Compositions of curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound, a method for preparing curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound, as well as the use of curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound as a sealant, an adhesive material, a potting compound and/or a coating agent.

An autohesive polymer material that includes: at least one polymer having at least two terminal silyl groups of the Formula (1) given by:
Si(R.sup.1).sub.a(R.sup.2).sub.b  (1).
Each of the radicals R.sup.1 comprises an alkyl, alkenyl or aryl group or a hydrogen atom. Each of the radicals R.sup.2 comprises a group that can be eliminated with water, b is 1, 2 or 3, and a is 3−b. The polymer material further includes at least one condensation catalyst. Further, the polymer material is chemically precrosslinked and further crosslinkable with moisture. In addition, the polymer material is configured for use as a layer body that can be applied to a substrate. The polymer material of this kind can also be used for producing permanent bonds.

An autohesive polymer material that includes: at least one polymer having at least two terminal silyl groups of the Formula (1) given by:
Si(R.sup.1).sub.a(R.sup.2).sub.b  (1).
Each of the radicals R.sup.1 comprises an alkyl, alkenyl or aryl group or a hydrogen atom. Each of the radicals R.sup.2 comprises a group that can be eliminated with water, b is 1, 2 or 3, and a is 3−b. The polymer material further includes at least one condensation catalyst. Further, the polymer material is chemically precrosslinked and further crosslinkable with moisture. In addition, the polymer material is configured for use as a layer body that can be applied to a substrate. The polymer material of this kind can also be used for producing permanent bonds.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses novel polyesteramides comprising cycloalkyl diols and/or cycloalkyl dialkanols with tunable properties based on the monomers and monomerratios used to prepare the polyesteramides and varying the reaction conditions. The present application also discloses compositions and articles.

The present application discloses novel polyesteramides comprising cycloalkyl diols and/or cycloalkyl dialkanols with tunable properties based on the monomers and monomerratios used to prepare the polyesteramides and varying the reaction conditions. The present application also discloses compositions and articles.

A polyphenylene sulfide resin composition exhibits excellent initial toughness and toughness after a long-term high temperature treatment typified by a tensile elongation at break after a dry heat treatment without impairing mechanical strength, chemical resistance and electrical insulation properties. The polyphenylene sulfide resin composition includes 0.01 to 10 parts by weight of an organosilane compound and 0.01 to 5 parts by weight of a metal salt of phosphorus oxoacid based on 100 parts by weight of a polyphenylene sulfide resin, and a tensile elongation at break, which is measured in accordance with ASTM-D638 under the conditions of a tensile speed of 10 mm/min and an ambient temperature of 23° C. after treating at 200° C. for 500 hours using an ASTM No. 4 dumbbell test piece obtained by injection molding the composition, is 10% or more.

Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.

Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.