Provided is a paste thermosetting resin composition containing solder powder, a thermosetting resin binder, an activator, and a thixotropy imparting agent. The solder powder has a melting point ranging from 100 C. to 240 C., inclusive. The thermosetting resin binder contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.

Provided is a paste thermosetting resin composition containing solder powder, a thermosetting resin binder, an activator, and a thixotropy imparting agent. The solder powder has a melting point ranging from 100 C. to 240 C., inclusive. The thermosetting resin binder contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.

According to the present invention, there is provide a coated film capable of exhibiting an excellent adhesion property to a prism resin used in optical applications such as a backlight unit for liquid crystal displays, etc., in particular, a prism resin adaptable for high-brightness prisms, i.e., a high-refractive index prism resin. The coating film of the present invention comprises a polyester film and a coating layer formed on at least one surface of the polyester film which is prepared from a coating solution comprising a (meth)acrylate (A) and at least one crosslinking agent (B) selected from the group consisting of an oxazoline compound, an isocyanate-based compound and a melamine compound.

According to the present invention, there is provide a coated film capable of exhibiting an excellent adhesion property to a prism resin used in optical applications such as a backlight unit for liquid crystal displays, etc., in particular, a prism resin adaptable for high-brightness prisms, i.e., a high-refractive index prism resin. The coating film of the present invention comprises a polyester film and a coating layer formed on at least one surface of the polyester film which is prepared from a coating solution comprising a (meth)acrylate (A) and at least one crosslinking agent (B) selected from the group consisting of an oxazoline compound, an isocyanate-based compound and a melamine compound.

The invention pertains to a filled polyamide composition [composition (C)] comprising: from 35 to 80% wt of at least one polyhydric alcohol-modified polyamide, comprising an amount of polyhydric alcohol (PHA, herein after) residues chemically bonded at least to a part of the polyamide [polyamide (A)] of at least 0.1% wt (based on the total weight of polyamide (A)); from 10 to 65% wt of at least one filler [filler (F)]; from 1 to 10% wt of at least one impact modifying rubber [rubber (I)]; and from 0.01 to 3% wt of at least one copper-containing stabilizer, with above % wt being referred to the total weight of composition (C).

A resin composition including an aromatic polyester resin and having high levels of hydrolysis resistance and moldability is provided. The resin composition includes an aromatic polyester resin having a terminal carboxyl group content of not more than 30 eq/ton (component A), a cyclic carbodiimide compound having at least two carbodiimide rings, each having only one carbodiimide group (component B), and a polyvalent hydroxyl group-containing compound having a hydroxyl value of not less than 200 (component C).

A resin composition including an aromatic polyester resin and having high levels of hydrolysis resistance and moldability is provided. The resin composition includes an aromatic polyester resin having a terminal carboxyl group content of not more than 30 eq/ton (component A), a cyclic carbodiimide compound having at least two carbodiimide rings, each having only one carbodiimide group (component B), and a polyvalent hydroxyl group-containing compound having a hydroxyl value of not less than 200 (component C).

A resin composition including an aromatic polyester resin and having high levels of hydrolysis resistance and moldability is provided. The resin composition includes an aromatic polyester resin having a terminal carboxyl group content of not more than 30 eq/ton (component A), a cyclic carbodiimide compound having at least two carbodiimide rings, each having only one carbodiimide group (component B), and a polyvalent hydroxyl group-containing compound having a hydroxyl value of not less than 200 (component C).

A resin composition which comprises polylactic acid, does not release an isocyanate group at the time of production and has excellent hydrolysis resistance and a low environmental burden. The resin composition comprises: (A) 100 parts by weight of a resin component (component A) containing polylactic acid (component A-); (B) 0.001 to 10 parts by weight of a compound (component B) having one carbodiimide group and a cyclic structure in which first nitrogen and second nitrogen are bonded to each other via a bonding group, the cyclic structure consisting of 8 to 50 atoms; and (C) 0.001 to 2 parts by weight of at least one antioxidant (component C) selected from the group consisting of a hindered phenol-based compound, a phosphite-based compound, a phosphonite-based compound and a thioether-based compound.

The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.