unplated lead surfaces of the plurality of Flat No-Lead Packages.