A polycarbonate resin composition containing 0.1 to 10 parts by mass of a polycarbonate copolymer (B) having carbonate bonding between (B1) bisphenol A and a (B2) polyalkylene glycol and 0.005 to 0.5 parts by mass of a phosphorus-containing stabilizer (C) relative to 100 parts by mass of a polycarbonate resin (A).

A polycarbonate resin composition containing 0.1 to 10 parts by mass of a polycarbonate copolymer (B) having carbonate bonding between (B1) bisphenol A and a (B2) polyalkylene glycol and 0.005 to 0.5 parts by mass of a phosphorus-containing stabilizer (C) relative to 100 parts by mass of a polycarbonate resin (A).

A polycarbonate resin composition pellet contains a polycarbonate resin (A), an aromatic compound (B) represented by general formula (1) below, and a phosphorus-based stabilizer (C), the aromatic compound (B) being contained in the pellet in an amount of 0.001% to 1% by mass, the phosphorus-based stabilizer (C) being contained in the pellet in an amount of 0.003% to 0.5% by mass:

##STR00001##

(where Y is a hydrogen atom or an organic group that does not contain any of nitrogen, sulfur, and halogen elements, when Y is a hydrogen atom, X is an alkyl group or an optionally substituted aryl group, when Y is an organic group, X is an organic group that does not contain any of nitrogen, sulfur, and halogen elements, g is 1 or 2, n is 0 to 5, k is 1 to 4, and k+n is 6 or less.)

A polycarbonate resin composition pellet contains a polycarbonate resin (A), an aromatic compound (B) represented by general formula (1) below, and a phosphorus-based stabilizer (C), the aromatic compound (B) being contained in the pellet in an amount of 0.001% to 1% by mass, the phosphorus-based stabilizer (C) being contained in the pellet in an amount of 0.003% to 0.5% by mass:

##STR00001##

(where Y is a hydrogen atom or an organic group that does not contain any of nitrogen, sulfur, and halogen elements, when Y is a hydrogen atom, X is an alkyl group or an optionally substituted aryl group, when Y is an organic group, X is an organic group that does not contain any of nitrogen, sulfur, and halogen elements, g is 1 or 2, n is 0 to 5, k is 1 to 4, and k+n is 6 or less.)

An adhesive composition including a first epoxy-based compound, a second epoxy-based compound, an oxetane compound, and a diacrylate-based compound is provided. A polarizing plate includes a polarizer, an adhesive layer provided on at least one surface of the polarizer and formed using the adhesive composition, and a protective film provided on at least one surface of the adhesive layer. An image display device using the polarizing plate is also provided.

The present disclosure provides a hard-coating resin composition for a hard-coating having easy processability, flexibility and high surface hardness suitable for a hard-coating agent, in which a siloxane molecule having an inorganic material characteristic is chemically bonded with an epoxy group having an organic material characteristic to form one molecule, and the siloxane molecule is made to contain a various molecular weight distribution for dense crosslinking during polymerization of the epoxy group in order to obtain high surface hardness due to the inorganic material.

The present disclosure provides a hard-coating resin composition for a hard-coating having easy processability, flexibility and high surface hardness suitable for a hard-coating agent, in which a siloxane molecule having an inorganic material characteristic is chemically bonded with an epoxy group having an organic material characteristic to form one molecule, and the siloxane molecule is made to contain a various molecular weight distribution for dense crosslinking during polymerization of the epoxy group in order to obtain high surface hardness due to the inorganic material.

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and has excellent adhesion reliability.

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and has excellent adhesion reliability.

A biodegradable cellulose fiber-based substrate, at least one side of which is coated with a release coating including: a) at least one water-soluble polymer (WSP) containing hydroxyl groups, and b) at least one lactone substituted with at least one linear or branched and/or cyclic C.sub.8-C.sub.30 hydrocarbon chain which may contain heteroatoms. The biodegradable substrate is certified biodegradable in accordance with EN 13432. A method of production thereof is also disclosed.