Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

A method for forming a film for the fabrication of a microelectronic or optoelectronic device comprising a series of diazirine compounds of formula (I) having utility as photocrosslinkers are disclosed.

##STR00001##

Where, A, L, z, Ar.sub.x and R.sub.y are as defined herein.

A method for forming a film for the fabrication of a microelectronic or optoelectronic device comprising a series of diazirine compounds of formula (I) having utility as photocrosslinkers are disclosed.

##STR00001##

Where, A, L, z, Ar.sub.x and R.sub.y are as defined herein.

A method for forming a film for the fabrication of a microelectronic or optoelectronic device comprising a series of diazirine compounds of formula (I) having utility as photocrosslinkers are disclosed.

##STR00001##

Where, A, L, z, Ar.sub.x and R.sub.y are as defined herein.

A series of diazirine compounds of formula (I) having utility as photocrosslinkers are disclosed. ##STR00001##
Where, A, L, z, Ar.sub.x and R.sub.y are as defined herein. Also disclosed are the photodefinable compositions containing these compounds.

A series of diazirine compounds of formula (I) having utility as photocrosslinkers are disclosed. ##STR00001##
Where, A, L, z, Ar.sub.x and R.sub.y are as defined herein. Also disclosed are the photodefinable compositions containing these compounds.

A series of diazirine compounds of formula (I) having utility as photocrosslinkers are disclosed. ##STR00001##
Where, A, L, z, Ar.sub.x and R.sub.y are as defined herein. Also disclosed are the photodefinable compositions containing these compounds.

A technique capable of suppressing reduction in thickness of a downhole tool or a component thereof in a well at a high temperature, and a resin composition including: 50 parts by mass or more and 97 parts by mass or less of polyglycolic acid; 3 parts by mass or more and 50 parts by mass or less of polybutylene terephthalate; and 2 parts by mass or more and 15 parts by mass or less of a cyclic carbodiimide compound with respect to 100 parts by mass of a total amount of the polyglycolic acid and the polybutylene terephthalate.