The present invention is a method of curing an adhesive composition positioned at least partially under a light-absorbing layer. The method includes providing an adhesive composition, positioning the light-absorbing layer over a surface of the adhesive composition such that there is an exposed area of the adhesive composition and a covered area of the adhesive composition and irradiating the exposed area of the adhesive composition and the covered area of the adhesive composition at the surface at a dosage of between about 100 mJ/cm.sup.2 and about 10,000 mJ/cm.sup.2. The adhesive composition includes a solute (meth)acryolyl oligomer having a molecular weight of 4 to 30 k and a Tg of less than about 20° C., a diluents monomer component and a photoinitiator.

The present invention is a method of curing an adhesive composition positioned at least partially under a light-absorbing layer. The method includes providing an adhesive composition, positioning the light-absorbing layer over a surface of the adhesive composition such that there is an exposed area of the adhesive composition and a covered area of the adhesive composition and irradiating the exposed area of the adhesive composition and the covered area of the adhesive composition at the surface at a dosage of between about 100 mJ/cm.sup.2 and about 10,000 mJ/cm.sup.2. The adhesive composition includes a solute (meth)acryolyl oligomer having a molecular weight of 4 to 30 k and a Tg of less than about 20° C., a diluents monomer component and a photoinitiator.

A photosensitive resin composition according to an example embodiment of the present disclosure includes a quantum dot, a photopolymerizable compound, a photopolymerization initiator, an alkali-soluble resin, and a solvent, wherein the alkali-soluble resin includes at least one of a monomer represented by Formula 1 and a monomer represented by Formula 2:

##STR00001##

A monomer having a substituent group capable of polarity switch under the action of acid is provided. A useful polymer is obtained by polymerizing the monomer. A resist composition comprising the polymer has improved development properties and is processed to form a negative pattern having high resolution and etch resistance which is insoluble in alkaline developer.

A curable resin composition which provides a cured product excellent in impact resistance and flexural modulus and has a low viscosity comprising a component (A), a component (B) and a component (C). The component (A) is a compound represented by formula (1),

##STR00001##

In formula (1), R is hydrogen or a hydrocarbon group having 1 to 4 carbon atoms. The hydrocarbon group optionally has a substituent. The component (B) is a compound having one or more caprolactone modified structures and two or more radically polymerizable groups per molecule, and the component (C) is a radical polymerization initiator.

A curable resin composition which provides a cured product excellent in impact resistance and flexural modulus and has a low viscosity comprising a component (A), a component (B) and a component (C). The component (A) is a compound represented by formula (1),

##STR00001##

In formula (1), R is hydrogen or a hydrocarbon group having 1 to 4 carbon atoms. The hydrocarbon group optionally has a substituent. The component (B) is a compound having one or more caprolactone modified structures and two or more radically polymerizable groups per molecule, and the component (C) is a radical polymerization initiator.

A curable resin composition which provides a cured product excellent in impact resistance and flexural modulus and has a low viscosity comprising a component (A), a component (B) and a component (C). The component (A) is a compound represented by formula (1),

##STR00001##

wherein in formula (1), R is hydrogen or a hydrocarbon group having 1 to 4 carbon atoms, and the hydrocarbon group optionally has a substituent, wherein the component (B) is a compound having 3 or more to 15 or less of oxyethylene groups or oxypropylene groups and two or more radically polymerizable groups per molecule, and wherein the component (C) is a radical polymerization initiator.

A curable resin composition which provides a cured product excellent in impact resistance and flexural modulus and has a low viscosity comprising a component (A), a component (B) and a component (C). The component (A) is a compound represented by formula (1),

##STR00001##

wherein in formula (1), R is hydrogen or a hydrocarbon group having 1 to 4 carbon atoms, and the hydrocarbon group optionally has a substituent, wherein the component (B) is a compound having 3 or more to 15 or less of oxyethylene groups or oxypropylene groups and two or more radically polymerizable groups per molecule, and wherein the component (C) is a radical polymerization initiator.

Dental materials may be made from polyhydric phenols that are non-genotoxic and exhibit estrogenic activity less than that of bisphenol S, while exhibiting properties such as strength and flexibility comparable to those of conventional BPA-derived dental materials.

This disclosure is directed to lighting diffusing fibers (LDFs) having a flame retardant coating thereon. The LDFs comprise a glass RAL fiber core having a primary polymer coating of a clear, colorless polymeric material having an index of refraction less than that of the glass fiber core and a flame retardant coating applied over the primary coating. The flame retardant coating consist of approximately 35-85 wt. % UV curable polymer forming monomers and 15-65 wt. % of an inorganic, halogen free filler, along with at least one photoinitiator and an antioxidant. In an embodiment phosphor-containing polymer layer can be applied between the primary coating and the flame retardant coating. In another embodiment the phosphor can be added to the flame retardant coating.