Disclosed is a polyimide film prepared from a liquid composition comprising a liquid composition comprising (a) a polyamic acid having a repeat unit structure of Formula I

##STR00001##

wherein R.sup.a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues and R.sup.b is the same or different at each occurrence and represents one or more diamine component residues, (b) one or more phosphorous-containing additivesm and (c) a high-boiling aprotic solvent. Also disclosed are processes for making the film and uses of the film in electronic devices.

Polycarbonate compositions comprising one or more additives selected from the group consisting of benzofuranone stabilizers of formula I, wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 are each independently hydrogen, halogen, hydroxy, C.sub.1-C.sub.25alkyl, C.sub.2-C.sub.25alkenyl, C.sub.2-C.sub.25alkynyl, C.sub.7-C.sub.9phenylalkyl, phenyl, C.sub.5-C.sub.8cycloalkyl, C.sub.1-C.sub.5galkoxy, C.sub.1-C.sub.8alkylamine, di(C.sub.1-C.sub.8alkyl)amino, C.sub.1-C.sub.25alkanoyloxy, C.sub.1-C.sub.25alkanoylamino, C.sub.3-C.sub.25alkenoyloxy, C.sub.3-C.sub.25alkanoyloxy interrupted by one to three O, S, NH or N(C.sub.1-C.sub.8alkyl)-, wherein C.sub.1-C.sub.25alkyl, C.sub.2-C.sub.25alkenyl, C.sub.2-C.sub.25alkynyl, C.sub.7-C.sub.9phenylalkyl, phenyl, C.sub.5-C.sub.5cycloalkyl, C.sub.1-C.sub.15alkoxy, C.sub.1-C.sub.5alkylamine, di(C.sub.1-C.sub.8alkyl)amino, C.sub.1-C.sub.25alkanoyloxy, C.sub.1-C.sub.25alkanoylamino, C.sub.3-C.sub.25alkenoyloxy and interrupted C.sub.3-C.sub.25alkenoyloxy are unsubstituted or substituted by one to three groups selected from halogen, hydroxy, thiol, amino, C.sub.1-C.sub.4alkylamino, di(C.sub.1-C.sub.4alkyl)amino and C.sub.1-C.sub.4alkyl.

##STR00001##

Polycarbonate compositions comprising one or more additives selected from the group consisting of benzofuranone stabilizers of formula I, wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 are each independently hydrogen, halogen, hydroxy, C.sub.1-C.sub.25alkyl, C.sub.2-C.sub.25alkenyl, C.sub.2-C.sub.25alkynyl, C.sub.7-C.sub.9phenylalkyl, phenyl, C.sub.5-C.sub.8cycloalkyl, C.sub.1-C.sub.5galkoxy, C.sub.1-C.sub.8alkylamine, di(C.sub.1-C.sub.8alkyl)amino, C.sub.1-C.sub.25alkanoyloxy, C.sub.1-C.sub.25alkanoylamino, C.sub.3-C.sub.25alkenoyloxy, C.sub.3-C.sub.25alkanoyloxy interrupted by one to three O, S, NH or N(C.sub.1-C.sub.8alkyl)-, wherein C.sub.1-C.sub.25alkyl, C.sub.2-C.sub.25alkenyl, C.sub.2-C.sub.25alkynyl, C.sub.7-C.sub.9phenylalkyl, phenyl, C.sub.5-C.sub.5cycloalkyl, C.sub.1-C.sub.15alkoxy, C.sub.1-C.sub.5alkylamine, di(C.sub.1-C.sub.8alkyl)amino, C.sub.1-C.sub.25alkanoyloxy, C.sub.1-C.sub.25alkanoylamino, C.sub.3-C.sub.25alkenoyloxy and interrupted C.sub.3-C.sub.25alkenoyloxy are unsubstituted or substituted by one to three groups selected from halogen, hydroxy, thiol, amino, C.sub.1-C.sub.4alkylamino, di(C.sub.1-C.sub.4alkyl)amino and C.sub.1-C.sub.4alkyl.

##STR00001##

The invention relates to a composition comprising an organic material susceptible to oxidative, thermal or light-induced degradation and a compound of formula I-P, I-O or I-M

##STR00001## Further embodiments are a compound of formula I-P, I-O or I-M, a process for protection of the organic material by the compound, the use of the compound for stabilizing the organic material, an additive composition comprising the compound, a process for manufacturing the compound and intermediates involved therein.

The invention relates to a composition comprising an organic material susceptible to oxidative, thermal or light-induced degradation and a compound of formula I-P, I-O or I-M

##STR00001## Further embodiments are a compound of formula I-P, I-O or I-M, a process for protection of the organic material by the compound, the use of the compound for stabilizing the organic material, an additive composition comprising the compound, a process for manufacturing the compound and intermediates involved therein.

The invention relates to a composition comprising an organic material susceptible to oxidative, thermal or light-induced degradation and a compound of formula 1-P, 1-O or I-M. Further embodiments are a compound of formula 1-P, 1-O or 1-M, a process for protection of the organic material by the compound, the use of the compound for stabilizing the organic material, an additive composition comprising the compound, a process for manufacturing the compound and intermediates involved therein. ##STR00001##

The invention relates to a composition comprising an organic material susceptible to oxidative, thermal or light-induced degradation and a compound of formula 1-P, 1-O or I-M. Further embodiments are a compound of formula 1-P, 1-O or 1-M, a process for protection of the organic material by the compound, the use of the compound for stabilizing the organic material, an additive composition comprising the compound, a process for manufacturing the compound and intermediates involved therein. ##STR00001##

A nanoparticle composition includes: out of nanoparticles and ligands, at least the nanoparticles; and a curable monomer. At least the nanoparticles or the ligands contained in the nanoparticle composition contain aromatic rings. The curable monomer contains an aromatic monomer.

A nanoparticle composition includes: out of nanoparticles and ligands, at least the nanoparticles; and a curable monomer. At least the nanoparticles or the ligands contained in the nanoparticle composition contain aromatic rings. The curable monomer contains an aromatic monomer.

A polyimide resin composition containing a polyimide resin (A) and a phosphinic acid metal salt-based flame retardant (B), the polyimide resin (A) containing repeating structural units of formulae (1) and (2): ##STR00001## wherein R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring, and a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) is 20 to 70 mol %.