C08K5/3442

POLISHING LIQUID AND CHEMICAL MECHANICAL POLISHING METHOD
20200362199 · 2020-11-19 · ·

A polishing liquid used for chemical mechanical polishing includes colloidal silica, in which a zeta potential of the colloidal silica measured in a state where the colloidal silica is present in the polishing liquid is 20 mV or less, an electrical conductivity is 200 S/cm or less, a pH is 2 to 6, and a transmittance is 70% to 99%.

POLISHING LIQUID AND CHEMICAL MECHANICAL POLISHING METHOD
20200362199 · 2020-11-19 · ·

A polishing liquid used for chemical mechanical polishing includes colloidal silica, in which a zeta potential of the colloidal silica measured in a state where the colloidal silica is present in the polishing liquid is 20 mV or less, an electrical conductivity is 200 S/cm or less, a pH is 2 to 6, and a transmittance is 70% to 99%.

Method for producing functionalized polyesters

The present application is directed to a method for preparing an amino-functional polyester, said method comprising: providing a mixture comprising at least one lactone monomer, a catalyst and a polyamine having at least one primary and at least one secondary amine group; and, subjecting said mixture to ring-opening polymerization conditions.

Method for producing functionalized polyesters

The present application is directed to a method for preparing an amino-functional polyester, said method comprising: providing a mixture comprising at least one lactone monomer, a catalyst and a polyamine having at least one primary and at least one secondary amine group; and, subjecting said mixture to ring-opening polymerization conditions.

THERMOSETTING RESIN COMPOSITION
20200317913 · 2020-10-08 · ·

An object of the present invention is to provide a cyanate ester-based curable resin composition having a high curing rate, very high heat resistance and very high long-term heat resistance, and a molded article and a prepreg each using the same. The present invention relates to a thermosetting resin composition including (A) a cyanate ester compound and/or (B) an unsaturated imide compound, and (C) a cyclic carbodiimide compound. In addition, the present invention relates to a molded article including a cured product of the thermosetting resin composition, and a prepreg including a reinforcing fiber substrate impregnated with the thermosetting resin composition.

THERMOSETTING RESIN COMPOSITION
20200317913 · 2020-10-08 · ·

An object of the present invention is to provide a cyanate ester-based curable resin composition having a high curing rate, very high heat resistance and very high long-term heat resistance, and a molded article and a prepreg each using the same. The present invention relates to a thermosetting resin composition including (A) a cyanate ester compound and/or (B) an unsaturated imide compound, and (C) a cyclic carbodiimide compound. In addition, the present invention relates to a molded article including a cured product of the thermosetting resin composition, and a prepreg including a reinforcing fiber substrate impregnated with the thermosetting resin composition.

HYDROLYSIS RESISTANT POLYAMIDES

A hydrolysis resistant polyamide composition comprising from 50 wt % to 80 wt % polyamide polymer having a theoretical amine end group content of at least 55 eq/gram; and from 25 wt % to 60 wt % glass fibers. The weight ratio of polyamide polymer to glass fibers ranges from 0.5:1 to 4.0:1. The polyamide composition comprises less than 0.06 wt % copper; and/or from 1 ppb to 0.24 wt % non-copper metal halide compound. The polyamide composition, when hydrolysis aged for 500 hours at 130 C., demonstrates an impact resilience greater than 40 kJ/m.sup.2, as measured at 23 C.

HYDROLYSIS RESISTANT POLYAMIDES

A hydrolysis resistant polyamide composition comprising from 50 wt % to 80 wt % polyamide polymer having a theoretical amine end group content of at least 55 eq/gram; and from 25 wt % to 60 wt % glass fibers. The weight ratio of polyamide polymer to glass fibers ranges from 0.5:1 to 4.0:1. The polyamide composition comprises less than 0.06 wt % copper; and/or from 1 ppb to 0.24 wt % non-copper metal halide compound. The polyamide composition, when hydrolysis aged for 500 hours at 130 C., demonstrates an impact resilience greater than 40 kJ/m.sup.2, as measured at 23 C.

Activated isobutylene-isoprene rubber and thermoset rubber therefrom
10676598 · 2020-06-09 · ·

In one or more embodiments, the present invention provides an way to modify the isoprene unit using an alder-ene reaction to form thermoset compounds comprising the resultant electron-deficient, readily crosslinkable polyisobutylene-based rubber that avoids the use of corrosive bromine or chlorine to make the activated butyl rubber, is easier to crosslink than the halobutyls, allows crosslinking with a simple organic base or a peroxide, and has mechanical properties as good as or better than sulfur crosslinked butyl rubbers.

Activated isobutylene-isoprene rubber and thermoset rubber therefrom
10676598 · 2020-06-09 · ·

In one or more embodiments, the present invention provides an way to modify the isoprene unit using an alder-ene reaction to form thermoset compounds comprising the resultant electron-deficient, readily crosslinkable polyisobutylene-based rubber that avoids the use of corrosive bromine or chlorine to make the activated butyl rubber, is easier to crosslink than the halobutyls, allows crosslinking with a simple organic base or a peroxide, and has mechanical properties as good as or better than sulfur crosslinked butyl rubbers.