Disclosed are new zwitterionic compounds having a bridge moiety, an electron accepter moiety, and an electron donor moiety. The bridge moiety is covalently bonded to both the electron accepter moiety and to the electron donor moiety. The bridge moiety includes one selected from xanthene and thioxanthene, and the accepter moiety includes a pyridinium moiety, and the donor moiety includes a malononitrile moiety.

Polymerizable compositions comprising a radically polymerizable resin can be polymerized in the absence of a peroxide initiator and other undesirable components. The polymerizable compositions and methods employ a manganese- or iron-containing salt or organic complex and a 1,3-dioxo compound with one or more other components. The polymerizable compositions have better storage stability and reduced gel time-drift.

Polymerizable compositions comprising a radically polymerizable resin can be polymerized in the absence of a peroxide initiator and other undesirable components. The polymerizable compositions and methods employ a manganese- or iron-containing salt or organic complex and a 1,3-dioxo compound with one or more other components. The polymerizable compositions have better storage stability and reduced gel time-drift.

The present invention describes compounds and uses thereof in applications relating to absorption of electromagnetic energy. Preferred compounds are double bond-containing compounds capable of absorbing electromagnetic radiation energy and having improved properties.

The present invention describes compounds and uses thereof in applications relating to absorption of electromagnetic energy. Preferred compounds are double bond-containing compounds capable of absorbing electromagnetic radiation energy and having improved properties.

The present invention provides an acrylic damping adhesive. The acrylic damping adhesive comprises a crosslinked structure of a carboxy-containing acrylic polymer with a glass transition temperature less than or equal to −20° C. and a carboxy-containing acrylic polymer with a glass transition temperature ranging from 20° C. to 50° C. The acrylic damping adhesive according to technical solutions of the present invention exhibits double damping peaks in a rheological curve, and thus has a wider damping temperature range (the damping temperature range is greater than or equal to 50° C., and preferably greater than or equal to 90° C.), a higher frequency response of damping, and higher system stability.

The present invention provides an acrylic damping adhesive. The acrylic damping adhesive comprises a crosslinked structure of a carboxy-containing acrylic polymer with a glass transition temperature less than or equal to −20° C. and a carboxy-containing acrylic polymer with a glass transition temperature ranging from 20° C. to 50° C. The acrylic damping adhesive according to technical solutions of the present invention exhibits double damping peaks in a rheological curve, and thus has a wider damping temperature range (the damping temperature range is greater than or equal to 50° C., and preferably greater than or equal to 90° C.), a higher frequency response of damping, and higher system stability.

The present disclosure provides nanostructure compositions and methods of producing nanostructure compositions. The nanostructure compositions comprise at least one population of nanostructures, at least one reactive diluent, at least one anaerobic stabilizer, and optionally at least one organic resin. The present disclosure also provides nanostructure films comprising a nanostructure layer and methods of making nanostructure films.

The present disclosure provides nanostructure compositions and methods of producing nanostructure compositions. The nanostructure compositions comprise at least one population of nanostructures, at least one reactive diluent, at least one anaerobic stabilizer, and optionally at least one organic resin. The present disclosure also provides nanostructure films comprising a nanostructure layer and methods of making nanostructure films.

A polymer composition includes a conductive polymer and at least one stretchability and electrical conductivity (STEC) enhancer, wherein a content of the STEC enhancer in the composition is at least about 1 wt. % of the composition.