Patent classifications
C08F222/103
MICROWELL FILM FOR BIOASSAY, PHOTOSENSITIVE RESIN COMPOSITION FOR FORMATION OF THE MICROWELL FILM FOR BIOASSAY, AND METHOD OF MANUFACTURING THE MICROWELL FILM FOR BIOASSAY
To provide microwell films for bioassay suitable for a “unimolecular enzyme assay” method and methods of manufacturing the films, a microwell film for bioassay is comprised of at least a substrate (11), and a resin layer (12) having microwells on its surface provided on one main surface of the substrate (11), where in the substrate (11) and the resin forming the resin layer (12), an absorption coefficient at each of wavelengths of 350 nm to 800 nm is 0.01 μm.sup.−1 or less.
LOW VISCOSITY DUAL CURE ADDITIVE MANUFACTURING RESINS
Provided herein according to some embodiments is a dual cure additive manufacturing resin, comprising: (i) a light polymerizable component, (ii) a photoinitiator, (iii) a heat polymerizable component, and (iv) a non-reactive diluent, which resin is useful for the production of three-dimensional objects by additive manufacturing. Methods of using the same are also provided.
LOW VISCOSITY DUAL CURE ADDITIVE MANUFACTURING RESINS
Provided herein according to some embodiments is a dual cure additive manufacturing resin, comprising: (i) a light polymerizable component, (ii) a photoinitiator, (iii) a heat polymerizable component, and (iv) a non-reactive diluent, which resin is useful for the production of three-dimensional objects by additive manufacturing. Methods of using the same are also provided.
PHOTOSENSITIVE COMPOSITION
The photosensitive composition according to the present invention is a photosensitive composition including a semiconductor particle (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), in which the photosensitive composition satisfies any one or more of the following (a) to (c): (a) the photosensitive composition further includes a stabilizer (E), and a content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition; (b) the photopolymerizable compound (C) includes a (meth)acrylate compound (C1) having a molecular weight of 180 or less; and (c) the photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.
PHOTOSENSITIVE COMPOSITION
The photosensitive composition according to the present invention is a photosensitive composition including a semiconductor particle (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), in which the photosensitive composition satisfies any one or more of the following (a) to (c): (a) the photosensitive composition further includes a stabilizer (E), and a content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition; (b) the photopolymerizable compound (C) includes a (meth)acrylate compound (C1) having a molecular weight of 180 or less; and (c) the photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.
Radiation curable inkjet ink compositions, printed articles, and thermal inkjet methods of using the same
A radiation curable inkjet ink composition that includes (A) a mono-ethylenically unsaturated oligomer, (B) a mono-ethylenically unsaturated monomer, and (C) a solvent, wherein the radiation curable inkjet ink composition is substantially free of a photoinitiator and wherein a total weight of the mono-ethylenically unsaturated oligomer (A) is less than or equal to the total weight of the mono-ethylenically unsaturated monomer (B). A printed article including the radiation curable inkjet ink composition in cured form, and a method of forming an image with a thermal inkjet printhead are also provided.
Radiation curable inkjet ink compositions, printed articles, and thermal inkjet methods of using the same
A radiation curable inkjet ink composition that includes (A) a mono-ethylenically unsaturated oligomer, (B) a mono-ethylenically unsaturated monomer, and (C) a solvent, wherein the radiation curable inkjet ink composition is substantially free of a photoinitiator and wherein a total weight of the mono-ethylenically unsaturated oligomer (A) is less than or equal to the total weight of the mono-ethylenically unsaturated monomer (B). A printed article including the radiation curable inkjet ink composition in cured form, and a method of forming an image with a thermal inkjet printhead are also provided.
PU COMPOSITE RESINS
Disclosed herein is a fiber composite material including: (a) a polyurethane obtained reaction of at least the components: (i) a polyisocyanate composition; and (ii) a polyol composition including at least 15% by weight of an at least trifunctional alcohol (ii.1), which exhibits at least two primary hydroxyl groups (ii.1); and (b) fibers which are at least partially embedded in the compact polyurethane.
Further disclosed herein are a process for producing a fiber composite material, a fiber composite material obtained by this process, and a method of using the fiber composite material for producing a pipe, in particular a conical pipe, a pipe connector, a pressure vessel, a storage tank, an insulator, a mast, a bar, a roller, a torsion shaft, a profile, a piece of sports equipment, a molded part, a cover, an automotive exterior part, a rope, a cable, an isogrid structure or a semi-finished textile product.
PU COMPOSITE RESINS
Disclosed herein is a fiber composite material including: (a) a polyurethane obtained reaction of at least the components: (i) a polyisocyanate composition; and (ii) a polyol composition including at least 15% by weight of an at least trifunctional alcohol (ii.1), which exhibits at least two primary hydroxyl groups (ii.1); and (b) fibers which are at least partially embedded in the compact polyurethane.
Further disclosed herein are a process for producing a fiber composite material, a fiber composite material obtained by this process, and a method of using the fiber composite material for producing a pipe, in particular a conical pipe, a pipe connector, a pressure vessel, a storage tank, an insulator, a mast, a bar, a roller, a torsion shaft, a profile, a piece of sports equipment, a molded part, a cover, an automotive exterior part, a rope, a cable, an isogrid structure or a semi-finished textile product.
MOLDING PROCESS AND COMPOSITIONS THEREFOR
A composition comprises a cyanoacrylate polymer and a protected amine. A method comprises: providing a shaped model comprising a cyanoacrylate polymer; preparing an investment having a cavity that corresponds to the shaped model; and heating the shaped model to sufficient temperature that the cyanoacrylate polymer depolymerizes and volatilizes. A hardenable material may be cast in the investment to provide a replica of the shaped model. A curable composition comprises: a cyanoacrylate monomer; a free-radical photoinitiator; and a protected amine, wherein the curable composition is free of compounds that initiate anionic polymerization of the cyanoacrylate monomer at ambient temperature. A method of curing the curable composition is also disclosed.