A method of making a spray-dried laundry detergent particle, wherein the method includes the steps: (a) forming an aqueous laundry detergent slurry, wherein the slurry includes: (i) from 1 wt% to 40 wt% anionic detersive surfactant; (ii) from 0.1 wt% to 3.5 wt% polyepoxy succinic acid polymer; and (iii) from 10 wt% to 80 wt% water, and (b) spray drying the slurry formed in step (a) to form a spray-dried laundry detergent particle.

A method of making a spray-dried laundry detergent particle, wherein the method includes the steps: (a) forming an aqueous laundry detergent slurry, wherein the slurry includes: (i) from 1 wt% to 40 wt% anionic detersive surfactant; (ii) from 0.1 wt% to 3.5 wt% polyepoxy succinic acid polymer; and (iii) from 10 wt% to 80 wt% water, and (b) spray drying the slurry formed in step (a) to form a spray-dried laundry detergent particle.

Catechol metal complex compounds of formula (I) ##STR00001##
are colored and can be used to give color to surfactant compositions. Detergents containing these catechol metal complex compounds do not stain the textile even after repeated use.

Provided are formulations that offer a high cleaning effect on inorganic particles, organic residues, chemical residues, reaction products on the surface due to interaction of the wafer surface with the Chemical Mechanical Planarization (CMP) slurry and elevated levels of undesirable metals on the surface left on the semiconductor devices after the CMP. The post-CMP cleaning formulations comprise one or more organic acid, one or more polymer and a fluoride compound with pH<7 and optionally a surfactant with two sulfonic acid groups.

Provided are formulations that offer a high cleaning effect on inorganic particles, organic residues, chemical residues, reaction products on the surface due to interaction of the wafer surface with the Chemical Mechanical Planarization (CMP) slurry and elevated levels of undesirable metals on the surface left on the semiconductor devices after the CMP. The post-CMP cleaning formulations comprise one or more organic acid, one or more polymer and a fluoride compound with pH<7 and optionally a surfactant with two sulfonic acid groups.

A liquid hand dishwashing cleaning composition having from 15% to 40% by weight of the composition of a surfactant system. The surfactant system has an anionic surfactant and from 5% to 18.4% of a nonionic surfactant package by weight of the composition. The weight ratio of the nonionic surfactant package to the anionic surfactant ranges from 1:1 to 3:1. The nonionic surfactant has a mixture of a first nonionic surfactant and a second nonionic surfactant. The first nonionic surfactant includes an alkyl polyglucoside surfactant. The surfactant system further includes a co-surfactant. The weight ratio of the anionic surfactant to the co-surfactant ranges from 1:1 to 8:1. The composition is free of fatty acid or salts thereof.

Fabric treatment compositions that include benefit agent capsules and biphenyl brightener. Methods of using the same. Wash water that includes such compositions.

The invention relates to solidification of liquid amine oxide, betaine, and/or sultaine surfactants with a binder to form a solidified surfactant composition. In particular, the invention relates to solidification of liquid surfactants utilizing drying device(s), wherein the feed composition contains at least one liquid surfactant and a binder and optional carrier to form a solidified surfactant composition. The solidified surfactant compositions can be useful in various cleaning compositions.

A water-soluble unit dose article comprising a water-soluble film and a detergent composition encapsulated within the water-soluble film, wherein the water-soluble film is a water-soluble polymer and the detergent composition includes a dye fixative, wherein said detergent composition has a neat pH of from 2.5 to 8.4.

Provided are a cleaning agent and a preparation method and the use thereof. The cleaning agent is prepared from the following raw materials comprising the following mass fraction of components: 0.5%-20% of an oxidant containing iodine, 0.5%-20% of an etchant containing boron, 1%-50% of a pyrrolidinone solvent, 1%-20% of a corrosion inhibitor, 0.01%-5% of a metal ion-free surfactant, and water, with the sum of the mass fraction of each component being 100%, the pH of the cleaning agent is 7.5-13.5, and the corrosion inhibitor is one or more of a benzotriazole corrosion inhibitor, a hydrazone corrosion inhibitor, a carbazone corrosion inhibitor and a thiocarbohydrazone corrosion inhibitor. The cleaning agent can efficiently remove nitrides from hard mask residues with little effects on metals and low-κ dielectric materials, and has a good selectivity.