The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

To provide a sealant composition with which a decrease in voltage holding rate is less likely to occur in a liquid crystal cell for a scanning antenna, the sealant composition according to the present invention includes a photo-radical polymerization initiator that generates a radical through application of light with a wavelength of 450 nm or greater and a polymerization component that contains a polymerizable functional group that is polymerizable using the radical.

To provide a sealant composition with which a decrease in voltage holding rate is less likely to occur in a liquid crystal cell for a scanning antenna, the sealant composition according to the present invention includes a photo-radical polymerization initiator that generates a radical through application of light with a wavelength of 450 nm or greater and a polymerization component that contains a polymerizable functional group that is polymerizable using the radical.

The invention pertains to a (per)fluoroelastomer composition comprising: a (per)fluoroelastomer [fluoroelastomer (A)]; and at least one (per)fluoropolyether additive [polymer (E)] comprising a (per)fluoropolyether chain comprising recurring units having at least one catenary ether bond and at least one fluorocarbon moiety, and comprising at least one chain end comprising at least one per(halo)fluorinated aromatic group [group (Ar.sup.F)], said polymer (E) being comprised in the composition in an amount of 0.5 to 30 phr, with respect to fluoroelastomer (A).

The invention pertains to a (per)fluoroelastomer composition comprising: a (per)fluoroelastomer [fluoroelastomer (A)]; and at least one (per)fluoropolyether additive [polymer (E)] comprising a (per)fluoropolyether chain comprising recurring units having at least one catenary ether bond and at least one fluorocarbon moiety, and comprising at least one chain end comprising at least one per(halo)fluorinated aromatic group [group (Ar.sup.F)], said polymer (E) being comprised in the composition in an amount of 0.5 to 30 phr, with respect to fluoroelastomer (A).

A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

An object of the present invention is to provide an active energy ray-curable inkjet ink composition that has a low viscosity such that the composition can be ejected as an inkjet ink, and can exhibit sufficient adhesion to a plastic substrate having low surface free energy. The present invention provides an active energy ray-curable inkjet ink composition comprising a polyester resin (A), wherein the polyester resin (A) contains a structural unit (a-1) derived from a polybasic acid and a structural unit (a-2) derived from a polyhydric alcohol, the structural unit (a-2) derived from a polyhydric alcohol contains 20 mol % or more and 100 mol % or less of a structural unit derived from hydrogenated bisphenol A, and the polyester resin (A) has a number average molecular weight (Mn) of 500 to 4,500 and an acid value of 5 to 300.

An object of the present invention is to provide an active energy ray-curable inkjet ink composition that has a low viscosity such that the composition can be ejected as an inkjet ink, and can exhibit sufficient adhesion to a plastic substrate having low surface free energy. The present invention provides an active energy ray-curable inkjet ink composition comprising a polyester resin (A), wherein the polyester resin (A) contains a structural unit (a-1) derived from a polybasic acid and a structural unit (a-2) derived from a polyhydric alcohol, the structural unit (a-2) derived from a polyhydric alcohol contains 20 mol % or more and 100 mol % or less of a structural unit derived from hydrogenated bisphenol A, and the polyester resin (A) has a number average molecular weight (Mn) of 500 to 4,500 and an acid value of 5 to 300.

Provided is a photosensitive composition including a radically polymerizable compound, a photoradical polymerization initiator, and at least one selected from a chain transfer agent or a radical trapping agent.

Provided is a photosensitive composition including a radically polymerizable compound, a photoradical polymerization initiator, and at least one selected from a chain transfer agent or a radical trapping agent.