A plasticized PVC composition free of phthalate and having low color is disclosed. The composition comprises a morpholide plasticizer prepared from a fatty acid selected from a tall oil fatty acid, a tall oil fatty acid monomer derived therefrom, and mixtures thereof. The fatty acid has a total carbon footprint of <95% of the total carbon footprint of a fatty acid obtained from a vegetable oil. The morpholide is prepared from the reaction of a tall oil fatty acid with morpholine in the presence of a catalyst.

A plasticized PVC composition free of phthalate and having low color is disclosed. The composition comprises a morpholide plasticizer prepared from a fatty acid selected from a tall oil fatty acid, a tall oil fatty acid monomer derived therefrom, and mixtures thereof. The fatty acid has a total carbon footprint of <95% of the total carbon footprint of a fatty acid obtained from a vegetable oil. The morpholide is prepared from the reaction of a tall oil fatty acid with morpholine in the presence of a catalyst.

Provided is a paste thermosetting resin composition containing solder powder, a thermosetting resin binder, an activator, and a thixotropy imparting agent. The solder powder has a melting point ranging from 100 C. to 240 C., inclusive. The thermosetting resin binder contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.

Provided is a paste thermosetting resin composition containing solder powder, a thermosetting resin binder, an activator, and a thixotropy imparting agent. The solder powder has a melting point ranging from 100 C. to 240 C., inclusive. The thermosetting resin binder contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.

To suppress the bias of the distribution of a filler dispersed in a sealing material (cured product) covering an electrode connection portion, provided is an epoxy resin composition, including: (A) an epoxy resin; (B) a curing agent; (C) a filler; and (D) an ionic compound in which at least one of a cation or an anion is organic matter.

An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.

An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.

An aqueous coating material composition, includes: a polyolefin resin aqueous dispersion (A) containing a polypropylene (a1); a crosslinking agent (B) having a functional group that reacts with a carboxyl group; and a polyester resin aqueous dispersion (C) having a resin acid value of 3 mgKOHg to 100 mgKOH/g, and with respect to a total solid content of the polyolefin resin aqueous dispersion (A), a solid content of the crosslinking agent (B) is 0.1 mass % to 20 mass %, and a solid content of the polyester resin aqueous dispersion (C) is 0.5 mass % to 30 mass %.

An aqueous coating material composition, includes: a polyolefin resin aqueous dispersion (A) containing a polypropylene (a1); a crosslinking agent (B) having a functional group that reacts with a carboxyl group; and a polyester resin aqueous dispersion (C) having a resin acid value of 3 mgKOHg to 100 mgKOH/g, and with respect to a total solid content of the polyolefin resin aqueous dispersion (A), a solid content of the crosslinking agent (B) is 0.1 mass % to 20 mass %, and a solid content of the polyester resin aqueous dispersion (C) is 0.5 mass % to 30 mass %.

The resin composition for sealing semiconductor according to the present invention is characterized by containing a maleimide-based compound represented by the following general formula (1), at least one of the benzoxazine-based compounds represented by the following general formula (2-1) and the following general formula (2-2), a curing catalyst, and an inorganic filler. In the general formulae (1), (2-1) and (2-2), each of X.sup.2, X.sup.3 and X.sup.4 independently represents an alkylene group having 1 to 10 carbon atoms, a group represented by the following general formula (3), a group represented by the formula SO.sub.2 or CO, an oxygen atom or a single bond. ##STR00001##