A polymer resin compound, a photosensitive resin composition for a black bank comprising the polymer resin compound, and a method for manufacturing a black bank. The method comprises coating the photosensitive resin composition on a substrate to form a photosensitive resin film; exposing and developing the photosensitive resin film to pattern the coated photosensitive resin film; and curing the patterned photosensitive resin film.

Matrix-filled liquid radiation curable resin compositions for additive fabrication are described and claimed. Such resins include a cationically polymerizable component that is an aliphatic epoxide, a multifunctional (meth)acrylate component, a cationic photoinitiator, a free-radical photoinitiator, and a matrix of inorganic fillers, wherein the matrix further constitutes prescribed ratios of at least one microparticle constituent and at least one nanoparticle constituent. Also described and claimed is a process for using the matrix-filled liquid radiation curable resins for additive fabrication to create three dimensional parts, and the three-dimensional parts made from the liquid radiation curable resins for additive fabrication.

A photocurable coating composition includes 50 to 150 parts by weight of a urethane acrylate oligomer having a number average molecular weight of 1300 to 1700 g/mol and 9 functional groups, 50 to 150 parts by weight of an acrylate monomer, 10 to 15 parts by weight of a photoinitiator, and 1 to 3 parts by weight of a surfactant.

A photocurable coating composition includes 50 to 150 parts by weight of a urethane acrylate oligomer having a number average molecular weight of 1300 to 1700 g/mol and 9 functional groups, 50 to 150 parts by weight of an acrylate monomer, 10 to 15 parts by weight of a photoinitiator, and 1 to 3 parts by weight of a surfactant.

A printed wiring board has conductor patterns (12) having a thickness (t1) of 50 m or more on an insulating substrate (11). An insulating layer (5) is provided in regions (L) on the conductor patterns and on the insulating substrate in regions (S) between the conductor patterns. A thickness (t.sub.L) of the insulating layer on the conductor patterns is preferably 0.1-1 times the conductor thickness (t.sub.1). The insulating layer is formed on the conductor patterns and on the insulating substrate between the conductor patterns by printing a resin composition using screen printing and then curing the resin composition. The resin composition has a viscosity of 50-300 P at 25 C. and a thixotropic index of 1.1-3.5. A screen printing plate used for screen printing has a mesh thickness of 2.2 or more times a yarn diameter of yarns.

A printed wiring board has conductor patterns (12) having a thickness (t1) of 50 m or more on an insulating substrate (11). An insulating layer (5) is provided in regions (L) on the conductor patterns and on the insulating substrate in regions (S) between the conductor patterns. A thickness (t.sub.L) of the insulating layer on the conductor patterns is preferably 0.1-1 times the conductor thickness (t.sub.1). The insulating layer is formed on the conductor patterns and on the insulating substrate between the conductor patterns by printing a resin composition using screen printing and then curing the resin composition. The resin composition has a viscosity of 50-300 P at 25 C. and a thixotropic index of 1.1-3.5. A screen printing plate used for screen printing has a mesh thickness of 2.2 or more times a yarn diameter of yarns.

The present invention relates to a polarizer protective film comprising a binder resin layer in which a poly(C.sub.2-4 alkylene glycol)-modified polyfunctional urethane (meth)acrylate-based polymer and a bifunctional or higher polyfunctional (meth)acrylate-based compound form a cross-linked bond, a polarizing plate comprising the polarizer protective film and a method for preparing a polarizing plate comprising forming the polarizer protective film.

The present invention relates to a polarizer protective film comprising a binder resin layer in which a poly(C.sub.2-4 alkylene glycol)-modified polyfunctional urethane (meth)acrylate-based polymer and a bifunctional or higher polyfunctional (meth)acrylate-based compound form a cross-linked bond, a polarizing plate comprising the polarizer protective film and a method for preparing a polarizing plate comprising forming the polarizer protective film.

Matrix-filled liquid radiation curable resin compositions for additive fabrication are described and claimed. Such resins include a cationically polymerizable component that is an aliphatic epoxide, a multifunctional (meth)acrylate component, a cationic photoinitiator, a free-radical photo initiator, and a matrix of inorganic fillers, wherein the matrix further constitutes prescribed ratios of at least one microparticle constituent and at least one nanoparticle constituent. Also described and claimed is a process for using the matrix-filled liquid radiation curable resins for additive fabrication to create three dimensional parts, and the three-dimensional parts made from the liquid radiation curable resins for additive fabrication.

The present invention provides a black photosensitive composition which has excellent residue suppressibility in a case where a pattern is formed and which makes it possible to form a pattern having excellent adhesiveness with a smaller exposure amount, a production method for a black photosensitive composition, a cured film, a color filter, a light shielding film, an optical element, a solid-state imaging element, and a headlight unit. The black photosensitive composition according to the present invention is a black photosensitive composition containing a black pigment, a resin, a carboxylic acid anhydride, and a polymerizable compound, in which the carboxylic acid anhydride has a molecular weight of 50 to 550, the carboxylic acid anhydride has a content of 0.30% to 10.0% by mass with respect to a total solid content of the black photosensitive composition, and the black pigment has an average particle diameter of 250 nm or less.