The present invention relates to flame retardant polyamide-based compositions or moulding materials and to articles of manufacture of the electricals or electronics industries producible therefrom, in particular charging components, containing at least one polyamide, aluminium oxide, magnesium hydroxide and at least one organic epoxide.

In an embodiment, a method for the manufacture of an injection molded article in an injection mold comprises at least one flow length of at least 50 cm, the flow length being defined as the shortest distance between a point of injection in the mold and an inner mold wall, the method comprising injection molding a polycarbonate composition comprising an aromatic polycarbonate, from 0.01 wt. % to 0.30 wt. % based on the weight of the polycarbonate composition of an epoxy additive having at least two epoxy groups per molecule, and from 0.01 wt. % to 0.30 wt. % based on the weight of the polycarbonate composition of a phenolic diphosphite derived from pentaerythritol.

In an embodiment, a method for the manufacture of an injection molded article in an injection mold comprises at least one flow length of at least 50 cm, the flow length being defined as the shortest distance between a point of injection in the mold and an inner mold wall, the method comprising injection molding a polycarbonate composition comprising an aromatic polycarbonate, from 0.01 wt. % to 0.30 wt. % based on the weight of the polycarbonate composition of an epoxy additive having at least two epoxy groups per molecule, and from 0.01 wt. % to 0.30 wt. % based on the weight of the polycarbonate composition of a phenolic diphosphite derived from pentaerythritol.

In an embodiment, a method for the manufacture of an injection molded article in an injection mold comprises at least one flow length of at least 50 cm, the flow length being defined as the shortest distance between a point of injection in the mold and an inner mold wall, the method comprising injection molding a polycarbonate composition comprising an aromatic polycarbonate, from 0.01 wt. % to 0.30 wt. % based on the weight of the polycarbonate composition of an epoxy additive having at least two epoxy groups per molecule, and from 0.01 wt. % to 0.30 wt. % based on the weight of the polycarbonate composition of a phenolic diphosphite derived from pentaerythritol.

Provided is an aromatic polycarbonate resin composition, including, with respect to 100 parts by mass of an aromatic polycarbonate resin (A), 0.01 part by mass to 0.1 part by mass of an alicyclic epoxy compound (B), 0.2 part by mass to 0.6 part by mass of a polyether compound (C) having a polyoxyalkylene structure, and 0.005 part by mass to 1 part by mass of a phosphorus-based compound (D), wherein a difference between a YI value of a 5-millimeter thick molded body, which is obtained by molding the aromatic polycarbonate resin composition at 320° C., after a lapse of 3,000 hours under an environment at 85° C. and a humidity of 85%, and an initial YI value thereof is 3.0 or less.

Provided is an aromatic polycarbonate resin composition, including, with respect to 100 parts by mass of an aromatic polycarbonate resin (A), 0.01 part by mass to 0.1 part by mass of an alicyclic epoxy compound (B), 0.2 part by mass to 0.6 part by mass of a polyether compound (C) having a polyoxyalkylene structure, and 0.005 part by mass to 1 part by mass of a phosphorus-based compound (D), wherein a difference between a YI value of a 5-millimeter thick molded body, which is obtained by molding the aromatic polycarbonate resin composition at 320° C., after a lapse of 3,000 hours under an environment at 85° C. and a humidity of 85%, and an initial YI value thereof is 3.0 or less.

Provided is an aromatic polycarbonate resin composition, including, with respect to 100 parts by mass of an aromatic polycarbonate resin (A), 0.01 part by mass to 0.1 part by mass of an alicyclic epoxy compound (B), 0.2 part by mass to 0.6 part by mass of a polyether compound (C) having a polyoxyalkylene structure, and 0.005 part by mass to 1 part by mass of a phosphorus-based compound (D), wherein a difference between a YI value of a 5-millimeter thick molded body, which is obtained by molding the aromatic polycarbonate resin composition at 320° C., after a lapse of 3,000 hours under an environment at 85° C. and a humidity of 85%, and an initial YI value thereof is 3.0 or less.

A sheet molding compound resin composition containing a thermosetting resin (A), a resin-curing agent (B), and a glycidyl ether (C) including an alkyl group having a carbon atom number of 7 to 14 and a glycidyl group is provided. The sheet molding compound resin composition can be favorably used for a sheet molding compound and a molded article of the sheet molding compound as a result of having excellent impregnating ability with respect to carbon fiber regardless of the resin viscosity.

A sheet molding compound resin composition containing a thermosetting resin (A), a resin-curing agent (B), and a glycidyl ether (C) including an alkyl group having a carbon atom number of 7 to 14 and a glycidyl group is provided. The sheet molding compound resin composition can be favorably used for a sheet molding compound and a molded article of the sheet molding compound as a result of having excellent impregnating ability with respect to carbon fiber regardless of the resin viscosity.

The present invention provides an acrylic damping adhesive. The acrylic damping adhesive comprises a crosslinked structure of a carboxy-containing acrylic polymer with a glass transition temperature less than or equal to −20° C. and a carboxy-containing acrylic polymer with a glass transition temperature ranging from 20° C. to 50° C. The acrylic damping adhesive according to technical solutions of the present invention exhibits double damping peaks in a rheological curve, and thus has a wider damping temperature range (the damping temperature range is greater than or equal to 50° C., and preferably greater than or equal to 90° C.), a higher frequency response of damping, and higher system stability.