A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150° C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4′-oxydiphthalic acid dianhydride and a structure derived from 4,4′-diaminodiphenyl ether; or (ii) a structure derived from 3,3′4,4′-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4′-diaminodiphenyl ether; or (iii) a structure derived from 4,4′-oxydiphthalic acid dianhydride and a structure derived from 2,2′-dimethyl-4,4′-diaminobiphenyl.

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system.

##STR00001##

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system.

##STR00001##

A desulfurized rubber obtained by mixing a desulfurization agent and a vulcanized rubber, the desulfurization agent containing a compound represented by any one of the following formulae (1) to (4):

##STR00001##

wherein R.sub.1 to R.sub.8 each independently represent a hydrogen atom, an oxygen atom, or an alkyl group. It is preferable that the desulfurization agent contains at least one selected from the group consisting of 2,2′-dithiodianiline and 4,4′-dithiodianiline.

A desulfurized rubber obtained by mixing a desulfurization agent and a vulcanized rubber, the desulfurization agent containing a compound represented by any one of the following formulae (1) to (4):

##STR00001##

wherein R.sub.1 to R.sub.8 each independently represent a hydrogen atom, an oxygen atom, or an alkyl group. It is preferable that the desulfurization agent contains at least one selected from the group consisting of 2,2′-dithiodianiline and 4,4′-dithiodianiline.

A mixture can be used for modifying the rheology of polymeric substrates. The mixture contains a hydroxylamine ester and an isocyanate functionalized with a thio compound.

Embodiments of the present disclosure are directed to polyolefin grafted polydiene polymers, wherein the polyolefin grafted polydiene polymers comprises a polydiene having a polydiene polymer backbone, a polyolefin, and at least one sulfur containing functionalizing agent which grafts the polyolefin onto at least one non-terminal position on the polydiene polymer backbone.

The present invention provides a vulcanized rubber composition which comprises a compound represented by formula (I) and a vulcanized rubber and in which the content of the compound represented by formula (I) is 0.00005 to 5% by weight with respect to the entire vulcanized rubber composition (the groups in formula (I) are as defined in the description).

##STR00001##

The present invention provides a rubber composition for a tire, the rubber composition containing: a diene rubber; silica; and a heterocyclic compound (where, the heterocyclic compound does not have a silicon atom) having a hydrocarbon group having from 3 to 30 carbons and at least one type of heterocycle selected from the group consisting of a piperazine ring, a morpholine ring, and a thiomorpholine ring; an average glass transition temperature of the diene rubber being −50° C. or higher; a content of the silica being from 80 to 200 parts by mass per 100 parts by mass of the diene rubber; and a content of the heterocyclic compound being from 0.5 to 20% by mass with respect to the content of the silica. Such rubber composition has excellent processability, exhibits excellent wet grip performance and has low rolling resistance when the rubber composition is formed into a tire.

A peroxide-curable polyolefin composition comprising a peroxide-curable polyolefin prepolymer, an organic peroxide, and 4-[[4,6-bis(octylthio)-1,3,5-triazin-2-yl]amino]-2,6-bis(1,1-dimethylethyl)-phenol. Also, a peroxide-cured polyolefin product prepared therefrom, methods of making and using same, and articles containing or made from same.