A corrosion-resistant terminal material for an aluminum core wire having a good adhesion of plating and a high effect of corrosion resistant, having a base material in which at least a surface is made of copper or copper alloy and a corrosion-resistant film formed on at least a part of the base material; the corrosion film having an intermediate alloy layer made of tin alloy, a zinc layer made of zinc or zinc alloy formed on the intermediate alloy layer, and a tin-zinc alloy layer made of tin alloy containing zinc and formed on the zinc layer; and a tin content in the intermediate alloy layer is 90 at % or less.

A corrosion-resistant terminal material for an aluminum core wire having a good adhesion of plating and a high effect of corrosion resistant, having a base material in which at least a surface is made of copper or copper alloy and a corrosion-resistant film formed on at least a part of the base material; the corrosion film having an intermediate alloy layer made of tin alloy, a zinc layer made of zinc or zinc alloy formed on the intermediate alloy layer, and a tin-zinc alloy layer made of tin alloy containing zinc and formed on the zinc layer; and a tin content in the intermediate alloy layer is 90 at % or less.

Described herein is an aqueous composition including tin ions and at least one compound of formula I

##STR00001## wherein X.sup.1 is selected from a linear or branched C.sub.1-C.sub.12 alkanediyl, which may optionally be interrupted by O or S or a C.sub.5 to C.sub.12 aromatic moiety, R.sup.11 is a copolymer of ethylene oxide and a further C.sub.3 to C.sub.6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight, R.sup.11 is selected from H, R.sup.11, R.sup.40, R.sup.13, R.sup.14 are (a) independently selected from H, R.sup.11, R.sup.40, or (b) may together form a divalent group X.sup.13; X.sup.13 is selected from a linear or branched C.sub.1-C.sub.12 alkanediyl, which may optionally be interrupted by O, S or NR.sup.43; R.sup.40 is H or a linear or branched C.sub.1-C.sub.20 alkyl, R.sup.43 is selected from H, R.sup.11 and a linear or branched C.sub.1-C.sub.20 alkyl.

This plating liquid contains (A) a soluble salt that contains at least a stannous salt, (B) an acid selected from organic acids and inorganic acids or a salt thereof, and (C) two kinds of surfactants of an amine-based surfactant (C1) and a nonionic surfactant(s) (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant(s) (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropviene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1+n2) is 40-50. In formula (3), (m1+m2) is 15-30 and n is 40-50.

A method for electrodeposition of pure phase crystalline SnSb from deep eutectic ethaline is described. Thin films of SnSb were synthesized using a solution containing equimolar Sn(II) and Sb(III) chlorides as precursors, and ethaline (1:2 by weight of choline chloride and ethylene chloride) was used as the solvent for the electrodeposition solution. The purity of the product is important, as the impure phase is found to be detrimental to the material's lifetime as both a sodium-ion and a lithium-ion anode. For sodium-ions, the directly deposited electrode was able to retain 95% capacity after 300 cycles, and only fall below 80% capacity retention after 800 cycles when cycled versus sodium. The electrodeposited SnSb used as a Li-ion battery anode showed stability, only failing below 80% capacity retention after 400 cycles.

The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.

The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.

A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent, ##STR00001##
here, in the Formula (1), X is C.sub.aH.sub.2a (a is 1 or 3) and m is 2 to 12.

Method of manufacturing a ground apparatus and ground apparatus comprising an aluminum nut (16) having an internal thread and adapted to clamp an eyelet (28) of an electrical conductor on a corresponding contact area of the stud (12), wherein the nut (16) has at least one coating (30) which contains at least zinc, characterized in that the coating further comprises tin, in that the coating consists of an acid tin-zinc electroplating on the aluminum nut (16) and is such that the tin is between 60 and 80% by weight of the coating and the tin-zinc coating forms a layer with an average thickness of from about 5 to 16 microns.

Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing frame may include a rim extending circumferentially about an upper surface of the plating bath vessel and defining a rinsing channel between the rim and the upper surface of the plating bath vessel. The electroplating apparatus may also include a rinsing assembly including a splash guard that is translatable from a recessed first position to a second position extending at least partially across an access to the plating bath vessel. The rinsing assembly may also include a fluid nozzle extending from the rinsing frame.