Patent classifications
C08K5/5465
Silicone formulation comprising an oxime crosslinker, cured silicone formulation and uses thereof
The present invention relates to a silicone formulation comprising an oxime silane crosslinker comprising 2-heptanoneoxime which exhibits significantly improved early cracking behaviour and/or skin formation time compared to silicone formulations employing conventional oxime silane crosslinkers, the corresponding cured silicone formulation, uses of the cured silicone formulation and uses of such oxime crosslinkers in the area of silicone formulations.
Silicone formulation comprising an oxime crosslinker, cured silicone formulation and uses thereof
The present invention relates to a silicone formulation comprising an oxime silane crosslinker comprising 2-heptanoneoxime which exhibits significantly improved early cracking behaviour and/or skin formation time compared to silicone formulations employing conventional oxime silane crosslinkers, the corresponding cured silicone formulation, uses of the cured silicone formulation and uses of such oxime crosslinkers in the area of silicone formulations.
Silicone formulation comprising an oxime crosslinker, cured silicone formulation and uses thereof
The present invention relates to a silicone formulation comprising an oxime silane crosslinker comprising 2-heptanoneoxime which exhibits significantly improved early cracking behaviour and/or skin formation time compared to silicone formulations employing conventional oxime silane crosslinkers, the corresponding cured silicone formulation, uses of the cured silicone formulation and uses of such oxime crosslinkers in the area of silicone formulations.
Ice release coatings
A compound is provided, having the formula (I), wherein R.sub.S is a soft block polymer; wherein each T is independently a urethane or urea linkage; see formulae (A) and (B); wherein each R.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, or —CH.sub.2CH.sub.2CH.sub.2CH.sub.3; wherein each R′.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.2CH.sub.3, or —OR.sub.D; and wherein each p is independently 1, 2, or 3. Compositions containing the compound, and methods of making and using the compound are provided. ##STR00001##
Ice release coatings
A compound is provided, having the formula (I), wherein R.sub.S is a soft block polymer; wherein each T is independently a urethane or urea linkage; see formulae (A) and (B); wherein each R.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, or —CH.sub.2CH.sub.2CH.sub.2CH.sub.3; wherein each R′.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.2CH.sub.3, or —OR.sub.D; and wherein each p is independently 1, 2, or 3. Compositions containing the compound, and methods of making and using the compound are provided. ##STR00001##
Ice release coatings
A compound is provided, having the formula (I), wherein R.sub.S is a soft block polymer; wherein each T is independently a urethane or urea linkage; see formulae (A) and (B); wherein each R.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, or —CH.sub.2CH.sub.2CH.sub.2CH.sub.3; wherein each R′.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.2CH.sub.3, or —OR.sub.D; and wherein each p is independently 1, 2, or 3. Compositions containing the compound, and methods of making and using the compound are provided. ##STR00001##
Condensation curable composition
A moisture-curable composition is shown and described herein. The moisture-curable composition comprises a moisture-curable resin and a moisture scavenger selected from a cyanoalkylalkoxysilane. The inclusion of the cyanoalkylalkoxysilane in the moisture-curable composition has been found to effectively scavenge moisture and control the rate of curing and viscosity increase in the composition.
Condensation curable composition
A moisture-curable composition is shown and described herein. The moisture-curable composition comprises a moisture-curable resin and a moisture scavenger selected from a cyanoalkylalkoxysilane. The inclusion of the cyanoalkylalkoxysilane in the moisture-curable composition has been found to effectively scavenge moisture and control the rate of curing and viscosity increase in the composition.
THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
A thermosetting resin composition, including: a thermosetting resin; a laser direct structuring additive; an inorganic filler; and a coupling agent, wherein the coupling agent contains one or more selected from the group consisting of a triazine functional group-, isocyanate functional group-, isocyanuric acid functional group-, benzotriazole functional group-, acid anhydride functional group-, azasilacyclopentane functional group-, imidazole functional group-, and unsaturated group-containing-silane coupling agent, and is not a mercaptosilane coupling agent, an amino silane coupling agent, or an epoxy silane coupling agent.
THERMOPLASTIC RESIN COMPOSITION
A thermoplastic resin composition comprising a thermoplastic resin (A), a polyarylene ether modified with a functional group (B), a coupling agent (C), and carbon fibers (D).