C03B33/033

Glass plate bend-breaking machine
11591251 · 2023-02-28 · ·

A glass plate bend-breaking machine for a glass plate includes a supporting mechanism by which a glass plate with a predetermined bend-breaking line as a cut line formed on an upper surface, i.e., one surface, thereof is supported at a lower surface, i.e., another surface, of the glass plate; and press-breaking devices and for press-breaking the glass plate along the predetermined bend-breaking line. Each of the press-breaking devices has a pressing body for simultaneously pressing a plurality of parts and along the predetermined bend-breaking line on the upper surface of the glass plate at the time of press-breaking the glass plate along the predetermined bend-breaking line at each of press-breaking positions on the glass plate.

Device for press-cutting glass, method for press-cutting glass, and glass-cutting system

A device for press-cutting glass, a method for press-cutting glass, and a glass-cutting system having the device for press-cutting glass. The device for press-cutting glass comprises a supporting member, having a first supporting portion and a second supporting portion for supporting a glass substrate, which are arranged in a spaced apart manner in a first direction; and a press-cutting member for press-cutting an edge of the glass substrate, which is positioned between the first supporting portion and the second supporting portion in the first direction. The device for press-cutting glass has advantages including high press-cutting efficiency, simple structure, low manufacturing cost, and easy assembling with other devices.

SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING
20230102291 · 2023-03-30 ·

Systems and methods are described for controlled crack propagation in a material using ultrasonic waves. A first stress in applied to the material such that the first stress is below a critical point of the material and is insufficient to initiate cracking of the material. A controlled ultrasound wave is then applied to the material causing the total stress applied at a crack tip in the material to exceed the critical point. In some implementations, the controlled cracking is used for wafering of a material.

SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING
20230102291 · 2023-03-30 ·

Systems and methods are described for controlled crack propagation in a material using ultrasonic waves. A first stress in applied to the material such that the first stress is below a critical point of the material and is insufficient to initiate cracking of the material. A controlled ultrasound wave is then applied to the material causing the total stress applied at a crack tip in the material to exceed the critical point. In some implementations, the controlled cracking is used for wafering of a material.

METHOD FOR MANUFACTURING GLASS PLATE AND APPARATUS FOR MANUFACTURING SAME
20230084567 · 2023-03-16 ·

After a glass sheet (G) having a scribe line (S) formed thereon is placed on a placement table (10) and positioned so that the scribe line (S) is positioned in a bending stress applying portion (15) of the placement table (10), when the glass sheet (G) is split along the scribe line (S) by applying a bending stress to a formation region of the scribe line (S) by the bending stress applying portion (15), the glass sheet (G) is positioned by laying a resin sheet (9) under the glass sheet (G) on the placement table (10) and aligning one side (G1) of the glass sheet (G) extending in a direction along the scribe line (S) with marks (Ma to Nd) projected onto a protruding portion (9a) of the resin sheet (9) by laser markers (16a to 16d).

METHOD FOR MANUFACTURING GLASS PLATE AND APPARATUS FOR MANUFACTURING SAME
20230084567 · 2023-03-16 ·

After a glass sheet (G) having a scribe line (S) formed thereon is placed on a placement table (10) and positioned so that the scribe line (S) is positioned in a bending stress applying portion (15) of the placement table (10), when the glass sheet (G) is split along the scribe line (S) by applying a bending stress to a formation region of the scribe line (S) by the bending stress applying portion (15), the glass sheet (G) is positioned by laying a resin sheet (9) under the glass sheet (G) on the placement table (10) and aligning one side (G1) of the glass sheet (G) extending in a direction along the scribe line (S) with marks (Ma to Nd) projected onto a protruding portion (9a) of the resin sheet (9) by laser markers (16a to 16d).

Method for manufacturing glass roll

Provided is a method of producing a glass roll including: a conveying step of conveying a glass film (G) along a longitudinal direction thereof; a cutting step of irradiating the glass film (G) with a laser beam (L) from a laser irradiation apparatus (19) while conveying the glass film (G) by the conveying step, to thereby separate the glass film (G) into a non-product portion (Gc) and a product portion (Gd); and a take-up step of taking up the product portion (Gd) into a roll shape, to thereby form a glass roll (R). The cutting step includes a step of winding a thread-like peeled material (Ge) generated from an end portion of the product portion (Gd) in a width direction around a rod-shaped collecting member (23), and leading the wound thread-like peeled material (Ge) in a predetermined conveying direction (PX) by a leading device (24).

Method for manufacturing glass plate and manufacturing apparatus therefor

Provided is a method of manufacturing a glass sheet, which comprises a conveying step of conveying a glass sheet (G3) by holding an upper part of the glass sheet (G3) in a vertical posture. The conveying step comprises a first conveying step of conveying the glass sheet (G3) in a first direction along a direction perpendicular to a main surface of the glass sheet (G3), and a second conveying step of conveying the glass sheet (G3) in a second direction along a direction parallel to the main surface after the first conveying step. When a conveying direction of the glass sheet is changed from the first direction to the second direction, a lower part of the main surface (G3y) is supported by a roller (41) of a support portion (4) from a forward side in the conveying direction of the glass sheet (G3) conveyed in the first direction.

METHOD AND APPARATUS FOR TRIMMING EDGES OF GLASS SUBSTRATES DURING INLINE PROCESSING

A method of separating an edge portion from a glass substrate includes applying a scoring tool of a scoring apparatus to a glass substrate to cause the scoring tool to score the glass substrate along a score line as the glass substrate moves relative to the scoring apparatus and applying a breaker bar of a breaker apparatus to the glass substrate as the glass substrate moves relative to the breaker bar to separate an edge portion from the glass substrate along the score line.

METHOD AND APPARATUS FOR TRIMMING EDGES OF GLASS SUBSTRATES DURING INLINE PROCESSING

A method of separating an edge portion from a glass substrate includes applying a scoring tool of a scoring apparatus to a glass substrate to cause the scoring tool to score the glass substrate along a score line as the glass substrate moves relative to the scoring apparatus and applying a breaker bar of a breaker apparatus to the glass substrate as the glass substrate moves relative to the breaker bar to separate an edge portion from the glass substrate along the score line.