In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.

In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.

A method for coating metallic surfaces with aqueous compositions, wherein a silane-based aqueous composition containing at least one silane and/or a related silicon-containing compound and optionally additional components is treated further, for example, at temperatures above 70 C., in a pretreatment step without drying the coating, by using at least one aqueous rinse step after this pretreatment step and then performing an electrodeposition coating, in which at least one surfactant is added at least in the last rinse step of the aqueous rinse steps. Coated metallic surfaces are also described.

A method for coating metallic surfaces with aqueous compositions, wherein a silane-based aqueous composition containing at least one silane and/or a related silicon-containing compound and optionally additional components is treated further, for example, at temperatures above 70 C., in a pretreatment step without drying the coating, by using at least one aqueous rinse step after this pretreatment step and then performing an electrodeposition coating, in which at least one surfactant is added at least in the last rinse step of the aqueous rinse steps. Coated metallic surfaces are also described.

A method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core made of aluminum to form a copper plating layer; cutting off part of the plated composite to expose cut surfaces of the core; and turning a part corresponding to the core into a hollow part by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum, thereby producing a hollow structure whose skeletal part is composed of all copper plating layers.

A method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core made of aluminum to form a copper plating layer; cutting off part of the plated composite to expose cut surfaces of the core; and turning a part corresponding to the core into a hollow part by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum, thereby producing a hollow structure whose skeletal part is composed of all copper plating layers.

A method for producing a corrosion resistant metal substrate and corrosion resistant metal substrate provided thereby. The method involves forming a plated substrate including a metal substrate provided with a nickel layer or with a nickel and cobalt layer followed by electrodepositing a molybdenum oxide layer from an aqueous solution onto the plated substrate, which is subsequently subjected to an annealing step in a reducing atmosphere to reduce the molybdenum oxide in the molybdenum oxide layer to molybdenum metal in a reduction annealing step and to form a diffusion layer which contains nickel and molybdenum, and optionally cobalt.

A method for producing a corrosion resistant metal substrate and corrosion resistant metal substrate provided thereby. The method involves forming a plated substrate including a metal substrate provided with a nickel layer or with a nickel and cobalt layer followed by electrodepositing a molybdenum oxide layer from an aqueous solution onto the plated substrate, which is subsequently subjected to an annealing step in a reducing atmosphere to reduce the molybdenum oxide in the molybdenum oxide layer to molybdenum metal in a reduction annealing step and to form a diffusion layer which contains nickel and molybdenum, and optionally cobalt.