A polyvinyl chloride composition for powder molding includes a polyvinyl chloride (A) an amount of 100 parts by mass, a plasticizer in an amount of 110 parts by mass or more and 150 parts by mass or less, and an acrylic polymer in an amount of 4 parts by mass or more and 23 parts by mass or less. The polyvinyl chloride (A) has an average particle diameter of 50 μm or more and 500 μm or less and an average degree of polymerization of 1,350 or more. The acrylic polymer has an average particle diameter of 0.01 μm or more and 10 μm or less and contains a constitutional unit derived from a (meth) acrylic ester in an amount of 50 mass % or more.

A resin composition that is laser-weldable under broad conditions of laser irradiation. A formed article formed of the resin composition. A kit for Galvano-scanning laser welding with a transmissive resin composition and a light-absorptive resin composition. A car-borne camera component formed of the resin composition. A car-borne camera module with the car-borne camera component. A UV exposed article formed of the resin composition. A method for manufacturing a formed article by welding a transmissive resin member and an absorptive resin member by Galvano-scanning laser welding. The resin composition for Galvano-scanning laser welding, contains 0.1 to 20 parts by mass of a reactive compound, per 100 parts by mass of a thermoplastic resin.

A resin composition that is laser-weldable under broad conditions of laser irradiation. A formed article formed of the resin composition. A kit for Galvano-scanning laser welding with a transmissive resin composition and a light-absorptive resin composition. A car-borne camera component formed of the resin composition. A car-borne camera module with the car-borne camera component. A UV exposed article formed of the resin composition. A method for manufacturing a formed article by welding a transmissive resin member and an absorptive resin member by Galvano-scanning laser welding. The resin composition for Galvano-scanning laser welding, contains 0.1 to 20 parts by mass of a reactive compound, per 100 parts by mass of a thermoplastic resin.

A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present invention can be suitably used as a vibration-damping material for a material for audio equipment such as, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.

A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present invention can be suitably used as a vibration-damping material for a material for audio equipment such as, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.

Provided are a pressure-sensitive adhesive composition, an optical member, a polarizing plate and a display device. The pressure-sensitive adhesive composition having physical properties required for an optical member using a particular block copolymer and an antioxidant or a photostabilizer, which forms a fine phase change region in a crosslinking structure, and particularly having excellent bending preventability and storage stability may be provided. Such a pressure-sensitive adhesive composition may be used for optical uses, for example, to laminate various optical members, or apply an optical member to a display device.

Provided are a pressure-sensitive adhesive composition, an optical member, a polarizing plate and a display device. The pressure-sensitive adhesive composition having physical properties required for an optical member using a particular block copolymer and an antioxidant or a photostabilizer, which forms a fine phase change region in a crosslinking structure, and particularly having excellent bending preventability and storage stability may be provided. Such a pressure-sensitive adhesive composition may be used for optical uses, for example, to laminate various optical members, or apply an optical member to a display device.

Stabilizer compositions for stabilizing materials against degradation due to thermal and ultraviolet light exposure are disclosed herein. In some instances, the stabilizer compositions include an ortho-hydroxyl tris-aryl-s-triazine compound; a hindered amine light stabilizer compound; a hindered hydroxybenzoate compound; a phosphite compound, an acid scavenger and/or thioester; and a hindered phenol antioxidant compound.

Stabilizer compositions for stabilizing materials against degradation due to thermal and ultraviolet light exposure are disclosed herein. In some instances, the stabilizer compositions include an ortho-hydroxyl tris-aryl-s-triazine compound; a hindered amine light stabilizer compound; a hindered hydroxybenzoate compound; a phosphite compound, an acid scavenger and/or thioester; and a hindered phenol antioxidant compound.

Moisture curable compositions having a low modulus and a high resilience are prepared by curing a composition containing a first polymer which predominately contains two moisture-curable silyl groups, and a second polymer which is terminated by an alkoxy group and contains but a single moisture-curable silyl group, or a hydroxyl group.