In one aspect, the invention has an object of providing antifouling coating compositions which have high resistance to fouling, in particular, fouling by slime, can form coating films with excellent properties such as strength and rubber properties, exhibit appropriate viscosity (sprayability and coating film surface leveling properties during spray coating) and sagging resistance, and have high storage stability suppressing deteriorations of these properties. To achieve the object, the invention provides an antifouling coating composition including (A) a diorganopolysiloxane having at least two silanol groups in the molecule, (B) an organosilane and/or a partial hydrolyzate condensate thereof having at least two hydrolyzable groups in the molecule, and (C) a pyrithione metal salt. The antifouling coating composition can be prepared from a kit in the form of a multiple-component system including respective packages of a component including the component (A) and the component (C), and a component including the component (B). In the (kit for the preparation of the) antifouling coating composition, the pyrithione metal salt (C) functions as an effective ingredient for achieving excellent antifouling properties, in particular, anti-sliming properties, and also as an effective ingredient for improving storage stability.

Disclosed is an anti-oxidation stabilizer, which has the following structure (A), wherein R1 is a connection chain, and the connection chain is a fatty chain, an aromatic structural chain or a fatty and aromatic structurally combined chain; R2 is (B), and X is O, S, N or NH or —CONR—, Z is O, S, N or NH, and X is different from Z; R is a fatty chain, an aromatic group, a sterically hindered amine or sterically hindered phenol, R3 is a fatty chain, an aromatic group, a sterically hindered amine or sterically hindered phenol, and R is identical to R3, or R is different from R3; n is a positive integer including 1, n1 is a positive integer including 1, and n is identical to n1, or n is different from n1.

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system. ##STR00001##

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system. ##STR00001##

Described are hydrosilylation-curable polyorganosiloxane compositions containing sulfur, including hydrosilylation-curable polyorganosiloxane prepolymers and hydrosilylation-cured polyorganosiloxane polymer products made therefrom, as well as methods of preparing and using the same, devices comprising or prepared from the same, and sulfur-functional organosiloxanes useful therein.

The present invention relates to a process for the preparation of a composition comprising aliphatic polyester by ring-opening polymerization of cyclic ester monomers, said process comprising the steps of: (a) providing cyclic ester monomers and polymerization catalyst to a reactor, (b) melt polymerizing said cyclic ester monomers to form a composition comprising aliphatic polyester, (c) stabilizing the composition against aliphatic polyester depolymerization by incorporating therein or applying thereto at least one stabilizing agent, thereby obtaining a melt-stable composition, and (d) optionally removing at least a portion of the residual cyclic ester monomers; wherein said stabilizing agent is a compound of formula (I)

##STR00001##

wherein R.sup.1, R.sup.2, R.sup.3, m ,R.sup.4 , R.sup.5, and R.sup.6 are as defined in the claims. The present invention also relates to a process for stabilizing an aliphatic polyester against depolymerization comprising the steps of (a) forming an aliphatic polyester, and (b) stabilizing the polyester against depolymerization by incorporating therein or applying thereto at least one stabilizing agent, thereby obtaining a melt-stable polyester, wherein said stabilizing agent is a compound of formula (I). The present invention also relates to the use of a compound of formula (I) as a stabilizing agent against aliphatic polyester depolymerization.

The present invention relates to a process for the preparation of a composition comprising aliphatic polyester by ring-opening polymerization of cyclic ester monomers, said process comprising the steps of: (a) providing cyclic ester monomers and polymerization catalyst to a reactor, (b) melt polymerizing said cyclic ester monomers to form a composition comprising aliphatic polyester, (c) stabilizing the composition against aliphatic polyester depolymerization by incorporating therein or applying thereto at least one stabilizing agent, thereby obtaining a melt-stable composition, and (d) optionally removing at least a portion of the residual cyclic ester monomers; wherein said stabilizing agent is a compound of formula (I)

##STR00001##

wherein R.sup.1, R.sup.2, R.sup.3, m ,R.sup.4 , R.sup.5, and R.sup.6 are as defined in the claims. The present invention also relates to a process for stabilizing an aliphatic polyester against depolymerization comprising the steps of (a) forming an aliphatic polyester, and (b) stabilizing the polyester against depolymerization by incorporating therein or applying thereto at least one stabilizing agent, thereby obtaining a melt-stable polyester, wherein said stabilizing agent is a compound of formula (I). The present invention also relates to the use of a compound of formula (I) as a stabilizing agent against aliphatic polyester depolymerization.

The invention relates to a plastics-covered mercaptosilane-wax mixture, where the plastic of the plastics covering is selected from the group of polypropylene, polyethylene, ethylene-vinyl acetate copolymer and mixtures of the abovementioned plastics with melting point from 70 to 170° C., and the mercaptosilane-wax mixture comprises at least one mercaptosilane of the general formula I

##STR00001##

and at least one wax with congealing point from 30 to 160° C.

The plastics-covered mercaptosilane-wax mixture can be used in rubber mixtures.

A compound having a maximum absorption in a wavelength range of 350 nm to 550 nm that functions as a dichroic dye is provided. In particular, a compound represented by formula (1) is provided. In the compound of formula (1), R.sup.1 represents an alkyl group having 1 to 20 carbon atoms or the like; R.sup.2 represents an acyl group having 1 to 20 carbon atoms or the like; R.sup.3 represents a hydrogen atom or the like; and Y represents a group of formula (Y1). In the formula (Y1), * represents a bonding site with N, or a group of formula (Y2). In the formula (Y2), * represents a bonding site with N; P.sup.1 and P.sup.2 each independently represent —S— or the like; and Q.sup.1 and Q.sup.2 each independently represent ═N— or the like.

##STR00001##

A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150° C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4′-oxydiphthalic acid dianhydride and a structure derived from 4,4′-diaminodiphenyl ether; or (ii) a structure derived from 3,3′4,4′-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4′-diaminodiphenyl ether; or (iii) a structure derived from 4,4′-oxydiphthalic acid dianhydride and a structure derived from 2,2′-dimethyl-4,4′-diaminobiphenyl.