A glazing includes at least one transparent substrate comprising a first major surface and an opposing second major surface, wherein said first major surface is coated with an electrically conductive layer and the electrically conductive layer is absent in one or more regions of the first major surface. At least a portion of the one or more regions of the first major surface, and/or corresponding regions of the opposing second major surface, bears a low-emissivity material, and the one or more regions permit the passage of electromagnetic radiation through the glazing.

A glass article having anti-sun properties includes a glass substrate having a stack of layers, which includes, successively from the surface of the substrate: a first module M.sub.1 having a layer based on a dielectric material with a thickness e.sub.1 or of a set of layers, a layer TN.sub.1 including titanium nitride with a thickness of between 2 nanometers and 80 nanometers, a second module M.sub.2 including a layer based on a dielectric material with a thickness e.sub.2 or of a set of layers based on dielectric materials with a cumulative thickness e.sub.2, an intermediate layer including at least one element selected from silicon, aluminum, titanium or a mixture of at least two of these elements is deposited between the layer TN.sub.1 and the first module M.sub.1 and/or between the layer TN.sub.1 and the second module M.sub.2, the intermediate layer having a thickness of between 0.2 nm and 6 nm.

A preparation method for a high-refractive index hydrogenated silicon film, a high-refractive index hydrogenated silicon film, a light filtering lamination and a light filtering piece. The method includes: (a) by magnetic controlled Si target sputtering, Si deposits on a base body, forming a silicon film, which (b) forms an oxygenic hydrogenated silicon film in environment of active hydrogen and active oxygen, the amount of active oxygen accounts for 4%-99% of the total amount of active hydrogen and active oxygen, or, a nitric hydrogenated silicon film in environment of active hydrogen and active nitrogen, the amount of active nitrogen accounts for 5%-20% of the total amount of active hydrogen and active nitrogen. Sputtering and reactions are separately conducted, Si first deposits on the base body by magnetic controlled Si target sputtering, and then plasmas of active hydrogen and active oxygen/nitrogen react with silicon for oxygenic or nitric SiH.

Provided is a chalcogenide glass material having excellent weather resistance and being suitable as an optical element for an infrared sensor. The chalcogenide glass material contains, in terms of % by mole, 20 to 99% Te and has an antireflection film formed thereon.

The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (α) at room temperature falling within a predetermined range, α of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and a of from 32×10.sup.−7 to 45×10.sup.−7 (1/° C.) in which E and α satisfies a predetermined formula, and has a predetermined composition.

A material includes a transparent substrate coated with a stack of thin layers acting on infrared radiation including at least one functional layer. The stack includes a carbon-based upper protective layer within which the carbon atoms are essentially in an sp.sup.2 hybridization state and the upper protective layer is deposited above at least a part of the functional layer and exhibits a thickness of less than 1 nm.

A coated article includes a substrate and a coating over at least a portion of the substrate. The coating includes a first dielectric layer over at least a portion of the substrate; a first metallic layer over at least a portion of the first dielectric layer; a second dielectric layer over at least a portion of the first metallic layer; and an overcoat over at least a portion of the second dielectric layer. A light absorbing layer is between second dielectric layer and the overcoat or is part of the overcoat. The light absorbing layer includes Ge, GeO.sub.x, Hf, HfO.sub.x, HfO.sub.2, NbN.sub.x, NbN.sub.xO.sub.y, Si.sub.aAl.sub.b, Si.sub.aAl.sub.bO.sub.x, Si.sub.aCo.sub.b, Si.sub.aCo.sub.bO.sub.x, Si.sub.aCo.sub.bCu.sub.c, Si.sub.aCo.sub.bCu.sub.cO.sub.x, Si.sub.aCr.sub.b, Si.sub.aCr.sub.bO.sub.x, Si.sub.aNi.sub.b, SiNiO.sub.x, SiO.sub.x, SnN.sub.x, SnO.sub.x, SnO.sub.xN.sub.y, TiN.sub.x, Ti.sub.aNb.sub.bN.sub.x, Ti.sub.aNb.sub.bO.sub.x, Ti.sub.aNb.sub.bO.sub.xN.sub.y, TiO.sub.xN.sub.y, WO.sub.x, WO.sub.2, ZnO:Co, ZnO:Fe, ZnO:Mn, ZnO:Ni, ZnO:V, ZnO:Cr, Zn.sub.aSn.sub.b, Zn.sub.aSn.sub.bO.sub.x, or any combination thereof.

A composite membrane for hydrogen separation and purification, including: a modified and activated support, a Palladium (Pd) layer, and an interstice layer between the second surface-modifying layer and the Pd layer. The support includes a support substrate, a first surface-modifying layer on the support substrate, and a second surface-modifying layer on the first surface-modifying layer.

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a via opening is formed through the core. In an embodiment, the via opening has an aspect ratio (depth:width) that is approximately 5:1 or greater. In an embodiment, the electronic package further comprises a via in the via opening, where the via opening is fully filled.

Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.