Disclosed herein are a polyimide film for graphite sheets, a method of fabricating the same, and a graphite sheet fabricated using the same. The polyimide film is fabricated by imidizing a polyamic acid formed by reaction between a dianhydride monomer and a diamine monomer, wherein the reaction is carried out in the presence of particles of a metal compound having an average particle diameter (D.sub.50) of about 1 μm to about 6 μm.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

A polymer-dispersed liquid crystal composition, a preparation method of a polymer-dispersed liquid crystal film, and a display panel are provided. The polymer-dispersed liquid crystal composition includes a prepolymer and a liquid crystal molecule, wherein the prepolymer is a fluorine-containing polyimide precursor chemically bonded to a polyaniline, including a polycondensation unit formed from a fluorine-containing dianhydride monomer and a fluorine-containing diamine monomer. In the present application, the conductive polyaniline is chemically bonded to the fluorine-containing polyimide precursor to increase the conductivity of the polyimide precursor. Further, a polymer-dispersed liquid crystal film having a driving voltage lower than 30 V and excellent insulating property and radiation resistance is obtained.

A reactive oligomer has a backbone derived from at least one of polyamideimide, polyimide, polyetherimide, polyaryletherketone, polyethersulfone, polyphenylene sulfide, polyamide, polyester, polyarylate, polyesteramide, polycarbonate, polybenzoxazole or polybenzimidazole and functionalized with at least one unreacted functional group capable of thermal chain extension and crosslinking after formation of the reactive oligomer, wherein the reactive oligomer has an M.sub.n of about 250 to about 10,000 g/mol, calculated using the Carothers equation. Compositions comprising the reactive oligomer have at least one other component that includes a second reactive oligomer, an oligomer lacking unreacted functional groups capable of thermal chain extension and crosslinking, a thermoplastic polymer, a thermoplastic polymer having the same backbone repeat units as the reactive oligomer, a filler, or an additive. A method of manufacture of an article comprises heating a composition comprising the reactive oligomer at a sufficient temperature and time to shape and crosslink the reactive oligomer, including additive manufacturing.

A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dissipation factor, X-axis coefficient of thermal expansion, copper foil peeling strength, varnish precipitation property and resin compatibility.

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The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. ##STR00001##
(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)

The present invention relates to a liquid crystal alignment composition comprising first liquid crystal alignment polymer; second liquid crystal alignment polymer; and a cross-linking agent compound, a method for preparing a liquid crystal alignment film using the same, a liquid crystal alignment film and a liquid crystal display using the same.

Disclosed herein is provided a method for manufacturing a polyimide film, the method comprising the steps of: preparing a polyamic acid solution; preparing a polyamic add composition by adding 2-3 mole equivalents of a dehydrating agent to the polyamic acid solution; and applying the polyamic acid to a support to form a film, followed by thermosetting the film in a heater.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The present invention provides a polyimide composite having material properties suitable for preparing a polyimide film having high transmittance, high stability, and a good mechanical property, so that it can be used as a substrate material of an organic light-emitting diode (OLED), an encapsulating film material, and so on, but are not limited thereto. The polyimide composite has a molecular structural formula as follow:

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