The invention relates to fluoropolymer filament for use in 3-D printing, and 3-D printed fluoropolymer articles having low warpage, excellent chemical resistance, excellent water resistance, flame resistance, and good mechanical integrity. Additionally, the articles of the invention have good shelf life without the need for special packaging. In particular, the invention relates to filament, 3-D printed polyvinylidene fluoride (PVDF) articles, and in particular material extrusion 3-D printing. The articles may be formed from PVDF homopolymers, copolymers, such as KYNAR® resins from Arkema, as well as polymer blends with appropriately defined low shear melt viscosity. The PVDF may optionally be a filled PVDF formulation. The physical properties of the 3-D printed articles can be maximized and warpage minimized by optimizing processing parameters.

An EVOH resin composition excellent in inorganic compound dispersibility and a method of producing an EVOH resin composition excellent in productivity and inorganic compound dispersibility are provided. The EVOH resin composition contains an EVOH resin (A) and an inorganic compound (B), and has a crystallinity of not lower than 36%. The EVOH resin composition is produced by: feeding an EVOH resin (A), an inorganic compound (B) and water (C) into a kneading apparatus including a screw-type side feeder (3); melt-kneading the resulting EVOH resin mixture while driving the screw-type side feeder (3); and expelling water vapor from the screw-type side feeder (3) to reduce the water content of the EVOH resin mixture to lower than 5 weight % while suppressing leakage of the EVOH resin kneaded body from the screw-type side feeder (3).

A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.

The present invention relates to a thermal insulation coating comprising at least two layers of coating, wherein a composition of the first layer comprises a silicone-based binder and a hollow glass microsphere, a composition of the second layer comprises an acrylic polymer and a hollow glass microsphere. Said thermal insulation coating is suitable for high-temperature applications, capable of adhering to a surface effectively, environmentally friendly, as well as providing high thermal reduction and low thermal conductivity.

The present invention relates to a thermal insulation coating comprising at least two layers of coating, wherein a composition of the first layer comprises a silicone-based binder and a hollow glass microsphere, a composition of the second layer comprises an acrylic polymer and a hollow glass microsphere. Said thermal insulation coating is suitable for high-temperature applications, capable of adhering to a surface effectively, environmentally friendly, as well as providing high thermal reduction and low thermal conductivity.

The invention relates to polymer compositions that contain a thermoplastic molding compound A, at least one reinforcing fiber B and at least one inorganic filler material C, the polymer composition having excellent aesthetic quality after thermoplastic processing. The invention also relates to a process for preparing the claimed composition and to uses thereof.

The invention relates to polymer compositions that contain a thermoplastic molding compound A, at least one reinforcing fiber B and at least one inorganic filler material C, the polymer composition having excellent aesthetic quality after thermoplastic processing. The invention also relates to a process for preparing the claimed composition and to uses thereof.

The invention relates to polymer compositions that contain a thermoplastic molding compound A, at least one reinforcing fiber B and at least one inorganic filler material C, the polymer composition having excellent aesthetic quality after thermoplastic processing. The invention also relates to a process for preparing the claimed composition and to uses thereof.

The present invention relates to a polybutylene terephthalate resin composition comprising 20 to 50 mass % of a polybutylene terephthalate resin (A) having an intrinsic viscosity of 0.60 to 1.0 dl/g, 20 to 45 mass % of a fibrous filler (B), 1 to 20 mass % of a polycarbonate resin (C) having a melt volume rate (MVR) of 30 cm.sup.3/10 min or more, 3 to 20 mass % of a copolymerized polybutylene terephthalate resin (D), and 0 to 20 mass % of an inorganic filler (E) other than the fibrous filler (B). The polybutylene terephthalate resin composition can form a molding that remedies sink marks, maintains high heat deflection temperature, and has excellent appearance.

The present invention relates to a polybutylene terephthalate resin composition comprising 20 to 50 mass % of a polybutylene terephthalate resin (A) having an intrinsic viscosity of 0.60 to 1.0 dl/g, 20 to 45 mass % of a fibrous filler (B), 1 to 20 mass % of a polycarbonate resin (C) having a melt volume rate (MVR) of 30 cm.sup.3/10 min or more, 3 to 20 mass % of a copolymerized polybutylene terephthalate resin (D), and 0 to 20 mass % of an inorganic filler (E) other than the fibrous filler (B). The polybutylene terephthalate resin composition can form a molding that remedies sink marks, maintains high heat deflection temperature, and has excellent appearance.