Patent classifications
C08F222/104
Eyelash Extension Adhesive
Provided is an eyelash extension adhesive comprising the following components (a) and (b): (a) a monofunctional monomer of formula (I) wherein R.sup.1 represents a hydrogen atom or a methyl group, and R.sup.2 to R.sup.6 each independently represent a hydrogen atom or a C1 to C6 alkyl group, and (b) a photopolymerization initiator. The eyelash extension adhesive is excellent in durability and water resistance, can adhere easily to eyelashes even in a wet state, and is very useful as a photopolymerizable adhesive for eyelash extension attachment not including a cyanoacrylate compound.
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Eyelash Extension Adhesive
Provided is an eyelash extension adhesive comprising the following components (a) and (b): (a) a monofunctional monomer of formula (I) wherein R.sup.1 represents a hydrogen atom or a methyl group, and R.sup.2 to R.sup.6 each independently represent a hydrogen atom or a C1 to C6 alkyl group, and (b) a photopolymerization initiator. The eyelash extension adhesive is excellent in durability and water resistance, can adhere easily to eyelashes even in a wet state, and is very useful as a photopolymerizable adhesive for eyelash extension attachment not including a cyanoacrylate compound.
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PHOTO-CURABLE RESIN COMPOSITION FOR THREE-DIMENSIONAL SHAPING
A photo-curable resin composition for three-dimensional shaping including: a resin component (A) containing a (meth)acrylate compound (A1) represented by General Formula (1)
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(where R.sub.1 is a hydrogen atom or a methyl group, and R.sub.2 is a linear, branched, or cyclic trivalent hydrocarbon group with one to eight carbon atoms which may have three or less heteroatoms), and a urethane (meth)acrylate compound (A2) having two or more radical-polymerizable functional groups; inorganic particles (B); and a photoradical polymerization initiator (C). 40% by mass or more and 90% by mass or less of the (meth)acrylate compound (A1) is contained in the resin component (A). 10% by mass or more and 60% by mass or less of the urethane (meth)acrylate compound (A2) is contained in the resin component (A).
PHOTO-CURABLE RESIN COMPOSITION FOR THREE-DIMENSIONAL SHAPING
A photo-curable resin composition for three-dimensional shaping including: a resin component (A) containing a (meth)acrylate compound (A1) represented by General Formula (1)
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(where R.sub.1 is a hydrogen atom or a methyl group, and R.sub.2 is a linear, branched, or cyclic trivalent hydrocarbon group with one to eight carbon atoms which may have three or less heteroatoms), and a urethane (meth)acrylate compound (A2) having two or more radical-polymerizable functional groups; inorganic particles (B); and a photoradical polymerization initiator (C). 40% by mass or more and 90% by mass or less of the (meth)acrylate compound (A1) is contained in the resin component (A). 10% by mass or more and 60% by mass or less of the urethane (meth)acrylate compound (A2) is contained in the resin component (A).
A METHOD FOR IMPROVING THE FLAME, SMOKE AND/OR TOXICITY RETARDANCY IN POLYISOCYANURATE / POLYURETHANE (PIR/PUR) COMPRISING MATERIALS
A polyisocyanurate and/or polyurethane (PIR/PUR) comprising material having improved Flame, Smoke and/or Toxicity (FST) retardancy is disclosed and a method for forming said PIR/PUR comprising material. The PIR/PUR material is comprising at least 0.2 wt % of compounds having a number average equivalent weight <160 g/mol and at least one non-polymerized ethylenically unsaturated moiety based on the total weight of the PIR/PUR comprising material, and optionally 0.01 wt % up to 1 wt % of one or more radical initiator compounds based on the total weight of the PIR/PUR comprising material.
CURABLE POTTING COMPOSITION FREE OF SUBSTANCES OF VERY HIGH CONCERN
The present invention relates to a curable potting composition based on acetoacetate, and to its use in electronic devices. In particular, the present invention relates to a curable potting composition based on multifunctional acetoacetate and multifunctional (meth)acrylate.
DUAL-CURABLE ADHESIVE COMPOSITION
The present invention provides a dual-curable hybrid adhesive composition including a photo-initiator, a thermal initiator, and a thiol group-containing compound, and more particularly, to an adhesive composition which may be cured through a single curing by ultraviolet (UV) light or heat, and where thermal curing proceeds concurrently with UV curing by a heat generated during the UV curing such that even a light shield portion which may not transmit UV light therethrough may be sufficiently cured.
DUAL-CURABLE ADHESIVE COMPOSITION
The present invention provides a dual-curable hybrid adhesive composition including a photo-initiator, a thermal initiator, and a thiol group-containing compound, and more particularly, to an adhesive composition which may be cured through a single curing by ultraviolet (UV) light or heat, and where thermal curing proceeds concurrently with UV curing by a heat generated during the UV curing such that even a light shield portion which may not transmit UV light therethrough may be sufficiently cured.
Artificial Nail Tip and Curing Composition Set and Applying Method Thereof
A nail tip curing composition includes an Extend Gel, an edge-off flat brush, a nail filing device, a plurality of GEL-X tips, a pH Bonder, and a Non-Acidic Gel Primer. The pH Bonder forms a pH Bonder layer on a surface of a fingernail. The Non-Acidic Gel Primer forms a Non-Acidic Gel Prime layer overlapped on the pH Bonder layer. The Extend Gel forms an Extend Gel layer overlapped on the Non-Acidic Gel Prime layer. The GEL-X tip is filed by the nail filing device and the Extend Gel is applied on an underside contact surface of the Gel-X tip by the edge-off flat brush. The underside contact surface of the Gel-X tip is contacted with the Extend Gel layer on the fingernail in such a manner that the Gel-X tip is firmly affixed on the fingernail.
Artificial Nail Tip and Curing Composition Set and Applying Method Thereof
A nail tip curing composition includes an Extend Gel, an edge-off flat brush, a nail filing device, a plurality of GEL-X tips, a pH Bonder, and a Non-Acidic Gel Primer. The pH Bonder forms a pH Bonder layer on a surface of a fingernail. The Non-Acidic Gel Primer forms a Non-Acidic Gel Prime layer overlapped on the pH Bonder layer. The Extend Gel forms an Extend Gel layer overlapped on the Non-Acidic Gel Prime layer. The GEL-X tip is filed by the nail filing device and the Extend Gel is applied on an underside contact surface of the Gel-X tip by the edge-off flat brush. The underside contact surface of the Gel-X tip is contacted with the Extend Gel layer on the fingernail in such a manner that the Gel-X tip is firmly affixed on the fingernail.