Provided are a metal foil, a metal foil manufacturing method and a method for manufacturing an electrode using the same, in which the adhesion between the metal foil and a conductive resin layer and the coating performance of the conductive resin layer can be improved by treating the surface of the metal foil. The metal foil comprises: a metal base substrate; a surface treatment layer formed on at least one surface of the metal base substrate by treating the surface of the metal base substrate; and a conductive resin layer applied to the surface of the surface treatment layer, wherein the surface treatment layer has a surface energy of 34-46 dyne/cm.

The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripper containing same and a method for cleaning a copper substrate. The copper surface passivation composition provides a good copper passivation protection performance, so that the copper surface passivation composition can be used for photoresist removal and copper surface passivation protection in a bumping process of semiconductor back-end packaging with good industrial application prospects and promotion potential in the technical field of microelectronics.

The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripper containing same and a method for cleaning a copper substrate. The copper surface passivation composition provides a good copper passivation protection performance, so that the copper surface passivation composition can be used for photoresist removal and copper surface passivation protection in a bumping process of semiconductor back-end packaging with good industrial application prospects and promotion potential in the technical field of microelectronics.

An interconnected open-pore 2.5D Cu/CuO foam-based photothermal evaporator capable of achieving a high evaporation rate of 4.1 kg m.sup.2 h.sup.1 under one sun illumination by exposing one end of the planar structure to air is disclosed. The micro-sized open-pore structure of Cu/CuO foam allows it to trap incident sunlight, and the densely distributed blade-like CuO nanostructures effectively scatter sunlight inside pores simultaneously. The inherent hydrophilicity of CuO and capillarity forces from the porous structure of Cu foam continuously supply sufficient water. Moreover, the doubled working sides of Cu/CuO foam enlarge the exposure area enabling efficient vapor diffusion. The feasible fabrication process and the combined structural features of Cu/CuO foam offer new insight into the future development of solar-driven evaporators in large-scale applications with practical durability.

An interconnected open-pore 2.5D Cu/CuO foam-based photothermal evaporator capable of achieving a high evaporation rate of 4.1 kg m.sup.2 h.sup.1 under one sun illumination by exposing one end of the planar structure to air is disclosed. The micro-sized open-pore structure of Cu/CuO foam allows it to trap incident sunlight, and the densely distributed blade-like CuO nanostructures effectively scatter sunlight inside pores simultaneously. The inherent hydrophilicity of CuO and capillarity forces from the porous structure of Cu foam continuously supply sufficient water. Moreover, the doubled working sides of Cu/CuO foam enlarge the exposure area enabling efficient vapor diffusion. The feasible fabrication process and the combined structural features of Cu/CuO foam offer new insight into the future development of solar-driven evaporators in large-scale applications with practical durability.