Patent classifications
C08F222/404
Hydrophilic polymer and membrane for oil-water separation and method of producing the same
This invention relates to a hydrophilic polymer and membrane for oil-water separation. More particularly, this invention relates to a super hydrophilic polymer and membrane with zwitterionic property for oil-water separation, and method of producing the same. The hydrophilic polymer comprises polymer repeat units, each unit having at least one negatively charged carboxylic functional group and at least one positively charged amine functional group; and a monomer having a single aromatic ring and an imide functional group.
CURABLE COMPOUND
Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T.sub.d5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.
CURABLE COMPOUND
Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T.sub.d5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.
LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, LIQUID CRYSTAL ELEMENT, AND POLYMER
Provided is a liquid crystal alignment agent that makes it possible to obtain a liquid crystal alignment film having a superior balance among solvent resistance, liquid crystal alignment properties, and voltage holding ratio. The liquid crystal alignment agent contains a polymer [P] including: at least one ring structure of an oxetane ring and an oxirane ring; (B) a functional group that reacts with at least one of the oxetane ring and the oxirane ring by heating; and (C) an optically aligning group.
LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, LIQUID CRYSTAL ELEMENT, AND POLYMER
Provided is a liquid crystal alignment agent that makes it possible to obtain a liquid crystal alignment film having a superior balance among solvent resistance, liquid crystal alignment properties, and voltage holding ratio. The liquid crystal alignment agent contains a polymer [P] including: at least one ring structure of an oxetane ring and an oxirane ring; (B) a functional group that reacts with at least one of the oxetane ring and the oxirane ring by heating; and (C) an optically aligning group.
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE
A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin composition contains a chelating flux agent (A), a thermal radical polymerization initiator (B) and a radical polymerizable compound (C).
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE
A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin composition contains a chelating flux agent (A), a thermal radical polymerization initiator (B) and a radical polymerizable compound (C).
FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN
An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. The problem described above can be solved by the following film forming material for lithography. A film forming material for lithography comprising: a compound having a group of formula (0A):
##STR00001##
(In formula (0A), R.sup.A is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and R.sup.B is an alkyl group having 1 to 4 carbon atoms.); and a compound having a group of formula (0B):
##STR00002##
FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN
An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. The problem described above can be solved by the following film forming material for lithography. A film forming material for lithography comprising: a compound having a group of formula (0A):
##STR00001##
(In formula (0A), R.sup.A is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and R.sup.B is an alkyl group having 1 to 4 carbon atoms.); and a compound having a group of formula (0B):
##STR00002##
RESIN COMPOSITION, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD EACH OBTAINED USING SAID RESIN COMPOSITION
One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).