The present invention pertains to a room-temperature-curable organopolysiloxane composition containing (A) an organopolysiloxane having the hydrolyzable silyl-group-containing monovalent organic group represented by formula (1)

##STR00001## (R.sup.1 represents a substituted or unsubstituted C1-10 alkyl group or a substituted or unsubstituted C6-10 aryl group, R.sup.2 represents a substituted or unsubstituted C1-10 alkyl group or a substituted or unsubstituted C6-10 aryl group, and R.sup.3 represents a substituted or unsubstituted C1-20 alkyl group or a hydrogen atom; M is an integer from 1 to 3, and n is an integer of 2 or more; and the broken line represents atomic bonding), (B) a hydrolyzable organosilane compound and/or a partially hydrolyzed condensate thereof, (C) a curing catalyst, and (F) a bleed oil. According to this configuration, an organotin-compound-free and MEKO-free product is achieved, exceptional fast-curing properties are achieved, and a cured coating film has exceptional rubber strength and exceptional antifouling performance over a long period of time.

The present invention provides a silicone composition for use in a printing plate, the composition including at least: a SiH group-containing compound; a compound represented by the following general formula (I); a compound represented by the following general formula (II); and/or a compound represented by the following general formula (III); wherein Ds in the compound represented by the general formula (I), Gs in the compound represented by the general formula (II) and Js in the compound represented by the general formula (III) each represents an acetoxy group or a dialkyloximino group: A-Si-(D).sub.3 (I) (wherein in the general formula (I), A represents a non-hydrolyzable functional group capable of undergoing a hydrosilylation reaction with a SiH group); E-Si-(G).sub.3 (II) (wherein in the general formula (II), E represents a non-hydrolyzable functional group incapable of undergoing a hydrosilylation reaction with a SiH group); and Si-(J).sub.4 (III). An object of the present invention is to provide a silicone composition for use in a printing plate, for obtaining a planographic printing plate precursor or a planographic printing plate which includes a silicone rubber layer having an excellent adhesion to an underlying layer despite being a fast-curing silicone rubber layer, and which has an excellent ink repellency and scratch resistance.

The present invention provides a silicone composition for use in a printing plate, the composition including at least: a SiH group-containing compound; a compound represented by the following general formula (I); a compound represented by the following general formula (II); and/or a compound represented by the following general formula (III); wherein Ds in the compound represented by the general formula (I), Gs in the compound represented by the general formula (II) and Js in the compound represented by the general formula (III) each represents an acetoxy group or a dialkyloximino group: A-Si-(D).sub.3 (I) (wherein in the general formula (I), A represents a non-hydrolyzable functional group capable of undergoing a hydrosilylation reaction with a SiH group); E-Si-(G).sub.3 (II) (wherein in the general formula (II), E represents a non-hydrolyzable functional group incapable of undergoing a hydrosilylation reaction with a SiH group); and Si-(J).sub.4 (III). An object of the present invention is to provide a silicone composition for use in a printing plate, for obtaining a planographic printing plate precursor or a planographic printing plate which includes a silicone rubber layer having an excellent adhesion to an underlying layer despite being a fast-curing silicone rubber layer, and which has an excellent ink repellency and scratch resistance.

Provided is a thermoplastic polyester resin composition comprising 100 parts by weight of (A) a non-liquid crystal thermoplastic polyester resin, 45 to 150 parts by weight of (B) a thermoplastic resin that is different from the non-liquid crystal thermoplastic polyester resin and has a dielectric loss tangent of not more than 0.005 when measured at a frequency of 5.8 GHz by the cavity resonance perturbation method, 2 to 20 parts by weight of (C) a compatibilizer having at least one reactive functional group selected from epoxy, acid anhydride, oxazoline, isocyanate, and carbodiimide groups, and 0.2 to 5 parts by weight of (D) at least one compound selected from tertiary amines, amidine compounds, organic phosphines and salts thereof, imidazoles, and boron compounds, wherein the ratio of the sum of the thermoplastic resin (B) and the compatibilizer (C) is in the range of 50 to 150 parts by weight and the weight ratio (B)/(C) of the thermoplastic resin (B) to the compatibilizer (C) is in the range of 8 to 50. The thermoplastic polyester resin composition can be molded into an article with low dielectric properties, excellent mechanical properties, and high bondability to metals.

