Provided is a curable silicone rubber mixture providing a cured silicone rubber having a small change in volume resistivity, even when a high voltage is applied for a long period of time. The curable silicone rubber mixture includes: a curable silicone rubber, a cation, an anion and metal oxide particles, the cation including a first cation having one or more carbon-carbon double bonds in a molecular thereof, the metal oxide particles having surfaces whose hydrophilization rate is 0.50 or more.

Provided is a curable silicone rubber mixture providing a cured silicone rubber having a small change in volume resistivity, even when a high voltage is applied for a long period of time. The curable silicone rubber mixture includes: a curable silicone rubber, a cation, an anion and metal oxide particles, the cation including a first cation having one or more carbon-carbon double bonds in a molecular thereof, the metal oxide particles having surfaces whose hydrophilization rate is 0.50 or more.

The invention relates to a plastics-covered mercaptosilane-wax mixture, where the plastic of the plastics covering is selected from the group of polypropylene, polyethylene, ethylene-vinyl acetate copolymer and mixtures of the abovementioned plastics with melting point from 70 to 170 C., and the mercaptosilane-wax mixture comprises at least one mercaptosilane of the general formula I ##STR00001##
and at least one wax with congealing point from 30 to 160 C. The plastics-covered mercaptosilane-wax mixture can be used in rubber mixtures.

The present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent, a coupling agent, a curing accelerator, and an adhesion promotor, the adhesion promotor comprising an imidazole-based compound having an average particle size of 0.1-5 m, and a semiconductor device comprising the same. The epoxy resin composition of the present invention has high adhesion to a different kind of material, such as copper, nickel, or silver, and thus, may satisfy a high level of reliability required for a semiconductor for a car, such as MSL or TCT.

The present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent, a coupling agent, a curing accelerator, and an adhesion promotor, the adhesion promotor comprising an imidazole-based compound having an average particle size of 0.1-5 m, and a semiconductor device comprising the same. The epoxy resin composition of the present invention has high adhesion to a different kind of material, such as copper, nickel, or silver, and thus, may satisfy a high level of reliability required for a semiconductor for a car, such as MSL or TCT.

The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.

The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.

The present invention relates to an adhesive sheet. The adhesive sheet according to the present invention utilizes an acrylic resin composition without using a separate primer layer. As a result, the present invention can provide excellent adhesion, high reliability due to its excellent light resistance under the sunlight exposure, and excellent elastic modulus. Therefore, it can be easily used as an adhesive material in various fields such as building materials and automobiles.

The present invention relates to an adhesive sheet. The adhesive sheet according to the present invention utilizes an acrylic resin composition without using a separate primer layer. As a result, the present invention can provide excellent adhesion, high reliability due to its excellent light resistance under the sunlight exposure, and excellent elastic modulus. Therefore, it can be easily used as an adhesive material in various fields such as building materials and automobiles.

Methods, systems, and devices are disclosed for fabricating 3D piezoelectric materials. In one aspect, a method includes photopolymerizing a selected portion of a two dimensional plane in a sample of a photolabile polymer solution containing piezoelectric nanoparticles to form a layer of a piezoelectric material, the photopolymerizing including directing light from a light source based on a pattern design in the selected portion of the photolabile polymer solution; and moving one or both of the sample and the directed light to photopolymerize another selected portion of another two dimensional plane in the sample to form another layer of the piezoelectric material.