Provided are a coated member in which damage of a coating film can be suppressed in a high temperature environment and the coating may be performed at low cost, and a method of manufacturing the same. A coated member includes a bond coat and a top coat sequentially laminated on a substrate made of a Si-based ceramic or a SiC fiber-reinforced SiC matrix composite, wherein the top coat includes a layer composed of a mixed phase of a (Y.sub.1-aLn.sub.1a).sub.2Si.sub.2O.sub.7 solid solution (here, Ln.sub.1 is any one of Nd, Sm, Eu, and Gd) and Y.sub.2SiO.sub.5 or a (Y.sub.1-bLn.sub.1′.sub.b).sub.2SiO.sub.5 solid solution (here, Ln.sub.1′ is any one of Nd, Sm, Eu, and Gd), or a mixed phase of a (Y.sub.1-cLn.sub.2c).sub.2Si.sub.2O.sub.7 solid solution (here, Ln.sub.2 is any one of Sc, Yb, and Lu) and Y.sub.2SiO.sub.5 or a (Y.sub.1-dLn.sub.2′.sub.d).sub.2SiO.sub.5 solid solution (here, Ln.sub.2′ is any one of Sc, Yb, and Lu).

According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a base material and a ceramic layer located on the base material. The base material includes a first surface, a second surface, and at least one hole extending through the first and second surfaces. The at least one hole includes a first, a second and a third hole part. The first hole part is continuous with the first surface and is oblique. The second hole part is between the second surface and the first hole part. The third hole part is between the first hole part and the second hole part and is oblique. The ceramic layer includes a first part located on the first surface and a second part located on the first hole part.

According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a base material and a ceramic layer located on the base material. The base material includes a first surface, a second surface, and at least one hole extending through the first and second surfaces. The at least one hole includes a first, a second and a third hole part. The first hole part is continuous with the first surface and is oblique. The second hole part is between the second surface and the first hole part. The third hole part is between the first hole part and the second hole part and is oblique. The ceramic layer includes a first part located on the first surface and a second part located on the first hole part.

Thermal barrier coatings consist of a tantala-zirconia mixture that is stabilized with two or more stabilizers. An exemplary thermal barrier coating consists of, by mole percent: about 8% to about 30% YO.sub.1.5; about 8% to about 30% YbO.sub.1.5 or GdO.sub.1.5 or combination thereof; about 8% to about 30% TaO.sub.2.5; about 0% to about 10% HfO.sub.2; and a balance of ZrO.sub.2.

Thermal barrier coatings consist of a tantala-zirconia mixture that is stabilized with two or more stabilizers. An exemplary thermal barrier coating consists of, by mole percent: about 8% to about 30% YO.sub.1.5; about 8% to about 30% YbO.sub.1.5 or GdO.sub.1.5 or combination thereof; about 8% to about 30% TaO.sub.2.5; about 0% to about 10% HfO.sub.2; and a balance of ZrO.sub.2.

A hybrid three-layer system is presented. The hybrid three-layer system includes a two-layer composite system and an additively manufactured third layer comprising a lattice structure. The composite layer system includes a metallic substrate, a structured surface, and a thermal protection system. The structured surface may be additively manufactured onto the metallic substrate and includes structured surface features formed to project above the metallic substrate. Each of the structured surface features are separated from adjacent structured surface features by grooves. The thermal protection coating may be thermally sprayed onto the structured surface and is bonded to each of the structured surface features. The lattice structure is in contact with a surface of the metallic substrate of the composite layer system.

Disclosed herein is a method of manufacturing a plasma-resistant coating film. The method includes (1) forming a lower coating layer through a thermal spray process, on a base member, from a first rare earth metal compound powder including 90 to 99.9 wt % of first rare earth metal compound particles and 0.1 to 10 wt % of silica (SiO.sub.2) particles, (2) processing the surface of the lower coating layer formed in step (1) to have an average surface roughness of 1 to 6 μm, and (3) forming an upper coating layer through a suspension plasma spray process, on the lower coating layer which is surface-treated in step (2), from second rare earth metal compound particles, to obtain a structurally dense and chemically stable plasma-resistant coating film with improved plasma resistance.

Disclosed herein is a method of manufacturing a plasma-resistant coating film. The method includes (1) forming a lower coating layer through a thermal spray process, on a base member, from a first rare earth metal compound powder including 90 to 99.9 wt % of first rare earth metal compound particles and 0.1 to 10 wt % of silica (SiO.sub.2) particles, (2) processing the surface of the lower coating layer formed in step (1) to have an average surface roughness of 1 to 6 μm, and (3) forming an upper coating layer through a suspension plasma spray process, on the lower coating layer which is surface-treated in step (2), from second rare earth metal compound particles, to obtain a structurally dense and chemically stable plasma-resistant coating film with improved plasma resistance.

A component for use in a plasma processing apparatus, which is to be exposed to a plasma, includes a base material, an alumite layer and a thermally sprayed film. The base material has a plurality of through holes and a rough surface at which one end of each of the through holes is opended. The alumite layer is formed on a surface of the base material having the rough surface by an anodic oxidation process. The thermally sprayed film is formed on the rough surface with the alumite layer therebetween.

A component for use in a plasma processing apparatus, which is to be exposed to a plasma, includes a base material, an alumite layer and a thermally sprayed film. The base material has a plurality of through holes and a rough surface at which one end of each of the through holes is opended. The alumite layer is formed on a surface of the base material having the rough surface by an anodic oxidation process. The thermally sprayed film is formed on the rough surface with the alumite layer therebetween.