A method is provided for forming a biphilic surface on a substrate comprising copper, such as a heat exchanger surface, wherein the method involves forming one or more hydrophilic areas on the surface by reacting those areas with at least one of hydrogen peroxide and ammonium hydroxide to form copper oxide and forming hydrophobic areas on the surface by reacting those areas with ammonium hydroxide solution to form copper hydroxide or by chemical etching with a combination of hydrochloric acid, hydrogen peroxide, and iron chloride. The functional surface can exhibit temporal biphilicity in response to one or more stimuli in high performance heat transfer applications.

A method is provided for forming a biphilic surface on a substrate comprising copper, such as a heat exchanger surface, wherein the method involves forming one or more hydrophilic areas on the surface by reacting those areas with at least one of hydrogen peroxide and ammonium hydroxide to form copper oxide and forming hydrophobic areas on the surface by reacting those areas with ammonium hydroxide solution to form copper hydroxide or by chemical etching with a combination of hydrochloric acid, hydrogen peroxide, and iron chloride. The functional surface can exhibit temporal biphilicity in response to one or more stimuli in high performance heat transfer applications.

According to exemplary practice of the present invention, a passivation solution is circulated in a closed loop so as to laminarly flow on a continual basis through the channels of copper-nickel alloy piping or tubing. The passivation solution consists essentially of seawater (natural and/or artificial) plus 0.5 mM nickel hydroxide additive. The cyclical flow of the passivation solution is administered to the piping/tubing for a selected period of time (e.g., seven days), resulting in growth of a corrosion-resistant film on the inside (channel) surfaces of the piping/tubing. The film thus formed consists essentially of nickel hydroxide, nickel oxide, and copper oxide, and represents a durable and effective anti-corrosive barrier when exposed to seawater.

According to exemplary practice of the present invention, a passivation solution is circulated in a closed loop so as to laminarly flow on a continual basis through the channels of copper-nickel alloy piping or tubing. The passivation solution consists essentially of seawater (natural and/or artificial) plus 0.5 mM nickel hydroxide additive. The cyclical flow of the passivation solution is administered to the piping/tubing for a selected period of time (e.g., seven days), resulting in growth of a corrosion-resistant film on the inside (channel) surfaces of the piping/tubing. The film thus formed consists essentially of nickel hydroxide, nickel oxide, and copper oxide, and represents a durable and effective anti-corrosive barrier when exposed to seawater.

A non-provisioned card having a front side and a back side, and at least one visible surface that is patinated or activated to promote patination.

An adhesive (B) of solvent containing adhesive as a suspension of low viscosity is prepared by adding a solvent MIBK to a one-part epoxy adhesive of a dicyandiamide-curable type (A). Metal shaped articles (M1 to M5) as adherends are prepared each of which, through various surface treatment, has specific surface configuration of roughened face and/or ultrafine irregularities and the surface is entirely covered with a thin layer of ceramics such as a metal oxide or metal phosphate. The specified face of each metal shaped article (M1 to M5) is painted with the solvent containing adhesive (B). The faces painted with the adhesive of two metal shaped articles (M1 to M5) are caused to abut each other, the articles are heated to cure the one-epoxy adhesive to accomplish adhesion. With one of the adherends replaced by a CFRP shaped article (P2), a composite of a metal and CFRP can be formed.

There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

An adhesive (B) of solvent containing adhesive as a suspension of low viscosity is prepared by adding a solvent MIBK to a one-part epoxy adhesive of a dicyandiamide-curable type (A). Metal shaped articles (M1 to M5) as adherends are prepared each of which, through various surface treatment, has specific surface configuration of roughened face and/or ultrafine irregularities and the surface is entirely covered with a thin layer of ceramics such as a metal oxide or metal phosphate. The specified face of each metal shaped article (M1 to M5) is painted with the solvent containing adhesive (B). The faces painted with the adhesive of two metal shaped articles (M1 to M5) are caused to abut each other, the articles are heated to cure the one-epoxy adhesive to accomplish adhesion. With one of the adherends replaced by a CFRP shaped article (P2), a composite of a metal and CFRP can be formed.

A non-provisioned card having a front side and a back side, and at least one visible surface that is patinated or activated to promote patination.