C08K5/5435

POLYORGANOSILOXANE COMPOSITION FOR USE IN ADHESION OF A POLYPHENYLENE SULFIDE RESIN

An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.

POLYORGANOSILOXANE COMPOSITION FOR USE IN ADHESION OF A POLYPHENYLENE SULFIDE RESIN

An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.

Thermosetting epoxy resin composition for the preparation of articles for electrical engineering, and the articles obtained therefrom

A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), wherein x is a number of from 2 to 8, and (b2) a polyetheramine with at least one terminal end group of the formula (2) (Formula (2)), and (C) at least one epoxy silane, is, in particular, suitable for the manufacture of instrument transformers and dry-type transformers by casting, potting and encapsulation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties. ##STR00001##

Thermosetting epoxy resin composition for the preparation of articles for electrical engineering, and the articles obtained therefrom

A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), wherein x is a number of from 2 to 8, and (b2) a polyetheramine with at least one terminal end group of the formula (2) (Formula (2)), and (C) at least one epoxy silane, is, in particular, suitable for the manufacture of instrument transformers and dry-type transformers by casting, potting and encapsulation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties. ##STR00001##

Multi-vinyl cyclic siloxane enhanced ethylene/α-olefin/diene interpolymer based compositions

A composition comprising the following components: A) an ethylene/α-olefin/non-conjugated diene interpolymer; B) a peroxide; C) at least one multi-vinyl cyclic siloxane selected from Structure 1 below: Structure 1, wherein n is an integer greater than, or equal to, 1; and each R1 is independently selected from the following: a (C.sub.2-C.sub.4) alkenyl, or a H.sub.2C═C(R.sup.1a)—C(═O)—O—(CH.sub.2).sub.m—, and wherein R.sup.1a is H or methyl, and m is an integer from 1 to 4; and each R2 is independently selected from the following: H, a (C.sub.1-C.sub.4) alkyl, a (C.sub.2-C.sub.4) alkenyl, a phenyl, or a H.sub.2C═C(R.sup.1b)—C(═O)—O—(CH.sub.2).sub.m—, wherein R.sup.1b is H or methyl, and m is an integer from 1 to 4. ##STR00001##

Primer Composition and Methods
20220389236 · 2022-12-08 ·

A one-part primer composition is provided. The one-part primer composition includes a first epoxy resin that is a liquid under ambient conditions a particulate corrosion inhibitor present in an amount of from 5 wt % to 30 wt % relative to the overall weight of the composition excluding carrier solvents and water, a curative comprising a primary aromatic amine, a silane coupling agent, a carrier solvent; and water homogeneously mixed with the carrier solvent and present in an amount sufficient to hydrolyze the silane coupling agent while preserving solubility of the first epoxy resin and curative in the carrier solvent/water mixture. The corrosion inhibitor is pre-dispersed in a liquid epoxy to break the agglomeration of the inhibitors, mitigate settling of the pigment and improve primer performance.

Curable silicone compositions

Curable organopolysiloxane compositions and their cured products with superior properties are described as well as their uses as materials for optical devices, such as LEDs.

Curable silicone compositions

Curable organopolysiloxane compositions and their cured products with superior properties are described as well as their uses as materials for optical devices, such as LEDs.

Curable silicone compositions

Curable organopolysiloxane compositions and their cured products with superior properties are described as well as their uses as materials for optical devices, such as LEDs.

Adhesive composition, protective film and polarizing plate which comprise adhesive layer comprising same, and image display device comprising same

An adhesive composition is provided. The adhesive composition includes a polyvinyl alcohol-based resin; a melamine-based crosslinking agent; an acid catalyst; and a silane-based additive. The weight ratio of the melamine-based crosslinking agent and the acid catalyst is from 5:1 to 1:1. The acid catalyst also has a sulfonic acid group. A protective film and a polarizing plate including an adhesive layer including the adhesive composition, and an image display device including the polarizing plate is also provided.