A moisture curable polyorganosiloxane composition is disclosed. The composition comprises: (A) a polyorganosiloxane endblocked with alkoxysilyl-containing groups at both molecular terminals; (B) a polyorganosiloxane resin having a content of OZ in a range of from about 50 mol % to about 150 mol %, wherein each Z is H or an alkyl group such that OZ represents a silanol group and/or a silicon atom-bonded alkoxy group; and (C) a polyorganosiloxane resin having an alkoxysilyl-containing group. The composition exhibits good to excellent coating performance without using a solvent. In addition, the composition can cure by contacting moisture in air to form a cured product exhibiting good to excellent mechanical properties.

A moisture curable polyorganosiloxane composition is disclosed. The composition comprises: (A) a polyorganosiloxane endblocked with alkoxysilyl-containing groups at both molecular terminals; (B) a polyorganosiloxane resin having a content of OZ in a range of from about 50 mol % to about 150 mol %, wherein each Z is H or an alkyl group such that OZ represents a silanol group and/or a silicon atom-bonded alkoxy group; and (C) a polyorganosiloxane resin having an alkoxysilyl-containing group. The composition exhibits good to excellent coating performance without using a solvent. In addition, the composition can cure by contacting moisture in air to form a cured product exhibiting good to excellent mechanical properties.

A process for end capping and chain extending silanol terminated polydiorganosiloxanes with a mixture of one or more alkylacetoxydialkoxysilanes and one or more alkyldiacetoxyalkoxysilanes. The resulting capped polymeric material may be utilised as a polymer in e.g. a one-part alkoxy sealant composition such as, for example, an alkoxy low modulus clean (non-staining) or clear sealant composition.

A process for end capping and chain extending silanol terminated polydiorganosiloxanes with a mixture of one or more alkylacetoxydialkoxysilanes and one or more alkyldiacetoxyalkoxysilanes. The resulting capped polymeric material may be utilised as a polymer in e.g. a one-part alkoxy sealant composition such as, for example, an alkoxy low modulus clean (non-staining) or clear sealant composition.

Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.

Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.

Included is a homogeneous sheet, which excludes polyvinylchloride. The sheet includes a polyurethane, a synthetic rubber blend, and a filler. The synthetic rubber blend may include a pre-mix of a synthetic rubber and white oil.

Included is a homogeneous sheet, which excludes polyvinylchloride. The sheet includes a polyurethane, a synthetic rubber blend, and a filler. The synthetic rubber blend may include a pre-mix of a synthetic rubber and white oil.

A thermally conductive addition-curable silicone composition includes: a heat-treated mixture including (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a silicon atom in one molecule, and (C) aluminum oxide; (D) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (E) a platinum-based metal catalyst; and (F) a cation-exchange type and/or both-ions-exchange type ion trap agent. A thermally conductive addition-curable silicone composition can be applied on electric and electronic components and in a module including a circuit substrate mounting these components thereon and can exhibit excellent stress relaxation property and thermal conductivity after cured. In addition, a method for producing the same.

Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.