A polyacetal resin composition capable of keeping the generation of formaldehyde from a molded article at a very low level and stably keeping mold deposits at a minimum during molding. The polyacetal resin composition includes at least (A) 100 parts by mass of a polyacetal polymer, (B) 0.01-0.50 parts by mass of an aliphatic carboxylic hydrazide, (C) 0.001-0.50 part by mass of a hydantoin compound having two hydrazinocarbonylalkyl groups, and (D) 0.001-0.30 part by mass of an alkaline earth metal salt of an aliphatic carboxylic acid. The total amount of (B) and (C) is 0.03-0.55 part by mass per 100 parts by mass of the (A) polyacetal polymer.

An object of the present invention is to provide an antistatic agent which imparts excellent antistatic properties to thermoplastic resins. The antistatic agent of the present invention contains a block polymer (A) having a block of a polyamide (a) and a block of a hydrophilic polymer (b) as structure units; and an amide-forming monomer (c), wherein a weight ratio of the amide-forming monomer (c) to the block polymer (A), i.e., amide-forming monomer (c)/block polymer (A), is 2/98 to 12/88.

An object of the present invention is to provide an antistatic agent which imparts excellent antistatic properties to thermoplastic resins. The antistatic agent of the present invention contains a block polymer (A) having a block of a polyamide (a) and a block of a hydrophilic polymer (b) as structure units; and an amide-forming monomer (c), wherein a weight ratio of the amide-forming monomer (c) to the block polymer (A), i.e., amide-forming monomer (c)/block polymer (A), is 2/98 to 12/88.

Provided is an epoxy resin composition containing an epoxy resin (A), a curing agent (B) and an imidazole adduct-type curing accelerator (C), in which the curing agent (B) contains a compound (B-1) represented by formula (B-1) [R.sup.1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms] and a compound (B-2) represented by formula (B-2) [R.sup.2 represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group] and the content of the compound (B-2) is 2 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A).

Provided is an epoxy resin composition containing an epoxy resin (A), a curing agent (B) and an imidazole adduct-type curing accelerator (C), in which the curing agent (B) contains a compound (B-1) represented by formula (B-1) [R.sup.1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms] and a compound (B-2) represented by formula (B-2) [R.sup.2 represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group] and the content of the compound (B-2) is 2 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A).

A rubber modifier for a tire includes rosins and/or terpenes and at least one kind of nitrogen-containing compound selected from the group consisting of a nitrogen-containing heterocyclic compound, a tertiary amine compound, and an amino alcohol.

A rubber modifier for a tire includes rosins and/or terpenes and at least one kind of nitrogen-containing compound selected from the group consisting of a nitrogen-containing heterocyclic compound, a tertiary amine compound, and an amino alcohol.

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

Provided are a lens for spectacles containing a resin and a coloring agent having a maximum absorption wavelength in a methanol solution in a range of 400 nm to 500 nm and a half-width of an absorption peak in a methanol solution of 10 nm or more and less than 40 nm, and spectacles.