Patent classifications
C08K5/1525
Cellulose fiber-based substrate, its manufacturing process and use as masking tape
A cellulose fiber-based substrate, at least one side of which is coated with an aqueous mixture composed of: a) at least one water-soluble polymer (WSP) containing hydroxyl groups, b) at least one lactone substituted with at least one linear or branched and/or cyclic C.sub.8-C.sub.30 hydrocarbon chain which may contain heteroatoms, c) at least one crosslinking agent. A method of production and use thereof.
Cellulose fiber-based substrate, its manufacturing process and use as masking tape
A cellulose fiber-based substrate, at least one side of which is coated with an aqueous mixture composed of: a) at least one water-soluble polymer (WSP) containing hydroxyl groups, b) at least one lactone substituted with at least one linear or branched and/or cyclic C.sub.8-C.sub.30 hydrocarbon chain which may contain heteroatoms, c) at least one crosslinking agent. A method of production and use thereof.
RELEASE AGENT FOR REACTIVE HOT MELT RESIN
The present invention provides a release agent for a reactive hot melt resin, wherein a dispersion term (D) in the Hansen solubility parameters falls within the range of 14.0 to 21.0 MPa.sup.0.5, a dipole interaction force term (P) falls within the range of 0 to 10.5 MPa.sup.0.5, and a hydrogen bond term (H) falls within the range of 0 to 13.5 MPa.sup.0.5. Preferably, the adhesive for a reactive hot melt resin is at least one type of solvent selected from a group consisting of benzoic acid esters, tetrahydrofurfuryl alcohol, and tetrahydrofurfuryl (meth)acrylate. The reactive hot melt resin preferably contains an urethane prepolymer having an isocyanate group, and the urethane bond content in the urethane prepolymer is preferably within the range of 0.1 to 3 mol/kg.
RELEASE AGENT FOR REACTIVE HOT MELT RESIN
The present invention provides a release agent for a reactive hot melt resin, wherein a dispersion term (D) in the Hansen solubility parameters falls within the range of 14.0 to 21.0 MPa.sup.0.5, a dipole interaction force term (P) falls within the range of 0 to 10.5 MPa.sup.0.5, and a hydrogen bond term (H) falls within the range of 0 to 13.5 MPa.sup.0.5. Preferably, the adhesive for a reactive hot melt resin is at least one type of solvent selected from a group consisting of benzoic acid esters, tetrahydrofurfuryl alcohol, and tetrahydrofurfuryl (meth)acrylate. The reactive hot melt resin preferably contains an urethane prepolymer having an isocyanate group, and the urethane bond content in the urethane prepolymer is preferably within the range of 0.1 to 3 mol/kg.
CELLULOSE DERIVED HYDROPHOBIC, BIO-DEGRADABLE FILMS FOR MULCH & OTHER APPLICATIONS
The present invention describes synthesis and properties of cellulose based biodegradable hydrophobic mulch film for agricultural applications. The invented method can also be used to obtain an highly hydrophobic mulch film. Cellulose, the most abundant natural polymer is chemically modified to make bio-degradable, mulch films that are partially air permeable but water impermeable. The water impermeability can be changed by varying the processing conditions. The film can be multi-functional; that is besides providing the water impermeability the film can also be customized to adjust the pH of soil and to deliver herbicides or fertilizers to the soil. Other lignocellulosic materials or different combinations of synthetic fibers, fabrics or polymers and cellulose materials including newsprint can also be used to make the biodegradable hydrophobic film. Additionally, the invention can be used to make biodegradable extremely hydrophobic self-cleaning products for other hydrophobic applications such as packaging materials or disposable water-proof clothing.
ENCAPSULATING COMPOSITION
The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and has excellent adhesion reliability.
ENCAPSULATING COMPOSITION
The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and has excellent adhesion reliability.
Impregnating resin, conductor arrangement, electrical coil and electrical machine
An impregnating resin, e.g., a catalytically hardenable impregnating resin for the conductor of an electrical machine, may include at least one reactive resin mixed with at least one reactive diluent and a hardening catalyst, e.g., for cationic, anionic or coordinate polymerization of the impregnating resin. The properties of the impregnating resin or use thereof may be improved by virtue of the reactive diluent containing a heterocyclic four-membered ring. The impregnating resin may be part of a main insulation of a conductor arrangement, which may in turn be installed in an electrical coil or other electrical machine.
WATER- AND OIL-REPELLENT AGENT
A water- and oil-repellent agent including: a polysaccharide; and a sizing agent, wherein the polysaccharide exhibits a viscosity of 60 cps or less at 50 C. in a 20 mass % aqueous solution.
WATER- AND OIL-REPELLENT AGENT
A water- and oil-repellent agent including: a polysaccharide; and a sizing agent, wherein the polysaccharide exhibits a viscosity of 60 cps or less at 50 C. in a 20 mass % aqueous solution.