The presently claimed invention relates to the use of ionic liquids for stabilizing the viscosity of an aqueous silicate-based coating composition and a method for stabilizing the composition thereof. The presently claimed invention is also directed to an aqueous composition comprising ionic liquids.

A curable resin composition includes a phthalonitrile oligomer, and a prepolymer thereof. According to the present invention, a curable resin composition, which has melt viscosity that can be controlled within a wide range, and thus, can be applied in a larger number of fields.

The present invention relates to a coating composition and a coating film prepared therefrom, and more particularly, to a coating composition for preparing a coating film exhibiting more improved mechanical and optical properties together with self-healing properties and impact resistance; and to a coating film prepared therefrom.

Disclosed herein are a resin composition for underlayer film formation which is capable of forming an underlayer film having good adhesiveness to a base material and good surface state, an imprint forming kit, a laminate, a pattern forming method, and a method for producing a device. Provided is a resin composition for underlayer film formation, including a resin, a nucleophilic catalyst, and a solvent, in which the content of the nucleophilic catalyst is 0.01 to 0.3 mass % with respect to the solid content of the resin composition for underlayer film formation.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

Thermoplastic resin composition comprising: (a1) at least one styrene-acrylonitrile copolymer component A1, (a2) at least one acrylonitrile styrene acrylate graft copolymer A2 as impact modifier, (a3) optionally at least one thermoplastic polymer A3 other than components A1 and A2, (b) at least one pigment B, (c) at least one hindered amine UV light stabilizer C, and (d) optionally further polymer additives D, other than components B and C, wherein the UV stabilizing component(s) present in the thermoplastic resin are only hindered amine UV light stabilizer(s) C.

Thermoplastic resin composition comprising: (a1) at least one styrene-acrylonitrile copolymer component A1, (a2) at least one acrylonitrile styrene acrylate graft copolymer A2 as impact modifier, (a3) optionally at least one thermoplastic polymer A3 other than components A1 and A2, (b) at least one pigment B, (c) at least one hindered amine UV light stabilizer C, and (d) optionally further polymer additives D, other than components B and C, wherein the UV stabilizing component(s) present in the thermoplastic resin are only hindered amine UV light stabilizer(s) C.

A rubber modifier for a tire includes rosins and/or terpenes and at least one kind of nitrogen-containing compound selected from the group consisting of a nitrogen-containing heterocyclic compound, a tertiary amine compound, and an amino alcohol.

Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to heat or electromagnetic energy. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a shape memory material. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.