A manufacturing method including mounting a ceramic plate on a circuit board such that the ceramic plate can be prevented from falling over. An electronic circuit module manufacturing method includes mounting a ceramic plate including a resin layer on a principal surface of a circuit board in such a manner that a principal surface of the ceramic plate is perpendicular or substantially perpendicular to the principal surface of the circuit board, and removing the resin layer from the principal surface of the ceramic plate mounted on the circuit board. In the step of mounting, the ceramic plate is supported by the resin layer and is thus prevented from falling over.

Methods for repairing a thermal barrier coating deposited on a component with localized spallation of the thermal barrier coating includes depositing a primer slurry on a thermally grown oxide of the component exposed by the localized spallation, depositing a ceramic slurry on the primer slurry, and heating the primer slurry and the ceramic slurry. The primer slurry includes a primer that includes at least one of a metal and a metal oxide. The ceramic slurry includes a ceramic material, a ceramic slurry binder material, and a ceramic slurry fluid carrier. Heating the primer slurry and the ceramic slurry forms a first chemical bond between the primer and the thermally grown oxide and a second chemical bond between the primer and the ceramic material.

A method of metallizing a ceramic substrate includes depositing a barrier layer onto the substrate, depositing a tie layer onto the barrier layer, and depositing a metal layer onto the tie layer to metallize the substrate. The barrier layer may include an oxygen rich material, a nitrogen rich material, or a carbon rich material.

A method of metallizing a ceramic substrate includes depositing a barrier layer onto the substrate, depositing a tie layer onto the barrier layer, and depositing a metal layer onto the tie layer to metallize the substrate. The barrier layer may include an oxygen rich material, a nitrogen rich material, or a carbon rich material.

The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point; a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein heating is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.

A coated tool according to the present disclosure is a coated tool including a base body and a coating film located on the base body. The coated tool has a first surface with a rake face, a second surface with a flank face, and a third surface located between the first surface and the second surface and being a C surface or an R surface. The coating film includes a first coating film located on the first surface and/or a second coating film located on the second surface, and a third coating film located on the third surface. When a wavenumber of a maximum Raman peak of the first coating film is referred to as a first wavenumber, a wavenumber of a maximum Raman peak of the second coating film is referred to as a second wavenumber, and a wavenumber of the maximum Raman peak of the third coating film is referred to as a third wavenumber, the third wavenumber is smaller than the first wavenumber and the second wavenumber.

A method for enhancing metal corrosion resistance of a metal deposited on a substrate is provided. The method includes contacting the metal coated substrate with a treating composition including metal oxide nano-particles. Furthermore, a method for making a mirror comprising a substrate having a metal coated thereon is provided, wherein the method includes contacting the metal coated substrate with a treating composition including metal oxide nano-particles. Preferably, the metal oxide nano-particles are selected from one or more oxides of zinc, iridium, tin, aluminum, cerium, chromium, vanadium, titanium, iron, indium, copper, gold, palladium, platinum, manganese, cobalt, nickel, zirconium, molybdenum, rhodium, silver, indium, wolfram, iridium, lead, bismuth, samarium, erbium, or mixtures of these materials. In addition, products obtainable by these methods are provided.

A method for enhancing metal corrosion resistance of a metal deposited on a substrate is provided. The method includes contacting the metal coated substrate with a treating composition including metal oxide nano-particles. Furthermore, a method for making a mirror comprising a substrate having a metal coated thereon is provided, wherein the method includes contacting the metal coated substrate with a treating composition including metal oxide nano-particles. Preferably, the metal oxide nano-particles are selected from one or more oxides of zinc, iridium, tin, aluminum, cerium, chromium, vanadium, titanium, iron, indium, copper, gold, palladium, platinum, manganese, cobalt, nickel, zirconium, molybdenum, rhodium, silver, indium, wolfram, iridium, lead, bismuth, samarium, erbium, or mixtures of these materials. In addition, products obtainable by these methods are provided.

An insert includes a cBN sintered compact including cBN particles and a binder phase binding the cBN particles. The cBN particles occupy 60% or more of the cross-sectional area of the cBN sintered compact. The binder phase contains Al compound particles containing at least one of AlN or Al.sub.2O.sub.3. A particle distribution of the Al compound particles in a cumulative distribution based on the number of the Al compound particles in a cross section of the cBN sintered compact is as follows. The proportion of the Al compound particles with the particle diameter of 0.3 ?m or larger is 5% or more, and the proportion of the Al compound particles with the particle diameter of 0.5 ?m or larger is less than 5%.

A method of making a titanium dioxide nanowire array includes contacting a substrate with a solvent comprising a titanium (III) precursor, an acid, and an oxidant while microwave heating the solvent, thereby forming a hydrogen titanate H2Ti2O5.H2O nanowire array. The hydrogen titanate nanowire array is annealed to form a titanium dioxide nanowire array. The substrate is seeded with titanium dioxide before starting the hydrothermal synthesis of the hydrogen titanate nanowire array. The titanium dioxide nanowire array is loaded with a platinum group metal to form an exhaust gas catalyst. The titanium dioxide nanowire array can be used to catalyze oxidation of combustion exhaust.