Provided is a thermoplastic polyester resin composition comprising 100 parts by weight of (A) a non-liquid crystal thermoplastic polyester resin, 45 to 150 parts by weight of (B) a thermoplastic resin that is different from the non-liquid crystal thermoplastic polyester resin and has a dielectric loss tangent of not more than 0.005 when measured at a frequency of 5.8 GHz by the cavity resonance perturbation method, 2 to 20 parts by weight of (C) a compatibilizer having at least one reactive functional group selected from epoxy, acid anhydride, oxazoline, isocyanate, and carbodiimide groups, and 0.2 to 5 parts by weight of (D) at least one compound selected from tertiary amines, amidine compounds, organic phosphines and salts thereof, imidazoles, and boron compounds, wherein the ratio of the sum of the thermoplastic resin (B) and the compatibilizer (C) is in the range of 50 to 150 parts by weight and the weight ratio (B)/(C) of the thermoplastic resin (B) to the compatibilizer (C) is in the range of 8 to 50. The thermoplastic polyester resin composition can be molded into an article with low dielectric properties, excellent mechanical properties, and high bondability to metals.

Provided is an organosilicon compound characterized by containing at least one group represented by structural formula (1) in one molecule and having a main chain comprising a silicon-containing organic group. This organosilicon compound exhibits satisfactorily fast curability, and excellent yellowing resistance, heat resistance, storage stability, and safety.

##STR00001##

(In the formula, each R.sup.1 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, each R.sup.2 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, and each R.sup.3 independently represents a hydrogen atom or an unsubstituted or substituted C1-10 alkyl group. m is a number from 1-3, and n is an integer of 2 or greater. A dashed line represents a bond.)

Provided is an organosilicon compound characterized by containing at least one group represented by structural formula (1) in one molecule and having a main chain comprising a silicon-containing organic group. This organosilicon compound exhibits satisfactorily fast curability, and excellent yellowing resistance, heat resistance, storage stability, and safety.

##STR00001##

(In the formula, each R.sup.1 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, each R.sup.2 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, and each R.sup.3 independently represents a hydrogen atom or an unsubstituted or substituted C1-10 alkyl group. m is a number from 1-3, and n is an integer of 2 or greater. A dashed line represents a bond.)

A polyphenylene sulfide resin composition exhibits excellent initial toughness and toughness after a long-term high temperature treatment typified by a tensile elongation at break after a dry heat treatment without impairing mechanical strength, chemical resistance and electrical insulation properties. The polyphenylene sulfide resin composition includes 0.01 to 10 parts by weight of an organosilane compound and 0.01 to 5 parts by weight of a metal salt of phosphorus oxoacid based on 100 parts by weight of a polyphenylene sulfide resin, and a tensile elongation at break, which is measured in accordance with ASTM-D638 under the conditions of a tensile speed of 10 mm/min and an ambient temperature of 23 C. after treating at 200 C. for 500 hours using an ASTM No. 4 dumbbell test piece obtained by injection molding the composition, is 10% or more.

A compound is provided, having the formula (I), wherein R.sub.S is a soft block polymer; wherein each T is independently a urethane or urea linkage; see formulae (A) and (B); wherein each R.sub.D is independently CH.sub.3, CH.sub.2CH.sub.3, CH.sub.2CH.sub.2CH.sub.3, or CH.sub.2CH.sub.2CH.sub.2CH.sub.3; wherein each R.sub.D is independently CH.sub.3, CH.sub.2CH.sub.3, CH.sub.2CH.sub.2CH.sub.3, CH.sub.2CH.sub.2CH.sub.2CH.sub.3, or OR.sub.D; and wherein each p is independently 1, 2, or 3. Compositions containing the compound, and methods of making and using the compound are provided.

##STR00001##

A compound is provided, having the formula (I), wherein R.sub.S is a soft block polymer; wherein each T is independently a urethane or urea linkage; see formulae (A) and (B); wherein each R.sub.D is independently CH.sub.3, CH.sub.2CH.sub.3, CH.sub.2CH.sub.2CH.sub.3, or CH.sub.2CH.sub.2CH.sub.2CH.sub.3; wherein each R.sub.D is independently CH.sub.3, CH.sub.2CH.sub.3, CH.sub.2CH.sub.2CH.sub.3, CH.sub.2CH.sub.2CH.sub.2CH.sub.3, or OR.sub.D; and wherein each p is independently 1, 2, or 3. Compositions containing the compound, and methods of making and using the compound are provided.

##STR00001##