Patent classifications
C08F222/322
Two-Part Cyanoacrylate Curable Adhesive System
Two-part cyanoacrylate/cationically curable adhesive systems are provided.
Two-Part, Cyanoacrylate/Free Radically Curable Adhesive Systems
Two-part cyanoacrylate/free radical curable adhesive systems, are provided.
Two-Part, Cyanoacrylate/Free Radically Curable Adhesive Systems
Two-part cyanoacrylate/free radical curable adhesive systems, are provided.
Cyanoacrylate compositions
Cyanoacrylate compositions that include, in addition to an allyl-2-cyanoacrylate, a rubber toughening component and a component functionalized with at least two blocked hydroxyl groups are provided.
Photocurable electron deficient olefin-containing compositions
This invention relates to photocurable electron deficient olefin-containing compositions, such as those containing certain 2-cyanoacrylates, 2-cyanopentadienoates, methylidene malonates, and vinylidine cyanide, and photolatent bases. When exposed to radiation in the electromagnetic spectrum, the compositions show a delay cure property.
Photocurable electron deficient olefin-containing compositions
This invention relates to photocurable electron deficient olefin-containing compositions, such as those containing certain 2-cyanoacrylates, 2-cyanopentadienoates, methylidene malonates, and vinylidine cyanide, and photolatent bases. When exposed to radiation in the electromagnetic spectrum, the compositions show a delay cure property.
CYANOACRYLATE COMPOSITIONS
This invention relates to cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, a polybutylmethacrylate-polymethylmethacrylate copolymer. The inventive cyanoacrylate compositions load up to nearly a threefold increase of polybutylmethacrylate-polymethylmethacrylate copolymer over conventional polymethylmethacrylate and cured products of the inventive cyanoacrylate compositions demonstrate improved flexibility in terms of modulus (at comparable loading levels as well as increased loading levels compared to conventional polymethylmethacrylate) without compromising stability, fixture time or tensile shear strength.
CYANOACRYLATE COMPOSITIONS
This invention relates to cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, a polybutylmethacrylate-polymethylmethacrylate copolymer. The inventive cyanoacrylate compositions load up to nearly a threefold increase of polybutylmethacrylate-polymethylmethacrylate copolymer over conventional polymethylmethacrylate and cured products of the inventive cyanoacrylate compositions demonstrate improved flexibility in terms of modulus (at comparable loading levels as well as increased loading levels compared to conventional polymethylmethacrylate) without compromising stability, fixture time or tensile shear strength.
CYANOACRYLIC ADHESIVE COMPOSITIONS WITH IMPROVED RESISTANCE TO HIGH TEMPERATURES
Cyanoacrylic adhesive compositions of the type comprising at least one cyanoacrylic acid ester or one malonic acid ester having an allyl, acrylic or methacrylic group, wherein there is also present at least one radical initiator of the polymerization reaction of the allyl, acrylic or methacrylic ester of cyanoacrylic acid or malonic acid and at least one radical inhibitor of said polymerization reaction. In comparison with known cyanoacrylic adhesive compositions, those according to the invention offer the advantage of maintaining their bonding capability even at high temperatures, in particular up to 150 C.
CYANOACRYLIC ADHESIVE COMPOSITIONS WITH IMPROVED RESISTANCE TO HIGH TEMPERATURES
Cyanoacrylic adhesive compositions of the type comprising at least one cyanoacrylic acid ester or one malonic acid ester having an allyl, acrylic or methacrylic group, wherein there is also present at least one radical initiator of the polymerization reaction of the allyl, acrylic or methacrylic ester of cyanoacrylic acid or malonic acid and at least one radical inhibitor of said polymerization reaction. In comparison with known cyanoacrylic adhesive compositions, those according to the invention offer the advantage of maintaining their bonding capability even at high temperatures, in particular up to 150 C.