Embodiments provide methods for assembling an apparel product. The methods include applying a composition to a portion of a major component of the apparel product or a portion of a minor component of the apparel product. The methods include coupling the portion of the minor component with the portion of the major component via the composition. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with an adhesive. The major component and/or minor component includes a recyclable material. The methods include converting the composition to the adhesive. The adhesive includes a material having a cycloalkene bond.

The present invention relates to an ink composition, a kit comprising components of the ink composition, a method of manufacturing a deformable conductor utilizing the ink composition, a deformable conductor obtainable by the method, an electronic device, in particular a wearable and/or stretchable electronic device, comprising the deformable conductor, a method of manufactuing a conductor, a conductor obtainable by the method and an electronic device comprising the conductor. The ink composition comprises a source of transition metal ions, a reducing agent and a polymer and/or a polymer precursor, the polymer precursor comprising a polymerizable terminal multiple bond. The method of manufacturing a deformable conductor comprises the steps of applying the ink composition on at least a part of a surface of a deformable substrate and thermally treating and/or irradiating the ink composition.

A coating composition may include a modified polyvinyl alcohol resin (A) having an ethylene unsaturated group in a side chain thereof. Examples of the modified polyvinyl alcohol resin (A) include those including a structural unit represented by formula (II) or (III). Substrates in various technical fields such as the resin molding field, automobile/railway/aircraft/ships-related field, medical product field, food field, agriculture/gardening field, electrical field, and construction field can be coated with such a coating composition.

The present disclosure relates to an antimicrobial coating on a surface, a method for preparing and uses of the same. In particular it relates to a process for preparing an antimicrobial coating on a surface, the process comprising the steps of: a) providing a surface; b) coating a metal oxide or a metal hydroxide on the surface in the presence of a solvent in a hydrothermal synthesis step to form a coated surface having a plurality of nanostructures; c) optionally drying the coated surface, wherein said nanostructure is preferably in nanopillar structure. The coating of the present application exhibits excellent antimicrobial activity against different types of microorganism, such as bacteria and yeast. The nanostructures are able to exert stress to the microorganism, and therefore controlling or killing them.

The present invention relates to methods and articles for wound healing involving the use of a material having antimicrobial properties, said material comprising a synergistic combination of at least two metal oxide powders, comprising a mixed oxidation state oxide of a first metal and a single oxidation state oxide of a second metal, wherein the mixed oxidation state oxide constitutes from about 0.05% to about 15% wt. of the total weight of the synergistic combination of the at least two metal oxide powders and wherein the ions of the metal powders are in ionic contact upon exposure of said material to moisture.

The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 40% by mass and less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

A paint system contains an anti-fouling metal oxide and a fumed silica, wherein the fumed silica has a BET surface area of 150 to 400 m.sup.2/g, a tamped density of 100 to 300 g/l, and a thickening of less than 500 mPas, in which the percentage by weight of silica≤the percentage by weight of the metal and/or oxide thereof, based on the total weight of the paint system. The paint system also contains at least one water-binding organic and/or inorganic filler.

A flowable liquid formulation for 3D printing is described. The formulation comprises from 0.1 to 25 wt. % radiopaque particles, wherein at least 50% by weight of the particles have a diameter of at most 100 nm. The formulation further comprises monomeric, oligomeric and/or polymeric precursors adapted for polymerization to form a solidified article. Also described is an article (100) formed by 3D printing, the article (100) comprising a first 3D printed region (110) having a first radiopacity and a second 3D printed region (120) having a second radiopacity, wherein the first radiopacity is greater than the second radiopacity. Also described is a method of forming the article (100).

The present invention relates to a molded article with a metallic appearance and a process for making the same. Particularly, the present invention relates to a molded article having a part that comprises a layer with a sandwich structure.

The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused.