There is provided a copolymer having the general structure below, wherein a, b, and d are molar ratios varying between about 0.01 and about 0.90 and c is a molar ratio varying between about 0.01 and about 0.90; A1 represents monomer units comprising a cyano-containing pendant group in which the cyano is not directly attached to the backbone of the copolymer; A2 represents monomer units comprising two or more hydrogen bonding sites; A3 represents monomer units that increase solubility in organic solvents; and A4 represents monomer units that increase solubility in aqueous alkaline solutions. There is also provided a near-infrared radiation-sensitive coating composition comprising this copolymer as well as a positive-working thermal lithographic printing plate comprising a near-infrared radiation-sensitive coating comprising this copolymer, a method of producing such a printing plate, and finally a method of printing using such a printing plate. Formula (I).

There is provided a copolymer having the general structure below, wherein a, b, and d are molar ratios varying between about 0.01 and about 0.90 and c is a molar ratio varying between about 0.01 and about 0.90; A1 represents monomer units comprising a cyano-containing pendant group in which the cyano is not directly attached to the backbone of the copolymer; A2 represents monomer units comprising two or more hydrogen bonding sites; A3 represents monomer units that increase solubility in organic solvents; and A4 represents monomer units that increase solubility in aqueous alkaline solutions. There is also provided a near-infrared radiation-sensitive coating composition comprising this copolymer as well as a positive-working thermal lithographic printing plate comprising a near-infrared radiation-sensitive coating comprising this copolymer, a method of producing such a printing plate, and finally a method of printing using such a printing plate. Formula (I).

An object of the present invention is to provide a pattern forming method which is excellent in developability and defect suppression performance. Another object of the present invention is to provide a method for producing an electronic device including the pattern forming method. Still another object of the present invention is to provide a kit capable of forming a pattern which is excellent in developability and defect suppression performance. The pattern forming method of the present invention is a pattern forming method including a resist film forming step of forming a resist film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition; an exposing step of exposing the resist film; and a developing step of developing the exposed resist film using a developer, in which the actinic ray-sensitive or radiation-sensitive resin composition contains an acid-decomposable resin represented by a specific structure; and as the developer, a chemical liquid containing an organic solvent, alcohol impurities, and metal impurities containing at least metal atoms is used, the total content of the alcohol impurities being 0.01 mass ppb to 1000 mass ppm with respect to the total mass of the chemical liquid.

An object of the present invention is to provide a pattern forming method which is excellent in developability and defect suppression performance. Another object of the present invention is to provide a method for producing an electronic device including the pattern forming method. Still another object of the present invention is to provide a kit capable of forming a pattern which is excellent in developability and defect suppression performance. The pattern forming method of the present invention is a pattern forming method including a resist film forming step of forming a resist film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition; an exposing step of exposing the resist film; and a developing step of developing the exposed resist film using a developer, in which the actinic ray-sensitive or radiation-sensitive resin composition contains an acid-decomposable resin represented by a specific structure; and as the developer, a chemical liquid containing an organic solvent, alcohol impurities, and metal impurities containing at least metal atoms is used, the total content of the alcohol impurities being 0.01 mass ppb to 1000 mass ppm with respect to the total mass of the chemical liquid.

Build materials for 3D printing applications are described herein which, in some embodiments, comprise a dye component operable to alter spectral characteristics of the printed part over the course of the build cycle. In some embodiments, for example, the dye component can provide desirable light penetration depth during article printing and sufficient optical clarity during final light curing processes.

Build materials for 3D printing applications are described herein which, in some embodiments, comprise a dye component operable to alter spectral characteristics of the printed part over the course of the build cycle. In some embodiments, for example, the dye component can provide desirable light penetration depth during article printing and sufficient optical clarity during final light curing processes.

A porous resin used to solid phase synthesis and a preparation method therefor, specifically being a porous resin having functional groups being an amino group or a hydroxyl group and a preparation method therefor. Using an olefin compound containing two cyano groups as a modified monomer, using a high internal phase emulsion as a pore-foaming agent, and performing suspension polymerization to prepare the porous resin. And then functionalizing the porous resin to obtain the porous resin having functional groups being an amino group or a hydroxyl group. Different from the existing preparation method, the modified monomer can make the distribution of the functional groups more uniform, and make the swelling degrees of the porous resin in different solvents close. The high internal phase emulsion pore-foaming agent can make the pore size distribution of the carrier narrower. The porous resin can be used as a solid phase synthesis carrier to prepare an oligonucleotide, and the use of the carrier is beneficial for improving the yield and purity of the oligonucleotide.

A porous resin used to solid phase synthesis and a preparation method therefor, specifically being a porous resin having functional groups being an amino group or a hydroxyl group and a preparation method therefor. Using an olefin compound containing two cyano groups as a modified monomer, using a high internal phase emulsion as a pore-foaming agent, and performing suspension polymerization to prepare the porous resin. And then functionalizing the porous resin to obtain the porous resin having functional groups being an amino group or a hydroxyl group. Different from the existing preparation method, the modified monomer can make the distribution of the functional groups more uniform, and make the swelling degrees of the porous resin in different solvents close. The high internal phase emulsion pore-foaming agent can make the pore size distribution of the carrier narrower. The porous resin can be used as a solid phase synthesis carrier to prepare an oligonucleotide, and the use of the carrier is beneficial for improving the yield and purity of the oligonucleotide.

Build materials for 3D printing applications are described herein which, in some embodiments, comprise a dye component operable to alter spectral characteristics of the printed part over the course of the build cycle. In some embodiments, for example, the dye component can provide desirable light penetration depth during article printing and sufficient optical clarity during final light curing processes.

Build materials for 3D printing applications are described herein which, in some embodiments, comprise a dye component operable to alter spectral characteristics of the printed part over the course of the build cycle. In some embodiments, for example, the dye component can provide desirable light penetration depth during article printing and sufficient optical clarity during final light curing processes.