This invention relates to a vehicle headlight assembly comprising: a light source, a housing supporting the light, a bezel equipped over the front side of the housing, and a transparent cover being equipped over the front side of the bezel, wherein the bezel and optionally the housing comprises a thermoplastic resin and a colorant, wherein the colorant is selected from the group consisting of an anthraquinone dye, an amine salt thereof and a mixture thereof.

One embodiment is a hardcoat multilayer film which includes layers, namely, a first hardcoat, a second hardcoat and a transparent resin film sequentially from the surface layer side. The first hardcoat is formed from a coating material that does not contain inorganic particles, while containing 100 parts by mass of (A) a polyfunctional (meth)acrylate, 0.5-20 parts by mass of (B) a compound having two or more secondary thiol groups in each molecule, 0.01-7 parts by mass of (C) a water repellent agent and 0.01-10 parts by mass of (D) a silane coupling agent; and the second hardcoat is formed from a coating material that contains 100 parts by mass of (A) a polyfunctional (meth)acrylate and 30-300 parts by mass of (F) inorganic fine particles having an average particle diameter of 1-300 nm. The polyfunctional (meth)acrylate (A) may contain 20% by mass or more of a tripentaerythritol acrylate. The coating material which forms the first hardcoat may additionally contain 0.1-5 parts by mass of (E) a thiophenyl-based photopolymerization initiator.

One embodiment is a hardcoat multilayer film which includes layers, namely, a first hardcoat, a second hardcoat and a transparent resin film sequentially from the surface layer side. The first hardcoat is formed from a coating material that does not contain inorganic particles, while containing 100 parts by mass of (A) a polyfunctional (meth)acrylate, 0.5-20 parts by mass of (B) a compound having two or more secondary thiol groups in each molecule, 0.01-7 parts by mass of (C) a water repellent agent and 0.01-10 parts by mass of (D) a silane coupling agent; and the second hardcoat is formed from a coating material that contains 100 parts by mass of (A) a polyfunctional (meth)acrylate and 30-300 parts by mass of (F) inorganic fine particles having an average particle diameter of 1-300 nm. The polyfunctional (meth)acrylate (A) may contain 20% by mass or more of a tripentaerythritol acrylate. The coating material which forms the first hardcoat may additionally contain 0.1-5 parts by mass of (E) a thiophenyl-based photopolymerization initiator.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

Biomass derived benzophenone derivatives, and methods of making and using the same, are described. In accordance with the present disclosure, biomass derived benzophenone derivatives are useful as visible light photoinitiators.

A method of manufacturing a semiconductor device includes forming a polymer mixture over a substrate, curing the polymer mixture to form a polymer material, and patterning the polymer material. The polymer mixture includes a polymer precursor, a photosensitizer, a cross-linker, and a solvent. The polymer precursor may be a polyamic acid ester. The cross-linker may be tetraethylene glycol dimethacrylate. The photosensitizer includes 4-phenyl-2-(piperazin-1-yl)thiazole. The mixture may further include an additive.

A method of manufacturing a semiconductor device includes forming a polymer mixture over a substrate, curing the polymer mixture to form a polymer material, and patterning the polymer material. The polymer mixture includes a polymer precursor, a photosensitizer, a cross-linker, and a solvent. The polymer precursor may be a polyamic acid ester. The cross-linker may be tetraethylene glycol dimethacrylate. The photosensitizer includes 4-phenyl-2-(piperazin-1-yl)thiazole. The mixture may further include an additive.

The direct-current cable includes a conductive portion; and an insulating layer covering an outer periphery of the conductive portion, the insulating layer containing cross-linked base resin and inorganic filler, the base resin containing polyethylene, a BET specific surface area of the inorganic filler being greater than or equal to 5 m.sup.2/g and less than or equal to 150 m.sup.2/g, and a mean volume diameter of the inorganic filler being less than or equal to 1.0 μm, the mass ratio of the inorganic filler with respect to the base resin being greater than or equal to 0.001 and less than or equal to 0.05, and the cross-linked base resin being cross-linked by a cross-linking agent containing organic peroxide.