A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.

A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.

A porous film includes at least one porous polyimide film that includes a polyimide resin, an organic amine compound and a resin other than a polyimide resin, and that does not include a polar aprotic solvent, wherein a content of the organic amine compound is 0.001% by weight or higher with respect to a total weight of the porous polyimide film.

A porous film includes at least one porous polyimide film that includes a polyimide resin, an organic amine compound and a resin other than a polyimide resin, and that does not include a polar aprotic solvent, wherein a content of the organic amine compound is 0.001% by weight or higher with respect to a total weight of the porous polyimide film.

A benzoxazine resin, including a compound of the following Formula 1-1:

##STR00001##

where R.sup.1, R.sup.2, and R.sup.3 are as defined herein.

A benzoxazine resin, including a compound of the following Formula 1-1:

##STR00001##

where R.sup.1, R.sup.2, and R.sup.3 are as defined herein.

The use of tetrahydrobenzoxazines I ##STR00001##
where R.sup.1 is a hydrocarbyl radical and R.sup.2, R.sup.3, R.sup.4 and R.sup.5 are each independently hydrogen atoms, hydroxyl groups or hydrocarbyl radicals, and where R.sup.2 to R.sup.5 may also form a second and a third tetrahydrooxazine ring, with the proviso that at least one of the substituents has from 4 to 3000 carbon atoms and the remaining substituents, when they are hydrocarbyl radicals, each have from 1 to 20 carbon atoms, as stabilizers for stabilizing inanimate organic material, especially turbine fuels, against the action of light, oxygen and heat.

The use of tetrahydrobenzoxazines I ##STR00001##
where R.sup.1 is a hydrocarbyl radical and R.sup.2, R.sup.3, R.sup.4 and R.sup.5 are each independently hydrogen atoms, hydroxyl groups or hydrocarbyl radicals, and where R.sup.2 to R.sup.5 may also form a second and a third tetrahydrooxazine ring, with the proviso that at least one of the substituents has from 4 to 3000 carbon atoms and the remaining substituents, when they are hydrocarbyl radicals, each have from 1 to 20 carbon atoms, as stabilizers for stabilizing inanimate organic material, especially turbine fuels, against the action of light, oxygen and heat.

The present invention relates to the field oxidative drying inks suitable for offset, letterpress and intaglio printing. In particular, it relates to oxidative drying inks for printing by an offset process, letterpress process or intaglio process on a non-porous substrate selected from the group consisting of polymer materials, composite materials, metals or metalized materials and combinations thereof, said oxidative drying ink comprising at least one oxidative drying varnish and one or more neutral manganese complex compounds.

Provided is a resin composition, comprising epoxy resin, oxydianiline type benzoxazine resin, styrene-maleic anhydride resin and tetra-phenol resin. The resin composition may be baked for producing products such as prepregs, resin films, resin-coated coppers, laminates and printed circuit boards, which satisfy one or more or all of desirable properties such as higher dimensional stability after a reflow process, better thermal resistance after horizontal black oxide process, low dielectric constant, low dissipation factor, high thermal resistance and flame retardancy.