An encapsulation resin composition is used to hermetically seal a gap between a base member and a semiconductor chip bonded onto the base member. The encapsulation resin composition has a reaction start temperature of 160° C. or less. A melt viscosity of the encapsulation resin composition is 200 Pa.Math.s or less at the reaction start temperature, 400 Pa.Math.s or less at any temperature which is equal to or higher than a temperature lower by 40° C. than the reaction start temperature and which is equal to or lower than the reaction start temperature, and 1,000 Pa.Math.s or less at a temperature lower by 50° C. than the reaction start temperature.

An aqueous coating composition is provided that is preferably substantially free of bisphenol A. The coating composition is preferably a latex-based coating composition that includes a latex polymer formed from ingredients including an anionic and/or zwitterionic surfactant that includes one or more acid groups neutralized with a metallic base. The coating composition is useful in coating metal substrates such as, for example, interior and/or exterior surfaces of food or beverage containers.

A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise 10-40 wt % of a mono-functional monomer of formula (1), with R1 being H or C.sub.1-C.sub.6 alkyl, and R2 and R3 being one or more substitutions of C.sub.1-C.sub.10 alkyl or alkyl-aryl, and R4, R5 being H or C.sub.1-C.sub.10 alkyl, ##STR00001##
The photocurable composition can have a viscosity of not greater than 15 mPa.Math.s, and a photo-cured layer of the photocurable composition can have a low thermal shrinkage if subjected to a high temperature baking treatment, and a carbon content of at least 74%.

A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise 10-40 wt % of a mono-functional monomer of formula (1), with R1 being H or C.sub.1-C.sub.6 alkyl, and R2 and R3 being one or more substitutions of C.sub.1-C.sub.10 alkyl or alkyl-aryl, and R4, R5 being H or C.sub.1-C.sub.10 alkyl, ##STR00001##
The photocurable composition can have a viscosity of not greater than 15 mPa.Math.s, and a photo-cured layer of the photocurable composition can have a low thermal shrinkage if subjected to a high temperature baking treatment, and a carbon content of at least 74%.

A method is for manufacturing a laminated steel sheet comprising laminated a predetermined number of thin steel sheets formed by punching a belt-shaped thin steel sheet into a predetermined shape. This method includes the following steps 1 to 3: step 1: a step of sequentially punching the thin steel sheet into a predetermined shape with a metallic die; step 2: a step of applying a curable composition to a predetermined portion of the thin steel sheet; and step 3: a step of irradiating the curable composition with energy rays. The curable composition is a delayed curable composition which is cured after a lapse of a predetermined time after being irradiated with energy rays.

A method is for manufacturing a laminated steel sheet comprising laminated a predetermined number of thin steel sheets formed by punching a belt-shaped thin steel sheet into a predetermined shape. This method includes the following steps 1 to 3: step 1: a step of sequentially punching the thin steel sheet into a predetermined shape with a metallic die; step 2: a step of applying a curable composition to a predetermined portion of the thin steel sheet; and step 3: a step of irradiating the curable composition with energy rays. The curable composition is a delayed curable composition which is cured after a lapse of a predetermined time after being irradiated with energy rays.

Provided is an optical film which has a maximum absorption at a wavelength in the range of 600 to 680 nm, has a high dichroic ratio, and is excellent in light resistance. The optical film includes: a polymer of a polymerizable liquid crystal compound; and a compound represented by the following general formula (1).

##STR00001##

The present invention relates to a composition for a display sealing material having a photopolymerization initiator and a photocurable monomer, the photocurable monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups of chemical formula 1, wherein about 5 wt % to about 45 wt % of the monomer having two or more substituted or unsubstituted phenyl groups is comprised on the basis of the photocurable monomer and about 55 wt % to about 95 wt % of the monomer not having the aromatic hydrocarbon group is comprised on the basis of the photocurable monomer.

The present invention relates to a composition for a display sealing material having a photopolymerization initiator and a photocurable monomer, the photocurable monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups of chemical formula 1, wherein about 5 wt % to about 45 wt % of the monomer having two or more substituted or unsubstituted phenyl groups is comprised on the basis of the photocurable monomer and about 55 wt % to about 95 wt % of the monomer not having the aromatic hydrocarbon group is comprised on the basis of the photocurable monomer.

Provided are a photocurable composition for imprints, having good releasability and temporal stability of the releasability, a pattern forming method, and a method for manufacturing a device.

This photocurable composition for imprints includes a monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom, a bifunctional or higher polyfunctional (meth)acrylate (A2) not containing a fluorine atom, a monofunctional (meth)acrylate (B) containing a fluorine atom, and a photopolymerization initiator (C), in which the monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom has a boiling point of 100° C. to 200° C. at a pressure of 0.67 kPa, and the monofunctional (meth)acrylate (B) containing a fluorine atom has a boiling point of 100° C. to 200° C. at a pressure of 0.67 kPa.